JPS4838071A - - Google Patents

Info

Publication number
JPS4838071A
JPS4838071A JP7118271A JP7118271A JPS4838071A JP S4838071 A JPS4838071 A JP S4838071A JP 7118271 A JP7118271 A JP 7118271A JP 7118271 A JP7118271 A JP 7118271A JP S4838071 A JPS4838071 A JP S4838071A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7118271A
Other languages
Japanese (ja)
Other versions
JPS5116109B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46071182A priority Critical patent/JPS5116109B2/ja
Publication of JPS4838071A publication Critical patent/JPS4838071A/ja
Publication of JPS5116109B2 publication Critical patent/JPS5116109B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP46071182A 1971-09-16 1971-09-16 Expired JPS5116109B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46071182A JPS5116109B2 (en) 1971-09-16 1971-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46071182A JPS5116109B2 (en) 1971-09-16 1971-09-16

Publications (2)

Publication Number Publication Date
JPS4838071A true JPS4838071A (en) 1973-06-05
JPS5116109B2 JPS5116109B2 (en) 1976-05-21

Family

ID=13453243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46071182A Expired JPS5116109B2 (en) 1971-09-16 1971-09-16

Country Status (1)

Country Link
JP (1) JPS5116109B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130669A (en) * 1974-04-04 1975-10-16
JPS5322833U (en) * 1976-08-05 1978-02-25
JPS5456631U (en) * 1976-04-16 1979-04-19
JPS55142207A (en) * 1979-04-24 1980-11-06 Speno International Line defect transferring method and device therefor
JPS5645054A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414804Y2 (en) * 1974-10-30 1979-06-18

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130669A (en) * 1974-04-04 1975-10-16
JPS5456631U (en) * 1976-04-16 1979-04-19
JPS5322833U (en) * 1976-08-05 1978-02-25
JPS5630405Y2 (en) * 1976-08-05 1981-07-20
JPS55142207A (en) * 1979-04-24 1980-11-06 Speno International Line defect transferring method and device therefor
JPH0210363B2 (en) * 1979-04-24 1990-03-07 Speno International
JPS5645054A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device

Also Published As

Publication number Publication date
JPS5116109B2 (en) 1976-05-21

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