JPS48101085A - - Google Patents

Info

Publication number
JPS48101085A
JPS48101085A JP47032481A JP3248172A JPS48101085A JP S48101085 A JPS48101085 A JP S48101085A JP 47032481 A JP47032481 A JP 47032481A JP 3248172 A JP3248172 A JP 3248172A JP S48101085 A JPS48101085 A JP S48101085A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47032481A
Other languages
Japanese (ja)
Other versions
JPS5427714B2 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3248172A priority Critical patent/JPS5427714B2/ja
Publication of JPS48101085A publication Critical patent/JPS48101085A/ja
Publication of JPS5427714B2 publication Critical patent/JPS5427714B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3248172A 1972-03-31 1972-03-31 Expired JPS5427714B2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3248172A JPS5427714B2 (ko) 1972-03-31 1972-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3248172A JPS5427714B2 (ko) 1972-03-31 1972-03-31

Publications (2)

Publication Number Publication Date
JPS48101085A true JPS48101085A (ko) 1973-12-20
JPS5427714B2 JPS5427714B2 (ko) 1979-09-11

Family

ID=12360164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3248172A Expired JPS5427714B2 (ko) 1972-03-31 1972-03-31

Country Status (1)

Country Link
JP (1) JPS5427714B2 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717178A (en) * 1980-07-07 1982-01-28 Nec Corp Field-effect transistor
JPS5772357A (en) * 1980-10-24 1982-05-06 Nec Corp Mounting method of integrated circuit
JPS5778158A (en) * 1980-11-04 1982-05-15 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit device
JPS5853838A (ja) * 1981-09-26 1983-03-30 Mitsubishi Electric Corp 半導体装置
JPS59163843A (ja) * 1983-03-09 1984-09-14 Nippon Denso Co Ltd 半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717178A (en) * 1980-07-07 1982-01-28 Nec Corp Field-effect transistor
JPS5772357A (en) * 1980-10-24 1982-05-06 Nec Corp Mounting method of integrated circuit
JPS6143857B2 (ko) * 1980-10-24 1986-09-30 Nippon Electric Co
JPS5778158A (en) * 1980-11-04 1982-05-15 Nippon Telegr & Teleph Corp <Ntt> Semiconductor integrated circuit device
JPS5853838A (ja) * 1981-09-26 1983-03-30 Mitsubishi Electric Corp 半導体装置
JPS6360533B2 (ko) * 1981-09-26 1988-11-24
JPS59163843A (ja) * 1983-03-09 1984-09-14 Nippon Denso Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS5427714B2 (ko) 1979-09-11

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