JPS48102576A - - Google Patents
Info
- Publication number
- JPS48102576A JPS48102576A JP48017560A JP1756073A JPS48102576A JP S48102576 A JPS48102576 A JP S48102576A JP 48017560 A JP48017560 A JP 48017560A JP 1756073 A JP1756073 A JP 1756073A JP S48102576 A JPS48102576 A JP S48102576A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H10P14/6923—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23086972A | 1972-03-01 | 1972-03-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS48102576A true JPS48102576A (enExample) | 1973-12-22 |
| JPS5611753B2 JPS5611753B2 (enExample) | 1981-03-17 |
Family
ID=22866903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1756073A Expired JPS5611753B2 (enExample) | 1972-03-01 | 1973-02-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3743587A (enExample) |
| JP (1) | JPS5611753B2 (enExample) |
| DE (1) | DE2309615A1 (enExample) |
| FR (1) | FR2174569A5 (enExample) |
| GB (1) | GB1387774A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6324056A (ja) * | 1986-06-20 | 1988-02-01 | エイ・ティ・アンド・ティ・コーポレーション | デバイスの製造方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4131533A (en) * | 1977-12-30 | 1978-12-26 | International Business Machines Corporation | RF sputtering apparatus having floating anode shield |
| US4515668A (en) * | 1984-04-25 | 1985-05-07 | Honeywell Inc. | Method of forming a dielectric layer comprising a gettering material |
| GB8504458D0 (en) * | 1985-02-21 | 1985-03-27 | Gen Eng Radcliffe Ltd | Producing multi-layered coatings |
| DE3636524A1 (de) * | 1986-10-27 | 1988-04-28 | Vtu Angel Kancev | Einrichtung zum auftragen von ueberzuegen im vakuum durch magnetronzerstaeubung |
| US5047369A (en) * | 1989-05-01 | 1991-09-10 | At&T Bell Laboratories | Fabrication of semiconductor devices using phosphosilicate glasses |
| CN102701569B (zh) * | 2012-01-12 | 2015-01-07 | 上海华力微电子有限公司 | 改善高密度等离子体化学气相淀积的磷硅玻璃形貌的方法 |
-
1972
- 1972-03-01 US US00230869A patent/US3743587A/en not_active Expired - Lifetime
-
1973
- 1973-01-18 GB GB260273A patent/GB1387774A/en not_active Expired
- 1973-02-06 FR FR7305432A patent/FR2174569A5/fr not_active Expired
- 1973-02-14 JP JP1756073A patent/JPS5611753B2/ja not_active Expired
- 1973-02-27 DE DE19732309615 patent/DE2309615A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6324056A (ja) * | 1986-06-20 | 1988-02-01 | エイ・ティ・アンド・ティ・コーポレーション | デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2174569A5 (enExample) | 1973-10-12 |
| JPS5611753B2 (enExample) | 1981-03-17 |
| GB1387774A (en) | 1975-03-19 |
| US3743587A (en) | 1973-07-03 |
| DE2309615A1 (de) | 1973-09-06 |