JPS4870479A - - Google Patents
Info
- Publication number
- JPS4870479A JPS4870479A JP46105084A JP10508471A JPS4870479A JP S4870479 A JPS4870479 A JP S4870479A JP 46105084 A JP46105084 A JP 46105084A JP 10508471 A JP10508471 A JP 10508471A JP S4870479 A JPS4870479 A JP S4870479A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46105084A JPS4870479A (ja) | 1971-12-23 | 1971-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46105084A JPS4870479A (ja) | 1971-12-23 | 1971-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4870479A true JPS4870479A (ja) | 1973-09-25 |
Family
ID=14398043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46105084A Pending JPS4870479A (ja) | 1971-12-23 | 1971-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4870479A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175443U (ja) * | 1981-04-30 | 1982-11-05 | ||
| JPS60147140A (ja) * | 1984-01-11 | 1985-08-03 | Hitachi Ltd | 半導体素子チツプの実装方法 |
-
1971
- 1971-12-23 JP JP46105084A patent/JPS4870479A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175443U (ja) * | 1981-04-30 | 1982-11-05 | ||
| JPS60147140A (ja) * | 1984-01-11 | 1985-08-03 | Hitachi Ltd | 半導体素子チツプの実装方法 |
| JPH0315337B2 (ja) * | 1984-01-11 | 1991-02-28 | Hitachi Ltd |