JPS4890478A - - Google Patents

Info

Publication number
JPS4890478A
JPS4890478A JP2187772A JP2187772A JPS4890478A JP S4890478 A JPS4890478 A JP S4890478A JP 2187772 A JP2187772 A JP 2187772A JP 2187772 A JP2187772 A JP 2187772A JP S4890478 A JPS4890478 A JP S4890478A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2187772A
Other languages
Japanese (ja)
Other versions
JPS5313950B2 (is
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2187772A priority Critical patent/JPS5313950B2/ja
Publication of JPS4890478A publication Critical patent/JPS4890478A/ja
Publication of JPS5313950B2 publication Critical patent/JPS5313950B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
JP2187772A 1972-03-02 1972-03-02 Expired JPS5313950B2 (is)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2187772A JPS5313950B2 (is) 1972-03-02 1972-03-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2187772A JPS5313950B2 (is) 1972-03-02 1972-03-02

Publications (2)

Publication Number Publication Date
JPS4890478A true JPS4890478A (is) 1973-11-26
JPS5313950B2 JPS5313950B2 (is) 1978-05-13

Family

ID=12067341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2187772A Expired JPS5313950B2 (is) 1972-03-02 1972-03-02

Country Status (1)

Country Link
JP (1) JPS5313950B2 (is)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173848A (ja) * 1984-02-20 1985-09-07 Toshiba Seiki Kk ダイボンデイング装置
US4775085A (en) * 1985-10-04 1988-10-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor wafer breaking apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173848A (ja) * 1984-02-20 1985-09-07 Toshiba Seiki Kk ダイボンデイング装置
US4775085A (en) * 1985-10-04 1988-10-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor wafer breaking apparatus

Also Published As

Publication number Publication date
JPS5313950B2 (is) 1978-05-13

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