JPS4891869U - - Google Patents
Info
- Publication number
- JPS4891869U JPS4891869U JP1489272U JP1489272U JPS4891869U JP S4891869 U JPS4891869 U JP S4891869U JP 1489272 U JP1489272 U JP 1489272U JP 1489272 U JP1489272 U JP 1489272U JP S4891869 U JPS4891869 U JP S4891869U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Punching Or Piercing (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1489272U JPS4891869U (ja) | 1972-02-07 | 1972-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1489272U JPS4891869U (ja) | 1972-02-07 | 1972-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4891869U true JPS4891869U (ja) | 1973-11-05 |
Family
ID=27863721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1489272U Pending JPS4891869U (ja) | 1972-02-07 | 1972-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4891869U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03181160A (ja) * | 1989-12-11 | 1991-08-07 | Mitsui High Tec Inc | 半導体装置用リードフレーム |
-
1972
- 1972-02-07 JP JP1489272U patent/JPS4891869U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03181160A (ja) * | 1989-12-11 | 1991-08-07 | Mitsui High Tec Inc | 半導体装置用リードフレーム |