JPS4313705Y1 - - Google Patents

Info

Publication number
JPS4313705Y1
JPS4313705Y1 JP7508767U JP7508767U JPS4313705Y1 JP S4313705 Y1 JPS4313705 Y1 JP S4313705Y1 JP 7508767 U JP7508767 U JP 7508767U JP 7508767 U JP7508767 U JP 7508767U JP S4313705 Y1 JPS4313705 Y1 JP S4313705Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7508767U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7508767U priority Critical patent/JPS4313705Y1/ja
Publication of JPS4313705Y1 publication Critical patent/JPS4313705Y1/ja
Expired legal-status Critical Current

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Landscapes

  • Molten Solder (AREA)
JP7508767U 1967-08-31 1967-08-31 Expired JPS4313705Y1 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7508767U JPS4313705Y1 (cs) 1967-08-31 1967-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7508767U JPS4313705Y1 (cs) 1967-08-31 1967-08-31

Publications (1)

Publication Number Publication Date
JPS4313705Y1 true JPS4313705Y1 (cs) 1968-06-11

Family

ID=31807091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7508767U Expired JPS4313705Y1 (cs) 1967-08-31 1967-08-31

Country Status (1)

Country Link
JP (1) JPS4313705Y1 (cs)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039060B1 (cs) * 1971-03-09 1975-12-13
JPS5228443A (en) * 1975-08-29 1977-03-03 Hitachi Ltd Ultrasonic soldering device
JPS53129145A (en) * 1977-04-19 1978-11-10 Nippon Telegr & Teleph Corp <Ntt> Manufacture of solder laminated spring material
JPS60121064A (ja) * 1983-12-06 1985-06-28 Matsushita Electric Ind Co Ltd 金属ベ−ス回路基板の端子半田付け方法
JPS61135475A (ja) * 1984-12-04 1986-06-23 Tanaka Kikinzoku Kogyo Kk 複合帯状材料の製造方法
JPS6267193A (ja) * 1985-09-19 1987-03-26 Rohm Co Ltd エツチングフレ−ムのメツキ方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039060B1 (cs) * 1971-03-09 1975-12-13
JPS5228443A (en) * 1975-08-29 1977-03-03 Hitachi Ltd Ultrasonic soldering device
JPS53129145A (en) * 1977-04-19 1978-11-10 Nippon Telegr & Teleph Corp <Ntt> Manufacture of solder laminated spring material
JPS60121064A (ja) * 1983-12-06 1985-06-28 Matsushita Electric Ind Co Ltd 金属ベ−ス回路基板の端子半田付け方法
JPS61135475A (ja) * 1984-12-04 1986-06-23 Tanaka Kikinzoku Kogyo Kk 複合帯状材料の製造方法
JPS6267193A (ja) * 1985-09-19 1987-03-26 Rohm Co Ltd エツチングフレ−ムのメツキ方法

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