JPS4866537A - - Google Patents

Info

Publication number
JPS4866537A
JPS4866537A JP47126675A JP12667572A JPS4866537A JP S4866537 A JPS4866537 A JP S4866537A JP 47126675 A JP47126675 A JP 47126675A JP 12667572 A JP12667572 A JP 12667572A JP S4866537 A JPS4866537 A JP S4866537A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47126675A
Other languages
Japanese (ja)
Other versions
JPS5629758B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4866537A publication Critical patent/JPS4866537A/ja
Publication of JPS5629758B2 publication Critical patent/JPS5629758B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP12667572A 1971-12-16 1972-12-16 Expired JPS5629758B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20888571A 1971-12-16 1971-12-16

Publications (2)

Publication Number Publication Date
JPS4866537A true JPS4866537A (en) 1973-09-12
JPS5629758B2 JPS5629758B2 (en) 1981-07-10

Family

ID=22776434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12667572A Expired JPS5629758B2 (en) 1971-12-16 1972-12-16

Country Status (8)

Country Link
US (1) US3749649A (en)
JP (1) JPS5629758B2 (en)
CA (1) CA1115654A (en)
DE (1) DE2256845A1 (en)
FR (1) FR2163453B1 (en)
GB (1) GB1408148A (en)
IT (1) IT970627B (en)
NL (1) NL7217115A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117297A (en) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk Tin metal plating liquid

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
SE390986B (en) * 1973-10-18 1977-01-31 Modo Kemi Ab PROCEDURE FOR ELECTROPLETING AW COATINGS OF IGNITION OR IGNITION ALLOY UNIT OF AN ACID ELECTROLYTE BATH
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
NZ190645A (en) * 1978-06-16 1980-11-14 M & T Chemicals Inc Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (en) * 1981-09-08 1983-03-09 Occidental Chem Co ELECTROPLETING FOR PROVISION OF TIN LEAD ALLOYS ON DIFFERENT SUBSTRACTS
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4688899A (en) * 1984-07-27 1987-08-25 Casio Computer Co., Ltd. Dual-frequency, dielectric anisotropy liquid crystal display
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
DE3856429T2 (en) * 1987-12-10 2001-03-08 Learonal Inc Tin, lead or tin-lead alloy electrolytes for high speed electroplating
JP2752046B2 (en) * 1989-12-05 1998-05-18 株式会社村田製作所 Citrate tin or tin alloy plating bath
CA2047502C (en) * 1991-07-22 1995-05-09 Peter Tsuk Selectively plating electrically conductive pin
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
EP1342817A3 (en) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
WO2004063414A2 (en) * 2003-01-10 2004-07-29 Henkel Kommanditgesellschaft Auf Aktien A coating composition
US7063735B2 (en) * 2003-01-10 2006-06-20 Henkel Kommanditgesellschaft Auf Aktien Coating composition
US20060172064A1 (en) * 2003-01-10 2006-08-03 Henkel Kommanditgesellschaft Auf Aktien Process of coating metals prior to cold forming
EP1696052B1 (en) 2005-02-28 2010-10-06 Rohm and Haas Electronic Materials, L.L.C. Improved fluxing methods
JP6099256B2 (en) 2012-01-20 2017-03-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ Improved flux method for tin and tin alloys

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1141284A (en) * 1965-02-13 1969-01-29 Philips Electronic Associated Improvements in acid tin electroplating solutions
FR1539596A (en) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Electrolytic coating process with a shiny tin-lead alloy and new products thus obtained
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61117297A (en) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk Tin metal plating liquid
JPH0148352B2 (en) * 1984-11-13 1989-10-18 Ebara Udylite Kk

Also Published As

Publication number Publication date
FR2163453A1 (en) 1973-07-27
DE2256845A1 (en) 1973-06-20
JPS5629758B2 (en) 1981-07-10
US3749649A (en) 1973-07-31
FR2163453B1 (en) 1977-01-14
GB1408148A (en) 1975-10-01
NL7217115A (en) 1973-06-19
AU4828472A (en) 1974-05-02
CA1115654A (en) 1982-01-05
IT970627B (en) 1974-04-20

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