JPS48112955U - - Google Patents
Info
- Publication number
- JPS48112955U JPS48112955U JP1972036171U JP3617172U JPS48112955U JP S48112955 U JPS48112955 U JP S48112955U JP 1972036171 U JP1972036171 U JP 1972036171U JP 3617172 U JP3617172 U JP 3617172U JP S48112955 U JPS48112955 U JP S48112955U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972036171U JPS48112955U (nl) | 1972-03-29 | 1972-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972036171U JPS48112955U (nl) | 1972-03-29 | 1972-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS48112955U true JPS48112955U (nl) | 1973-12-24 |
Family
ID=27903460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972036171U Pending JPS48112955U (nl) | 1972-03-29 | 1972-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS48112955U (nl) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115965U (nl) * | 1977-02-23 | 1978-09-14 | ||
| JPS58149662U (ja) * | 1982-04-01 | 1983-10-07 | 株式会社トキメック | リリ−フ弁 |
| WO2014045491A1 (ja) * | 2012-09-21 | 2014-03-27 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
| JP2017022228A (ja) * | 2015-07-09 | 2017-01-26 | ローム株式会社 | 半導体装置およびその製造方法 |
-
1972
- 1972-03-29 JP JP1972036171U patent/JPS48112955U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53115965U (nl) * | 1977-02-23 | 1978-09-14 | ||
| JPS58149662U (ja) * | 1982-04-01 | 1983-10-07 | 株式会社トキメック | リリ−フ弁 |
| WO2014045491A1 (ja) * | 2012-09-21 | 2014-03-27 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
| JP2014063932A (ja) * | 2012-09-21 | 2014-04-10 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
| JP2017022228A (ja) * | 2015-07-09 | 2017-01-26 | ローム株式会社 | 半導体装置およびその製造方法 |