JPS48140U - - Google Patents

Info

Publication number
JPS48140U
JPS48140U JP4195971U JP4195971U JPS48140U JP S48140 U JPS48140 U JP S48140U JP 4195971 U JP4195971 U JP 4195971U JP 4195971 U JP4195971 U JP 4195971U JP S48140 U JPS48140 U JP S48140U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4195971U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4195971U priority Critical patent/JPS48140U/ja
Publication of JPS48140U publication Critical patent/JPS48140U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP4195971U 1971-05-22 1971-05-22 Pending JPS48140U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4195971U JPS48140U (cs) 1971-05-22 1971-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4195971U JPS48140U (cs) 1971-05-22 1971-05-22

Publications (1)

Publication Number Publication Date
JPS48140U true JPS48140U (cs) 1973-01-05

Family

ID=27914378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4195971U Pending JPS48140U (cs) 1971-05-22 1971-05-22

Country Status (1)

Country Link
JP (1) JPS48140U (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458870A (en) * 1977-10-18 1979-05-11 Omron Tateisi Electronics Co Method of molding mold of electronic device
JPH02302062A (ja) * 1989-05-16 1990-12-14 Nec Corp 混成集積回路装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458870A (en) * 1977-10-18 1979-05-11 Omron Tateisi Electronics Co Method of molding mold of electronic device
JPH02302062A (ja) * 1989-05-16 1990-12-14 Nec Corp 混成集積回路装置

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