JPS4825057B1 - - Google Patents
Info
- Publication number
- JPS4825057B1 JPS4825057B1 JP11368270A JP11368270A JPS4825057B1 JP S4825057 B1 JPS4825057 B1 JP S4825057B1 JP 11368270 A JP11368270 A JP 11368270A JP 11368270 A JP11368270 A JP 11368270A JP S4825057 B1 JPS4825057 B1 JP S4825057B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11368270A JPS4825057B1 (de) | 1970-12-19 | 1970-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11368270A JPS4825057B1 (de) | 1970-12-19 | 1970-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4825057B1 true JPS4825057B1 (de) | 1973-07-26 |
Family
ID=14618489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11368270A Pending JPS4825057B1 (de) | 1970-12-19 | 1970-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4825057B1 (de) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147764U (de) * | 1974-10-07 | 1976-04-09 | ||
| JPS52171565U (de) * | 1976-06-16 | 1977-12-27 | ||
| JP2005048186A (ja) * | 2003-07-29 | 2005-02-24 | Degussa Ag | 選択的レーザー焼結のための焼結粉末、その製法、成形体の製法、およびこの種の成形体 |
| WO2006126563A1 (ja) * | 2005-05-25 | 2006-11-30 | Toray Industries, Inc. | ポリアミド樹脂微粒子及びその製造方法 |
| JP2007056085A (ja) * | 2005-08-23 | 2007-03-08 | Toray Ind Inc | ポリカプロアミド樹脂微粒子およびそれを含む化粧品 |
-
1970
- 1970-12-19 JP JP11368270A patent/JPS4825057B1/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147764U (de) * | 1974-10-07 | 1976-04-09 | ||
| JPS52171565U (de) * | 1976-06-16 | 1977-12-27 | ||
| JP2005048186A (ja) * | 2003-07-29 | 2005-02-24 | Degussa Ag | 選択的レーザー焼結のための焼結粉末、その製法、成形体の製法、およびこの種の成形体 |
| WO2006126563A1 (ja) * | 2005-05-25 | 2006-11-30 | Toray Industries, Inc. | ポリアミド樹脂微粒子及びその製造方法 |
| JP2007056085A (ja) * | 2005-08-23 | 2007-03-08 | Toray Ind Inc | ポリカプロアミド樹脂微粒子およびそれを含む化粧品 |