JPS49107266U - - Google Patents

Info

Publication number
JPS49107266U
JPS49107266U JP1973003031U JP303173U JPS49107266U JP S49107266 U JPS49107266 U JP S49107266U JP 1973003031 U JP1973003031 U JP 1973003031U JP 303173 U JP303173 U JP 303173U JP S49107266 U JPS49107266 U JP S49107266U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1973003031U
Other versions
JPS5313343Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973003031U priority Critical patent/JPS5313343Y2/ja
Publication of JPS49107266U publication Critical patent/JPS49107266U/ja
Application granted granted Critical
Publication of JPS5313343Y2 publication Critical patent/JPS5313343Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1973003031U 1972-12-28 1972-12-28 Expired JPS5313343Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973003031U JPS5313343Y2 (ja) 1972-12-28 1972-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973003031U JPS5313343Y2 (ja) 1972-12-28 1972-12-28

Publications (2)

Publication Number Publication Date
JPS49107266U true JPS49107266U (ja) 1974-09-13
JPS5313343Y2 JPS5313343Y2 (ja) 1978-04-11

Family

ID=28062035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973003031U Expired JPS5313343Y2 (ja) 1972-12-28 1972-12-28

Country Status (1)

Country Link
JP (1) JPS5313343Y2 (ja)

Also Published As

Publication number Publication date
JPS5313343Y2 (ja) 1978-04-11

Similar Documents

Publication Publication Date Title
FR2204004B3 (ja)
JPS5310662B2 (ja)
JPS5228827Y2 (ja)
JPS5133600Y1 (ja)
CS165917B1 (ja)
CS157933B1 (ja)
CS161385B1 (ja)
CS157994B1 (ja)
CS156329B1 (ja)
CS156687B1 (ja)
CS159442B1 (ja)
CH578503A5 (ja)
BG18386A1 (ja)
CH578838A5 (ja)
CH579020A5 (ja)
CH575470A5 (ja)
DD103206A2 (ja)
CH585157A5 (ja)
BG19428A1 (ja)
BG22072A3 (ja)
CH578037A5 (ja)
CH575498B5 (ja)
CH579074A5 (ja)
CH579538A5 (ja)
CH572363A5 (ja)