JPS4826072B1 - - Google Patents

Info

Publication number
JPS4826072B1
JPS4826072B1 JP43036642A JP3664268A JPS4826072B1 JP S4826072 B1 JPS4826072 B1 JP S4826072B1 JP 43036642 A JP43036642 A JP 43036642A JP 3664268 A JP3664268 A JP 3664268A JP S4826072 B1 JPS4826072 B1 JP S4826072B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP43036642A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4826072B1 publication Critical patent/JPS4826072B1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Machine Tool Positioning Apparatuses (AREA)
JP43036642A 1967-06-01 1968-05-29 Pending JPS4826072B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64289567A 1967-06-01 1967-06-01

Publications (1)

Publication Number Publication Date
JPS4826072B1 true JPS4826072B1 (ja) 1973-08-04

Family

ID=24578471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP43036642A Pending JPS4826072B1 (ja) 1967-06-01 1968-05-29

Country Status (4)

Country Link
US (1) US3490846A (ja)
JP (1) JPS4826072B1 (ja)
FR (1) FR1567686A (ja)
GB (1) GB1227821A (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3955072A (en) * 1971-03-22 1976-05-04 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask
US3940211A (en) * 1971-03-22 1976-02-24 Kasper Instruments, Inc. Step-and-repeat projection alignment and exposure system
US4408885A (en) * 1971-03-22 1983-10-11 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
US3752589A (en) * 1971-10-26 1973-08-14 M Kobayashi Method and apparatus for positioning patterns of a photographic mask on the surface of a wafer on the basis of backside patterns of the wafer
US3819265A (en) * 1972-08-02 1974-06-25 Bell Telephone Labor Inc Scanning projection printer apparatus and method
GB1473301A (en) * 1973-05-03 1977-05-11 Nippon Kogaku Kk Manufacture of multi-layer structures
US4050817A (en) * 1973-05-03 1977-09-27 Nippon Kogaku K.K. Manufacture of multi-layer structures
US3865254A (en) * 1973-05-21 1975-02-11 Kasker Instr Inc Prealignment system for an optical alignment and exposure instrument
US3844655A (en) * 1973-07-27 1974-10-29 Kasper Instruments Method and means for forming an aligned mask that does not include alignment marks employed in aligning the mask
US3858978A (en) * 1973-08-10 1975-01-07 Kasper Instruments Chuck for use in out-of-contact optical alignment and exposure apparatus
US4179110A (en) * 1974-05-28 1979-12-18 Canon Kabushiki Kaisha Method for opposing a sheet-like material to a standard plane with predetermined space therebetween
US4052603A (en) * 1974-12-23 1977-10-04 International Business Machines Corporation Object positioning process and apparatus
US4335313A (en) * 1980-05-12 1982-06-15 The Perkin-Elmer Corporation Method and apparatus for aligning an opaque mask with an integrated circuit wafer
US4538885A (en) * 1982-06-18 1985-09-03 Coulter Electronics, Inc. Optical microscope system
US4508435A (en) * 1982-06-18 1985-04-02 Coulter Electronics, Inc. Air vacuum chuck for a microscope
JP2006302921A (ja) * 2005-04-15 2006-11-02 Shibuya Kogyo Co Ltd 導電性ボール搭載装置
EP1950595A1 (en) * 2005-11-16 2008-07-30 Olympus Corporation Optical microscope
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
CN113932843B (zh) * 2021-11-30 2024-06-07 中国工程物理研究院激光聚变研究中心 对温湿度及压力进行控制的传感器测试腔体及应用方法
CN117819205B (zh) * 2024-02-04 2024-05-17 嘉兴乐威电子科技有限公司 一种用于工件输送的吸取搬运机构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563789A (en) * 1947-09-13 1951-08-07 Bausch & Lomb Microscope fine adjustment
US2910913A (en) * 1955-05-17 1959-11-03 Zeiss Carl Camera microscopes
US3192844A (en) * 1963-03-05 1965-07-06 Kulicke And Soffa Mfg Company Mask alignment fixture
US3334541A (en) * 1964-07-28 1967-08-08 Jade Corp Precision art work machine
US3220331A (en) * 1965-01-27 1965-11-30 Kulicke And Soffa Mfg Company Contact printing mask alignment apparatus for semiconductor wafer geometry

Also Published As

Publication number Publication date
DE1772547A1 (ja) 1972-10-05
DE1772547B2 (de) 1972-10-05
FR1567686A (ja) 1969-04-08
GB1227821A (ja) 1971-04-07
US3490846A (en) 1970-01-20

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