JPS4888884A - - Google Patents

Info

Publication number
JPS4888884A
JPS4888884A JP47018038A JP1803872A JPS4888884A JP S4888884 A JPS4888884 A JP S4888884A JP 47018038 A JP47018038 A JP 47018038A JP 1803872 A JP1803872 A JP 1803872A JP S4888884 A JPS4888884 A JP S4888884A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47018038A
Other languages
Japanese (ja)
Other versions
JPS5748869B2 (no
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47018038A priority Critical patent/JPS5748869B2/ja
Priority to US410524A priority patent/US3909620A/en
Publication of JPS4888884A publication Critical patent/JPS4888884A/ja
Publication of JPS5748869B2 publication Critical patent/JPS5748869B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP47018038A 1972-02-23 1972-02-23 Expired JPS5748869B2 (no)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (no) 1972-02-23 1972-02-23
US410524A US3909620A (en) 1972-02-23 1973-10-29 Time controlled switching system with override control of manual operation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (no) 1972-02-23 1972-02-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58120362A Division JPS5936980A (ja) 1983-07-04 1983-07-04 セラミック配線基板とその製造方法

Publications (2)

Publication Number Publication Date
JPS4888884A true JPS4888884A (no) 1973-11-21
JPS5748869B2 JPS5748869B2 (no) 1982-10-19

Family

ID=11960493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47018038A Expired JPS5748869B2 (no) 1972-02-23 1972-02-23

Country Status (1)

Country Link
JP (1) JPS5748869B2 (no)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148859A (no) * 1974-05-20 1975-11-28
JPS5175178U (no) * 1974-12-10 1976-06-12
JPS51107281U (no) * 1975-02-25 1976-08-27
JPS55146995A (en) * 1980-04-07 1980-11-15 Nippon Electric Co Semiconductor device
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPS60263483A (ja) * 1984-06-12 1985-12-26 Sanyo Electric Co Ltd 発光ダイオ−ド配列体
JPH0313742U (no) * 1989-06-26 1991-02-12

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148859A (no) * 1974-05-20 1975-11-28
JPS5516473B2 (no) * 1974-05-20 1980-05-02
JPS5175178U (no) * 1974-12-10 1976-06-12
JPS51107281U (no) * 1975-02-25 1976-08-27
JPS55146995A (en) * 1980-04-07 1980-11-15 Nippon Electric Co Semiconductor device
JPS5937598B2 (ja) * 1980-04-07 1984-09-11 日本電気株式会社 半導体装置
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6351386B2 (no) * 1981-02-23 1988-10-13 Nippon Electric Co
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPS60263483A (ja) * 1984-06-12 1985-12-26 Sanyo Electric Co Ltd 発光ダイオ−ド配列体
JPH0313742U (no) * 1989-06-26 1991-02-12

Also Published As

Publication number Publication date
JPS5748869B2 (no) 1982-10-19

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