JPS4885151U - - Google Patents
Info
- Publication number
- JPS4885151U JPS4885151U JP1971114245U JP11424571U JPS4885151U JP S4885151 U JPS4885151 U JP S4885151U JP 1971114245 U JP1971114245 U JP 1971114245U JP 11424571 U JP11424571 U JP 11424571U JP S4885151 U JPS4885151 U JP S4885151U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971114245U JPS4885151U (de) | 1971-12-04 | 1971-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971114245U JPS4885151U (de) | 1971-12-04 | 1971-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4885151U true JPS4885151U (de) | 1973-10-16 |
Family
ID=28026470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971114245U Pending JPS4885151U (de) | 1971-12-04 | 1971-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4885151U (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335677U (de) * | 1989-08-18 | 1991-04-08 | ||
| JPH0350781U (de) * | 1989-09-25 | 1991-05-17 | ||
| JP2021173998A (ja) * | 2020-04-29 | 2021-11-01 | 業成科技(成都)有限公司 | インモールドエレクトロニクスアセンブリ及びその製造方法 |
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1971
- 1971-12-04 JP JP1971114245U patent/JPS4885151U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0335677U (de) * | 1989-08-18 | 1991-04-08 | ||
| JPH0350781U (de) * | 1989-09-25 | 1991-05-17 | ||
| JP2021173998A (ja) * | 2020-04-29 | 2021-11-01 | 業成科技(成都)有限公司 | インモールドエレクトロニクスアセンブリ及びその製造方法 |