JPS48104261U - - Google Patents
Info
- Publication number
- JPS48104261U JPS48104261U JP2878872U JP2878872U JPS48104261U JP S48104261 U JPS48104261 U JP S48104261U JP 2878872 U JP2878872 U JP 2878872U JP 2878872 U JP2878872 U JP 2878872U JP S48104261 U JPS48104261 U JP S48104261U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2878872U JPS5117811Y2 (en:Method) | 1972-03-09 | 1972-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2878872U JPS5117811Y2 (en:Method) | 1972-03-09 | 1972-03-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS48104261U true JPS48104261U (en:Method) | 1973-12-05 |
| JPS5117811Y2 JPS5117811Y2 (en:Method) | 1976-05-13 |
Family
ID=27889632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2878872U Expired JPS5117811Y2 (en:Method) | 1972-03-09 | 1972-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5117811Y2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185834U (ja) * | 1975-02-10 | 1984-12-10 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 試験システム用接続装置 |
| JPH08111439A (ja) * | 1995-10-18 | 1996-04-30 | Tokyo Seimitsu Co Ltd | 半導体素子検査方法 |
| JP2005514627A (ja) * | 2001-12-27 | 2005-05-19 | フォームファクター，インコーポレイテッド | 能動電子部品の直接冷却をともなう冷却アセンブリ |
-
1972
- 1972-03-09 JP JP2878872U patent/JPS5117811Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185834U (ja) * | 1975-02-10 | 1984-12-10 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 試験システム用接続装置 |
| JPH08111439A (ja) * | 1995-10-18 | 1996-04-30 | Tokyo Seimitsu Co Ltd | 半導体素子検査方法 |
| JP2005514627A (ja) * | 2001-12-27 | 2005-05-19 | フォームファクター，インコーポレイテッド | 能動電子部品の直接冷却をともなう冷却アセンブリ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5117811Y2 (en:Method) | 1976-05-13 |