JPS49107480A - - Google Patents
Info
- Publication number
- JPS49107480A JPS49107480A JP1866773A JP1866773A JPS49107480A JP S49107480 A JPS49107480 A JP S49107480A JP 1866773 A JP1866773 A JP 1866773A JP 1866773 A JP1866773 A JP 1866773A JP S49107480 A JPS49107480 A JP S49107480A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1866773A JPS49107480A (ja) | 1973-02-15 | 1973-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1866773A JPS49107480A (ja) | 1973-02-15 | 1973-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49107480A true JPS49107480A (ja) | 1974-10-12 |
Family
ID=11977948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1866773A Pending JPS49107480A (ja) | 1973-02-15 | 1973-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49107480A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6084823A (ja) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | 半導体ウエハのエツチング装置 |
| WO2010140224A1 (ja) * | 2009-06-02 | 2010-12-09 | 三菱電機株式会社 | 半導体装置の製造方法、並びにプリント回路板およびその製造方法 |
| US7943526B2 (en) | 2004-03-22 | 2011-05-17 | Rena Sondermaschinen Gmbh | Process for the wet-chemical treatment of one side of silicon wafers |
| JP2012504351A (ja) * | 2008-09-30 | 2012-02-16 | ショット・ゾラール・アーゲー | 基板を化学的に処理するための方法 |
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1973
- 1973-02-15 JP JP1866773A patent/JPS49107480A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6084823A (ja) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | 半導体ウエハのエツチング装置 |
| JPH0155573B2 (ja) * | 1983-10-15 | 1989-11-27 | Mitsubishi Electric Corp | |
| US7943526B2 (en) | 2004-03-22 | 2011-05-17 | Rena Sondermaschinen Gmbh | Process for the wet-chemical treatment of one side of silicon wafers |
| JP2012504351A (ja) * | 2008-09-30 | 2012-02-16 | ショット・ゾラール・アーゲー | 基板を化学的に処理するための方法 |
| WO2010140224A1 (ja) * | 2009-06-02 | 2010-12-09 | 三菱電機株式会社 | 半導体装置の製造方法、並びにプリント回路板およびその製造方法 |