JPS4813265B1 - - Google Patents
Info
- Publication number
- JPS4813265B1 JPS4813265B1 JP38055551A JP5555163A JPS4813265B1 JP S4813265 B1 JPS4813265 B1 JP S4813265B1 JP 38055551 A JP38055551 A JP 38055551A JP 5555163 A JP5555163 A JP 5555163A JP S4813265 B1 JPS4813265 B1 JP S4813265B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP38055551A JPS4813265B1 (enrdf_load_stackoverflow) | 1963-10-17 | 1963-10-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP38055551A JPS4813265B1 (enrdf_load_stackoverflow) | 1963-10-17 | 1963-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4813265B1 true JPS4813265B1 (enrdf_load_stackoverflow) | 1973-04-26 |
Family
ID=13001826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP38055551A Pending JPS4813265B1 (enrdf_load_stackoverflow) | 1963-10-17 | 1963-10-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4813265B1 (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4293587A (en) * | 1978-11-09 | 1981-10-06 | Zilog, Inc. | Low resistance backside preparation for semiconductor integrated circuit chips |
JPS5929429A (ja) * | 1982-07-29 | 1984-02-16 | エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ | ウエ−ハ裏面の金属化法 |
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1963
- 1963-10-17 JP JP38055551A patent/JPS4813265B1/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4293587A (en) * | 1978-11-09 | 1981-10-06 | Zilog, Inc. | Low resistance backside preparation for semiconductor integrated circuit chips |
JPS5929429A (ja) * | 1982-07-29 | 1984-02-16 | エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ | ウエ−ハ裏面の金属化法 |
US4517226A (en) * | 1982-07-29 | 1985-05-14 | Sgs-Ates Componenti Elettronici S.P.A. | Metallization process of a wafer back |