JPS4889353A - - Google Patents

Info

Publication number
JPS4889353A
JPS4889353A JP47021331A JP2133172A JPS4889353A JP S4889353 A JPS4889353 A JP S4889353A JP 47021331 A JP47021331 A JP 47021331A JP 2133172 A JP2133172 A JP 2133172A JP S4889353 A JPS4889353 A JP S4889353A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47021331A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47021331A priority Critical patent/JPS4889353A/ja
Publication of JPS4889353A publication Critical patent/JPS4889353A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP47021331A 1972-02-29 1972-02-29 Pending JPS4889353A (hu)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47021331A JPS4889353A (hu) 1972-02-29 1972-02-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47021331A JPS4889353A (hu) 1972-02-29 1972-02-29

Publications (1)

Publication Number Publication Date
JPS4889353A true JPS4889353A (hu) 1973-11-22

Family

ID=12052141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47021331A Pending JPS4889353A (hu) 1972-02-29 1972-02-29

Country Status (1)

Country Link
JP (1) JPS4889353A (hu)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180186A (ja) * 1984-02-22 1985-09-13 松下電器産業株式会社 プリント基板
JPS60194379U (ja) * 1984-06-01 1985-12-24 日立電子株式会社 2層高密度プリント基板
JPS61160996A (ja) * 1985-01-09 1986-07-21 松下電器産業株式会社 印刷配線基板
JP2011003888A (ja) * 2009-06-17 2011-01-06 Hon Hai Precision Industry Co Ltd 多層プリント回路基板及びその孔あけ加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4518621Y1 (hu) * 1969-06-18 1970-07-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4518621Y1 (hu) * 1969-06-18 1970-07-29

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180186A (ja) * 1984-02-22 1985-09-13 松下電器産業株式会社 プリント基板
JPH045280B2 (hu) * 1984-02-22 1992-01-30
JPS60194379U (ja) * 1984-06-01 1985-12-24 日立電子株式会社 2層高密度プリント基板
JPH027484Y2 (hu) * 1984-06-01 1990-02-22
JPS61160996A (ja) * 1985-01-09 1986-07-21 松下電器産業株式会社 印刷配線基板
JP2011003888A (ja) * 2009-06-17 2011-01-06 Hon Hai Precision Industry Co Ltd 多層プリント回路基板及びその孔あけ加工方法

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