JPS4888884A - - Google Patents

Info

Publication number
JPS4888884A
JPS4888884A JP47018038A JP1803872A JPS4888884A JP S4888884 A JPS4888884 A JP S4888884A JP 47018038 A JP47018038 A JP 47018038A JP 1803872 A JP1803872 A JP 1803872A JP S4888884 A JPS4888884 A JP S4888884A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47018038A
Other languages
Japanese (ja)
Other versions
JPS5748869B2 (Direct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47018038A priority Critical patent/JPS5748869B2/ja
Priority to US410524A priority patent/US3909620A/en
Publication of JPS4888884A publication Critical patent/JPS4888884A/ja
Publication of JPS5748869B2 publication Critical patent/JPS5748869B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP47018038A 1972-02-23 1972-02-23 Expired JPS5748869B2 (Direct)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (Direct) 1972-02-23 1972-02-23
US410524A US3909620A (en) 1972-02-23 1973-10-29 Time controlled switching system with override control of manual operation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (Direct) 1972-02-23 1972-02-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58120362A Division JPS5936980A (ja) 1983-07-04 1983-07-04 セラミック配線基板とその製造方法

Publications (2)

Publication Number Publication Date
JPS4888884A true JPS4888884A (Direct) 1973-11-21
JPS5748869B2 JPS5748869B2 (Direct) 1982-10-19

Family

ID=11960493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47018038A Expired JPS5748869B2 (Direct) 1972-02-23 1972-02-23

Country Status (1)

Country Link
JP (1) JPS5748869B2 (Direct)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148859A (Direct) * 1974-05-20 1975-11-28
JPS5175178U (Direct) * 1974-12-10 1976-06-12
JPS51107281U (Direct) * 1975-02-25 1976-08-27
JPS55146995A (en) * 1980-04-07 1980-11-15 Nippon Electric Co Semiconductor device
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPS60263483A (ja) * 1984-06-12 1985-12-26 Sanyo Electric Co Ltd 発光ダイオ−ド配列体
JPH0313742U (Direct) * 1989-06-26 1991-02-12

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148859A (Direct) * 1974-05-20 1975-11-28
JPS5175178U (Direct) * 1974-12-10 1976-06-12
JPS51107281U (Direct) * 1975-02-25 1976-08-27
JPS55146995A (en) * 1980-04-07 1980-11-15 Nippon Electric Co Semiconductor device
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPS60263483A (ja) * 1984-06-12 1985-12-26 Sanyo Electric Co Ltd 発光ダイオ−ド配列体
JPH0313742U (Direct) * 1989-06-26 1991-02-12

Also Published As

Publication number Publication date
JPS5748869B2 (Direct) 1982-10-19

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