JPS4838071A - - Google Patents

Info

Publication number
JPS4838071A
JPS4838071A JP7118271A JP7118271A JPS4838071A JP S4838071 A JPS4838071 A JP S4838071A JP 7118271 A JP7118271 A JP 7118271A JP 7118271 A JP7118271 A JP 7118271A JP S4838071 A JPS4838071 A JP S4838071A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7118271A
Other languages
Japanese (ja)
Other versions
JPS5116109B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46071182A priority Critical patent/JPS5116109B2/ja
Publication of JPS4838071A publication Critical patent/JPS4838071A/ja
Publication of JPS5116109B2 publication Critical patent/JPS5116109B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Sheets, Magazines, And Separation Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP46071182A 1971-09-16 1971-09-16 Expired JPS5116109B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46071182A JPS5116109B2 (enrdf_load_stackoverflow) 1971-09-16 1971-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46071182A JPS5116109B2 (enrdf_load_stackoverflow) 1971-09-16 1971-09-16

Publications (2)

Publication Number Publication Date
JPS4838071A true JPS4838071A (enrdf_load_stackoverflow) 1973-06-05
JPS5116109B2 JPS5116109B2 (enrdf_load_stackoverflow) 1976-05-21

Family

ID=13453243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46071182A Expired JPS5116109B2 (enrdf_load_stackoverflow) 1971-09-16 1971-09-16

Country Status (1)

Country Link
JP (1) JPS5116109B2 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130669A (enrdf_load_stackoverflow) * 1974-04-04 1975-10-16
JPS5322833U (enrdf_load_stackoverflow) * 1976-08-05 1978-02-25
JPS5456631U (enrdf_load_stackoverflow) * 1976-04-16 1979-04-19
JPS55142207A (en) * 1979-04-24 1980-11-06 Speno International Line defect transferring method and device therefor
JPS5645054A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130669A (enrdf_load_stackoverflow) * 1974-04-04 1975-10-16
JPS5456631U (enrdf_load_stackoverflow) * 1976-04-16 1979-04-19
JPS5322833U (enrdf_load_stackoverflow) * 1976-08-05 1978-02-25
JPS55142207A (en) * 1979-04-24 1980-11-06 Speno International Line defect transferring method and device therefor
JPS5645054A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device

Also Published As

Publication number Publication date
JPS5116109B2 (enrdf_load_stackoverflow) 1976-05-21

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