JPS474071A - - Google Patents
Info
- Publication number
- JPS474071A JPS474071A JP5322671A JP5322671A JPS474071A JP S474071 A JPS474071 A JP S474071A JP 5322671 A JP5322671 A JP 5322671A JP 5322671 A JP5322671 A JP 5322671A JP S474071 A JPS474071 A JP S474071A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0892—Compounds with a Si-O-N linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1896—Compounds having one or more Si-O-acyl linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6613470A | 1970-08-21 | 1970-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS474071A true JPS474071A (OSRAM) | 1972-02-28 |
| JPS5536674B2 JPS5536674B2 (OSRAM) | 1980-08-22 |
Family
ID=22067452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7153226A Expired JPS5536674B2 (OSRAM) | 1970-08-21 | 1971-07-19 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5536674B2 (OSRAM) |
| BE (1) | BE771590A (OSRAM) |
| CA (1) | CA918159A (OSRAM) |
| DE (1) | DE2141328A1 (OSRAM) |
| FR (1) | FR2104593A5 (OSRAM) |
| GB (1) | GB1299575A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023276880A1 (ja) * | 2021-06-29 | 2023-01-05 | 東洋紡株式会社 | ポリアミド酸、ポリイミド、及びその用途 |
| JPWO2024162022A1 (OSRAM) * | 2023-01-31 | 2024-08-08 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008512546A (ja) * | 2004-09-10 | 2008-04-24 | ダウ・コーニング・コーポレイション | 無水物官能性シルセスキオキサン樹脂 |
| CN101048464B (zh) | 2004-10-25 | 2011-04-20 | 陶氏康宁公司 | 含有醇官能的有机硅树脂或者酸酐官能的有机硅树脂的涂料组合物 |
| US7807012B2 (en) | 2004-10-25 | 2010-10-05 | Dow Corning Corporation | Moldable compositions containing carbinol functional silicone resins or anhydride functional silicone resins |
| JP6161506B2 (ja) * | 2013-10-17 | 2017-07-12 | 東洋ゴム工業株式会社 | 有機シラン及びそれを用いたゴム組成物 |
-
1971
- 1971-05-26 CA CA113915A patent/CA918159A/en not_active Expired
- 1971-07-19 JP JP7153226A patent/JPS5536674B2/ja not_active Expired
- 1971-07-22 GB GB34439/71A patent/GB1299575A/en not_active Expired
- 1971-08-18 DE DE19712141328 patent/DE2141328A1/de active Pending
- 1971-08-20 FR FR7130409A patent/FR2104593A5/fr not_active Expired
- 1971-08-20 BE BE771590A patent/BE771590A/xx unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023276880A1 (ja) * | 2021-06-29 | 2023-01-05 | 東洋紡株式会社 | ポリアミド酸、ポリイミド、及びその用途 |
| JPWO2024162022A1 (OSRAM) * | 2023-01-31 | 2024-08-08 | ||
| WO2024162022A1 (ja) * | 2023-01-31 | 2024-08-08 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化型シリコーン組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2141328A1 (de) | 1972-02-24 |
| GB1299575A (en) | 1972-12-13 |
| JPS5536674B2 (OSRAM) | 1980-08-22 |
| CA918159A (en) | 1973-01-02 |
| FR2104593A5 (OSRAM) | 1972-04-14 |
| BE771590A (fr) | 1972-02-21 |