JPS4853676A - - Google Patents
Info
- Publication number
- JPS4853676A JPS4853676A JP46088855A JP8885571A JPS4853676A JP S4853676 A JPS4853676 A JP S4853676A JP 46088855 A JP46088855 A JP 46088855A JP 8885571 A JP8885571 A JP 8885571A JP S4853676 A JPS4853676 A JP S4853676A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8885571A JPS5339742B2 (https=) | 1971-11-08 | 1971-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8885571A JPS5339742B2 (https=) | 1971-11-08 | 1971-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4853676A true JPS4853676A (https=) | 1973-07-27 |
| JPS5339742B2 JPS5339742B2 (https=) | 1978-10-23 |
Family
ID=13954585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8885571A Expired JPS5339742B2 (https=) | 1971-11-08 | 1971-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5339742B2 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919769A (https=) * | 1972-02-26 | 1974-02-21 | ||
| JPS5143566U (https=) * | 1974-09-27 | 1976-03-31 | ||
| JPS55176557U (https=) * | 1979-06-06 | 1980-12-18 | ||
| CN108701666A (zh) * | 2016-02-19 | 2018-10-23 | 贺利氏德国有限两合公司 | 用于制造衬底板的方法、衬底板、用于制造半导体模块的方法和半导体模块 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7408246B2 (en) | 2005-03-31 | 2008-08-05 | Agere Systems, Inc. | Controlling warping in integrated circuit devices |
-
1971
- 1971-11-08 JP JP8885571A patent/JPS5339742B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919769A (https=) * | 1972-02-26 | 1974-02-21 | ||
| JPS5143566U (https=) * | 1974-09-27 | 1976-03-31 | ||
| JPS55176557U (https=) * | 1979-06-06 | 1980-12-18 | ||
| CN108701666A (zh) * | 2016-02-19 | 2018-10-23 | 贺利氏德国有限两合公司 | 用于制造衬底板的方法、衬底板、用于制造半导体模块的方法和半导体模块 |
| JP2019512867A (ja) * | 2016-02-19 | 2019-05-16 | ヘラエウス ドイチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | 回路基板プレートを製造するための方法、回路基板プレート、半導体モジュールを製造するための方法、及び、半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5339742B2 (https=) | 1978-10-23 |