JPS4846738A - - Google Patents

Info

Publication number
JPS4846738A
JPS4846738A JP10279472A JP10279472A JPS4846738A JP S4846738 A JPS4846738 A JP S4846738A JP 10279472 A JP10279472 A JP 10279472A JP 10279472 A JP10279472 A JP 10279472A JP S4846738 A JPS4846738 A JP S4846738A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10279472A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4846738A publication Critical patent/JPS4846738A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP10279472A 1971-10-15 1972-10-16 Pending JPS4846738A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18970571A 1971-10-15 1971-10-15

Publications (1)

Publication Number Publication Date
JPS4846738A true JPS4846738A (en:Method) 1973-07-03

Family

ID=22698432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10279472A Pending JPS4846738A (en:Method) 1971-10-15 1972-10-16

Country Status (3)

Country Link
JP (1) JPS4846738A (en:Method)
DE (1) DE2250045A1 (en:Method)
FR (1) FR2156366A1 (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4091125A (en) * 1976-11-08 1978-05-23 Delgadillo Joseph A Circuit board and method for producing same

Also Published As

Publication number Publication date
DE2250045A1 (de) 1973-05-17
FR2156366A1 (en:Method) 1973-05-25

Similar Documents

Publication Publication Date Title
CS170286B1 (en:Method)
CS174186B2 (en:Method)
CS158580B2 (en:Method)
FR2166529A5 (en:Method)
CS161952B2 (en:Method)
FR2142781A1 (en:Method)
CS153644B1 (en:Method)
JPS4846738A (en:Method)
AU465418B2 (en:Method)
CS151334B1 (en:Method)
CS162518B1 (en:Method)
CS150433B1 (en:Method)
CS151118B1 (en:Method)
CS154074B1 (en:Method)
CS152635B1 (en:Method)
CS154114B1 (en:Method)
CS154113B1 (en:Method)
HU165615B (en:Method)
CS154119B1 (en:Method)
CS154961B1 (en:Method)
CS155926B1 (en:Method)
CS171343B1 (en:Method)
CS156010B1 (en:Method)
CS168824B1 (en:Method)
CS165283B1 (en:Method)