JPS4856065A - - Google Patents
Info
- Publication number
- JPS4856065A JPS4856065A JP46091304A JP9130471A JPS4856065A JP S4856065 A JPS4856065 A JP S4856065A JP 46091304 A JP46091304 A JP 46091304A JP 9130471 A JP9130471 A JP 9130471A JP S4856065 A JPS4856065 A JP S4856065A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46091304A JPS4942827B2 (cg-RX-API-DMAC10.html) | 1971-11-15 | 1971-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46091304A JPS4942827B2 (cg-RX-API-DMAC10.html) | 1971-11-15 | 1971-11-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4856065A true JPS4856065A (cg-RX-API-DMAC10.html) | 1973-08-07 |
| JPS4942827B2 JPS4942827B2 (cg-RX-API-DMAC10.html) | 1974-11-16 |
Family
ID=14022711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46091304A Expired JPS4942827B2 (cg-RX-API-DMAC10.html) | 1971-11-15 | 1971-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4942827B2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0283962A (ja) * | 1988-09-20 | 1990-03-26 | Hitachi Ltd | 半導体装置 |
| JP2017098315A (ja) * | 2015-11-19 | 2017-06-01 | 日立マクセル株式会社 | 半導体装置用基板とその製造方法、および半導体装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51137219U (cg-RX-API-DMAC10.html) * | 1975-04-28 | 1976-11-05 | ||
| JPS62180990U (cg-RX-API-DMAC10.html) * | 1986-05-07 | 1987-11-17 |
-
1971
- 1971-11-15 JP JP46091304A patent/JPS4942827B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0283962A (ja) * | 1988-09-20 | 1990-03-26 | Hitachi Ltd | 半導体装置 |
| JP2017098315A (ja) * | 2015-11-19 | 2017-06-01 | 日立マクセル株式会社 | 半導体装置用基板とその製造方法、および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4942827B2 (cg-RX-API-DMAC10.html) | 1974-11-16 |