JPS4852178A - - Google Patents

Info

Publication number
JPS4852178A
JPS4852178A JP8596671A JP8596671A JPS4852178A JP S4852178 A JPS4852178 A JP S4852178A JP 8596671 A JP8596671 A JP 8596671A JP 8596671 A JP8596671 A JP 8596671A JP S4852178 A JPS4852178 A JP S4852178A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8596671A
Other languages
Japanese (ja)
Other versions
JPS5116258B2 (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46085966A priority Critical patent/JPS5116258B2/ja
Priority to DE2252830A priority patent/DE2252830C2/de
Priority to FR7238316A priority patent/FR2158043B1/fr
Priority to CA155,193A priority patent/CA981800A/en
Publication of JPS4852178A publication Critical patent/JPS4852178A/ja
Publication of JPS5116258B2 publication Critical patent/JPS5116258B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
JP46085966A 1971-10-30 1971-10-30 Expired JPS5116258B2 (enFirst)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP46085966A JPS5116258B2 (enFirst) 1971-10-30 1971-10-30
DE2252830A DE2252830C2 (de) 1971-10-30 1972-10-27 Halbleiterbauelement mit einem Halbleiterelement in einem hermetisch geschlossenen Gehäuse
FR7238316A FR2158043B1 (enFirst) 1971-10-30 1972-10-27
CA155,193A CA981800A (en) 1971-10-30 1972-10-30 Uhf band semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46085966A JPS5116258B2 (enFirst) 1971-10-30 1971-10-30

Publications (2)

Publication Number Publication Date
JPS4852178A true JPS4852178A (enFirst) 1973-07-21
JPS5116258B2 JPS5116258B2 (enFirst) 1976-05-22

Family

ID=13873462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46085966A Expired JPS5116258B2 (enFirst) 1971-10-30 1971-10-30

Country Status (4)

Country Link
JP (1) JPS5116258B2 (enFirst)
CA (1) CA981800A (enFirst)
DE (1) DE2252830C2 (enFirst)
FR (1) FR2158043B1 (enFirst)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615059U (enFirst) * 1979-07-11 1981-02-09
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322387Y1 (enFirst) * 1968-02-22 1968-09-19

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1305115A (fr) * 1960-11-10 1962-09-28 Rca Corp Microélément de circuit électronique et ses modes de réalisation
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
FR1543300A (fr) * 1967-08-11 1968-10-25 Radiotechnique Coprim Rtc Boîtier pour dispositif semi-conducteur à forte dissipation calorifique
FR1553893A (enFirst) * 1967-11-28 1969-01-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322387Y1 (enFirst) * 1968-02-22 1968-09-19

Also Published As

Publication number Publication date
DE2252830C2 (de) 1983-05-26
FR2158043B1 (enFirst) 1978-08-04
DE2252830A1 (de) 1973-05-30
FR2158043A1 (enFirst) 1973-06-08
CA981800A (en) 1976-01-13
JPS5116258B2 (enFirst) 1976-05-22

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