JPS4853255U - - Google Patents
Info
- Publication number
- JPS4853255U JPS4853255U JP1971098886U JP9888671U JPS4853255U JP S4853255 U JPS4853255 U JP S4853255U JP 1971098886 U JP1971098886 U JP 1971098886U JP 9888671 U JP9888671 U JP 9888671U JP S4853255 U JPS4853255 U JP S4853255U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1971098886U JPS4853255U (ja) | 1971-10-25 | 1971-10-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1971098886U JPS4853255U (ja) | 1971-10-25 | 1971-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4853255U true JPS4853255U (ja) | 1973-07-10 |
Family
ID=28012079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1971098886U Pending JPS4853255U (ja) | 1971-10-25 | 1971-10-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4853255U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0258247A (ja) * | 1988-08-23 | 1990-02-27 | Nec Corp | 半導体装置 |
-
1971
- 1971-10-25 JP JP1971098886U patent/JPS4853255U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0258247A (ja) * | 1988-08-23 | 1990-02-27 | Nec Corp | 半導体装置 |