JPS4827683A - - Google Patents

Info

Publication number
JPS4827683A
JPS4827683A JP6106171A JP6106171A JPS4827683A JP S4827683 A JPS4827683 A JP S4827683A JP 6106171 A JP6106171 A JP 6106171A JP 6106171 A JP6106171 A JP 6106171A JP S4827683 A JPS4827683 A JP S4827683A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6106171A
Other languages
Japanese (ja)
Other versions
JPS5429865B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6106171A priority Critical patent/JPS5429865B2/ja
Priority to DE19722239676 priority patent/DE2239676A1/de
Publication of JPS4827683A publication Critical patent/JPS4827683A/ja
Priority to US05/546,923 priority patent/US3993808A/en
Publication of JPS5429865B2 publication Critical patent/JPS5429865B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP6106171A 1971-08-13 1971-08-13 Expired JPS5429865B2 (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6106171A JPS5429865B2 (enrdf_load_stackoverflow) 1971-08-13 1971-08-13
DE19722239676 DE2239676A1 (de) 1971-08-13 1972-08-11 Verfahren zum direkten stromlosen auftragen eines goldueberzugs
US05/546,923 US3993808A (en) 1971-08-13 1975-02-04 Method for electroless plating gold directly on tungsten or molybdenum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6106171A JPS5429865B2 (enrdf_load_stackoverflow) 1971-08-13 1971-08-13

Publications (2)

Publication Number Publication Date
JPS4827683A true JPS4827683A (enrdf_load_stackoverflow) 1973-04-12
JPS5429865B2 JPS5429865B2 (enrdf_load_stackoverflow) 1979-09-26

Family

ID=13160266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6106171A Expired JPS5429865B2 (enrdf_load_stackoverflow) 1971-08-13 1971-08-13

Country Status (1)

Country Link
JP (1) JPS5429865B2 (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923578A (enrdf_load_stackoverflow) * 1972-06-22 1974-03-02
JPS5136108A (enrdf_load_stackoverflow) * 1974-09-21 1976-03-26 Mizuki Seimitsu Kk
JPS51129672A (en) * 1975-04-11 1976-11-11 Hitachi Chemical Co Ltd Method of manufacturing ceramic circuit board
JPS5282369U (enrdf_load_stackoverflow) * 1975-12-16 1977-06-20
JPS5660038A (en) * 1980-10-20 1981-05-23 Nec Corp Semiconductor device
JPS60124892A (ja) * 1983-12-09 1985-07-03 日本特殊陶業株式会社 リ−ド付ｉｃパッケ−ジの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147547A (en) * 1960-03-10 1964-09-08 Gen Electric Coating refractory metals
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals
US3281931A (en) * 1963-10-10 1966-11-01 Bendix Corp High temperature ceramic-metal seal
US3551997A (en) * 1967-10-06 1971-01-05 Rca Corp Methods for electroless plating and for brazing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147547A (en) * 1960-03-10 1964-09-08 Gen Electric Coating refractory metals
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals
US3281931A (en) * 1963-10-10 1966-11-01 Bendix Corp High temperature ceramic-metal seal
US3551997A (en) * 1967-10-06 1971-01-05 Rca Corp Methods for electroless plating and for brazing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4923578A (enrdf_load_stackoverflow) * 1972-06-22 1974-03-02
JPS5136108A (enrdf_load_stackoverflow) * 1974-09-21 1976-03-26 Mizuki Seimitsu Kk
JPS51129672A (en) * 1975-04-11 1976-11-11 Hitachi Chemical Co Ltd Method of manufacturing ceramic circuit board
JPS5282369U (enrdf_load_stackoverflow) * 1975-12-16 1977-06-20
JPS5660038A (en) * 1980-10-20 1981-05-23 Nec Corp Semiconductor device
JPS60124892A (ja) * 1983-12-09 1985-07-03 日本特殊陶業株式会社 リ−ド付ｉｃパッケ−ジの製造方法

Also Published As

Publication number Publication date
JPS5429865B2 (enrdf_load_stackoverflow) 1979-09-26

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