JPS4881778U - - Google Patents

Info

Publication number
JPS4881778U
JPS4881778U JP536572U JP536572U JPS4881778U JP S4881778 U JPS4881778 U JP S4881778U JP 536572 U JP536572 U JP 536572U JP 536572 U JP536572 U JP 536572U JP S4881778 U JPS4881778 U JP S4881778U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP536572U
Other languages
Japanese (ja)
Other versions
JPS5111342Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP536572U priority Critical patent/JPS5111342Y2/ja
Publication of JPS4881778U publication Critical patent/JPS4881778U/ja
Application granted granted Critical
Publication of JPS5111342Y2 publication Critical patent/JPS5111342Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
JP536572U 1971-12-29 1971-12-29 Expired JPS5111342Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP536572U JPS5111342Y2 (https=) 1971-12-29 1971-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP536572U JPS5111342Y2 (https=) 1971-12-29 1971-12-29

Publications (2)

Publication Number Publication Date
JPS4881778U true JPS4881778U (https=) 1973-10-05
JPS5111342Y2 JPS5111342Y2 (https=) 1976-03-26

Family

ID=33094665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP536572U Expired JPS5111342Y2 (https=) 1971-12-29 1971-12-29

Country Status (1)

Country Link
JP (1) JPS5111342Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143639A (ja) * 1983-12-29 1985-07-29 Konishiroku Photo Ind Co Ltd 集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143639A (ja) * 1983-12-29 1985-07-29 Konishiroku Photo Ind Co Ltd 集積回路装置

Also Published As

Publication number Publication date
JPS5111342Y2 (https=) 1976-03-26

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