JPS4897484A - - Google Patents
Info
- Publication number
- JPS4897484A JPS4897484A JP2174072A JP2174072A JPS4897484A JP S4897484 A JPS4897484 A JP S4897484A JP 2174072 A JP2174072 A JP 2174072A JP 2174072 A JP2174072 A JP 2174072A JP S4897484 A JPS4897484 A JP S4897484A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Weting (AREA)
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2174072A JPS5226674B2 (fr) | 1972-03-02 | 1972-03-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2174072A JPS5226674B2 (fr) | 1972-03-02 | 1972-03-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4897484A true JPS4897484A (fr) | 1973-12-12 |
JPS5226674B2 JPS5226674B2 (fr) | 1977-07-15 |
Family
ID=12063458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2174072A Expired JPS5226674B2 (fr) | 1972-03-02 | 1972-03-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5226674B2 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5817636A (ja) * | 1981-07-23 | 1983-02-01 | Nec Home Electronics Ltd | 半導体装置の製造方法 |
WO2019082724A1 (fr) * | 2017-10-27 | 2019-05-02 | 三星ダイヤモンド工業株式会社 | Procédé de segmentation de substrat comportant un film métallique |
-
1972
- 1972-03-02 JP JP2174072A patent/JPS5226674B2/ja not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5817636A (ja) * | 1981-07-23 | 1983-02-01 | Nec Home Electronics Ltd | 半導体装置の製造方法 |
WO2019082724A1 (fr) * | 2017-10-27 | 2019-05-02 | 三星ダイヤモンド工業株式会社 | Procédé de segmentation de substrat comportant un film métallique |
JPWO2019082724A1 (ja) * | 2017-10-27 | 2020-11-12 | 三星ダイヤモンド工業株式会社 | メタル膜付き基板の分断方法 |
JP2021193746A (ja) * | 2017-10-27 | 2021-12-23 | 三星ダイヤモンド工業株式会社 | メタル膜付き基板の分断方法 |
KR20220035995A (ko) * | 2017-10-27 | 2022-03-22 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 메탈막 부착 기판의 분단 방법 |
KR20230022274A (ko) * | 2017-10-27 | 2023-02-14 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 메탈막 부착 기판의 분단 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPS5226674B2 (fr) | 1977-07-15 |