JPS48112955U - - Google Patents

Info

Publication number
JPS48112955U
JPS48112955U JP1972036171U JP3617172U JPS48112955U JP S48112955 U JPS48112955 U JP S48112955U JP 1972036171 U JP1972036171 U JP 1972036171U JP 3617172 U JP3617172 U JP 3617172U JP S48112955 U JPS48112955 U JP S48112955U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972036171U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972036171U priority Critical patent/JPS48112955U/ja
Publication of JPS48112955U publication Critical patent/JPS48112955U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1972036171U 1972-03-29 1972-03-29 Pending JPS48112955U (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972036171U JPS48112955U (sv) 1972-03-29 1972-03-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972036171U JPS48112955U (sv) 1972-03-29 1972-03-29

Publications (1)

Publication Number Publication Date
JPS48112955U true JPS48112955U (sv) 1973-12-24

Family

ID=27903460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972036171U Pending JPS48112955U (sv) 1972-03-29 1972-03-29

Country Status (1)

Country Link
JP (1) JPS48112955U (sv)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53115965U (sv) * 1977-02-23 1978-09-14
JPS58149662U (ja) * 1982-04-01 1983-10-07 株式会社トキメック リリ−フ弁
WO2014045491A1 (ja) * 2012-09-21 2014-03-27 日本特殊陶業株式会社 配線基板及びその製造方法
JP2017022228A (ja) * 2015-07-09 2017-01-26 ローム株式会社 半導体装置およびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53115965U (sv) * 1977-02-23 1978-09-14
JPS58149662U (ja) * 1982-04-01 1983-10-07 株式会社トキメック リリ−フ弁
WO2014045491A1 (ja) * 2012-09-21 2014-03-27 日本特殊陶業株式会社 配線基板及びその製造方法
JP2014063932A (ja) * 2012-09-21 2014-04-10 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2017022228A (ja) * 2015-07-09 2017-01-26 ローム株式会社 半導体装置およびその製造方法

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