JPS4910465U - - Google Patents
Info
- Publication number
- JPS4910465U JPS4910465U JP1972050532U JP5053272U JPS4910465U JP S4910465 U JPS4910465 U JP S4910465U JP 1972050532 U JP1972050532 U JP 1972050532U JP 5053272 U JP5053272 U JP 5053272U JP S4910465 U JPS4910465 U JP S4910465U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972050532U JPS4910465U (oth) | 1972-04-29 | 1972-04-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972050532U JPS4910465U (oth) | 1972-04-29 | 1972-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4910465U true JPS4910465U (oth) | 1974-01-29 |
Family
ID=27930529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972050532U Pending JPS4910465U (oth) | 1972-04-29 | 1972-04-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4910465U (oth) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001148515A (ja) * | 1999-11-22 | 2001-05-29 | Sharp Corp | 発光装置、その製造方法、及び発光装置を搭載した電子機器 |
-
1972
- 1972-04-29 JP JP1972050532U patent/JPS4910465U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001148515A (ja) * | 1999-11-22 | 2001-05-29 | Sharp Corp | 発光装置、その製造方法、及び発光装置を搭載した電子機器 |