JPS4830887A - - Google Patents
Info
- Publication number
- JPS4830887A JPS4830887A JP47075222A JP7522272A JPS4830887A JP S4830887 A JPS4830887 A JP S4830887A JP 47075222 A JP47075222 A JP 47075222A JP 7522272 A JP7522272 A JP 7522272A JP S4830887 A JPS4830887 A JP S4830887A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17450971A | 1971-08-24 | 1971-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4830887A true JPS4830887A (ref) | 1973-04-23 |
Family
ID=22636426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47075222A Pending JPS4830887A (ref) | 1971-08-24 | 1972-07-28 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS4830887A (ref) |
| DE (1) | DE2233427A1 (ref) |
| FR (1) | FR2150337B1 (ref) |
| GB (1) | GB1330600A (ref) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2048561B (en) | 1979-04-02 | 1983-02-23 | Philips Electronic Associated | Method of forming a secondary emissive coating on a dynode |
| GB2139248A (en) * | 1983-05-04 | 1984-11-07 | Gen Electric Co Plc | Copper alloy solderable contact pad produced by vapour deposition |
| CN104353966B (zh) * | 2011-08-26 | 2016-08-17 | 葫芦岛润盈复合新材料有限公司 | 一种塑性和韧性较好的铜包铝排的生产方法 |
| CN104439923B (zh) * | 2011-08-26 | 2017-03-08 | 葫芦岛润盈复合新材料有限公司 | 一种电阻率较低且塑性和韧性较好的铜包铝排的生产方法 |
| CN104384857B (zh) * | 2011-08-26 | 2016-08-17 | 葫芦岛润盈复合新材料有限公司 | 一种电阻率较低的铜包铝排的生产方法 |
-
1972
- 1972-07-03 GB GB3100772A patent/GB1330600A/en not_active Expired
- 1972-07-07 DE DE2233427A patent/DE2233427A1/de active Pending
- 1972-07-26 FR FR7228835*A patent/FR2150337B1/fr not_active Expired
- 1972-07-28 JP JP47075222A patent/JPS4830887A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2233427A1 (de) | 1973-03-08 |
| GB1330600A (en) | 1973-09-19 |
| FR2150337B1 (ref) | 1974-12-27 |
| FR2150337A1 (ref) | 1973-04-06 |