JPH1199412A - Dividing and polishing method for chip raw material with sintered diamond - Google Patents
Dividing and polishing method for chip raw material with sintered diamondInfo
- Publication number
- JPH1199412A JPH1199412A JP30231197A JP30231197A JPH1199412A JP H1199412 A JPH1199412 A JP H1199412A JP 30231197 A JP30231197 A JP 30231197A JP 30231197 A JP30231197 A JP 30231197A JP H1199412 A JPH1199412 A JP H1199412A
- Authority
- JP
- Japan
- Prior art keywords
- sintered diamond
- chip
- metallic support
- diamond
- sintered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 50
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000005498 polishing Methods 0.000 title claims description 19
- 239000002994 raw material Substances 0.000 title abstract description 7
- 238000005219 brazing Methods 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 17
- 239000010953 base metal Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/02—Circular saw blades
- B23D61/021—Types of set; Variable teeth, e.g. variable in height or gullet depth; Varying pitch; Details of gullet
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、円板状に形成さ
れた台金の周縁部に設けられた、焼結ダイヤモンド付き
チップ素材の分割と研磨の方法であり、素材を所要角度
に計算して斜めに切断、分割し、使用する焼結ダイヤモ
ンドの小量化と研磨時間の短縮を図り、コストの低減と
作業性の向上を目的とした、焼結ダイヤモンド付きチッ
プ素材の分割と研磨方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of dividing and polishing a chip material with a sintered diamond provided on a peripheral portion of a base metal formed in a disk shape, and calculates the material to a required angle. Cutting and splitting diagonally, and reducing the amount of sintered diamond to be used and shortening the polishing time, and cutting and polishing the chip material with sintered diamond for the purpose of reducing costs and improving workability. It is.
【０００２】[0002]
【従来の技術】従来は、焼結ダイヤモンドと超硬合金か
らなる素材を、任意なサイズでワイヤーカットにて切断
し、台金に、ろう付けして焼結ダイヤモンド付きチップ
の先端にげ角に沿って研磨し、両側面は側面研磨部を切
り幅に合わせて研磨していた。2. Description of the Related Art Conventionally, a material made of a sintered diamond and a cemented carbide is cut into wires of an arbitrary size by wire cutting, brazed to a base metal, and the tip of a tip with a sintered diamond is formed at an angle. The side surfaces were polished according to the cut width on both side surfaces.
【０００３】[0003]
【発明が解決しようとする課題】従来の方法は、焼結ダ
イヤモンド付きチップの先端研磨部と側面研磨部の研磨
範囲が広く、焼結ダイヤモンドをダイヤモンド砥石で研
磨するので時間がかかり、作業性が低いことと、高価な
機械設備が必要という問題点があった。In the conventional method, the polishing range of the tip polishing portion and the side polishing portion of the tip with the sintered diamond is wide, and since the sintered diamond is polished with the diamond grindstone, it takes time and the workability is low. There are problems that it is low and that expensive mechanical equipment is required.
【０００４】[0004]
【課題を解決するための手段】本発明は、超硬合金と焼
結ダイヤモンドからなる素材を、すくい角と先端にげ角
を計算した角度で、斜めに切断と同時に溝を設けた焼結
ダイヤモンドに台金を埋め込み、台金との接点を、ろう
付けして固定し、仕上げは焼結ダイヤモンドチップの両
側面の研磨のみとしたものであり、本発明を使用すれ
ば、焼結ダイヤモンドの使用量が少量化されてコスト低
減となり，研磨時間も短縮されるので作業性が大幅に向
上する。SUMMARY OF THE INVENTION The present invention relates to a sintered diamond in which a material consisting of a cemented carbide and a sintered diamond is cut obliquely and simultaneously provided with a groove at an angle at which the rake angle and the angle at the tip are calculated. The base metal is embedded in the base metal, the contact point with the base metal is fixed by brazing, and the polishing is performed only on both sides of the sintered diamond chip. Since the amount is reduced and the cost is reduced, and the polishing time is also reduced, the workability is greatly improved.
【０００５】[0005]
【発明の実施の形態】超硬合金と焼結ダイヤモンドから
なる素材を、すくい角と先端にげ角を計算した角度で斜
めに切断と同時に、溝を設けて分割する。BEST MODE FOR CARRYING OUT THE INVENTION A material comprising a cemented carbide and a sintered diamond is cut obliquely at an angle at which a rake angle and a bevel angle are calculated at a tip, and at the same time, a groove is provided and divided.
【０００６】前記により設けられた溝に台金を埋め込
み、ろう付けして固定した後、焼結ダイヤモンドチップ
の両側面のみを研磨して仕上げる。[0006] After the base metal is buried in the groove provided above and fixed by brazing, only the both side surfaces of the sintered diamond chip are polished and finished.
【０００７】上記のような方法で、焼結ダイヤモンド付
きチップソーを製造すれば、焼結ダイヤモンドの使用量
が少なくて済み、研磨も焼結ダイヤモンドチップの両側
面だけなので時間も短縮でき、経済性と作業性が著しく
向上する。[0007] If a tip saw with sintered diamond is manufactured by the above-described method, the amount of sintered diamond used can be reduced, and polishing can be performed only on both side surfaces of the sintered diamond tip, so that the time can be shortened. Workability is significantly improved.
【０００８】[0008]
【実施例】実施例について図面を参照して説明すると、
図１は本発明を使用して作成した焼結ダイヤモンド付き
チップソーの、部分拡大側面図であり、円板状に形成し
た台金１の周縁部に、分割した焼結ダイヤモンド付きチ
ップを台金１の、ろう付け部７に、ろう付けして固定す
る。Embodiments will be described with reference to the drawings.
FIG. 1 is a partially enlarged side view of a tip saw with a sintered diamond prepared by using the present invention, and a divided tip with a sintered diamond is attached to the periphery of a base 1 formed in a disk shape. Is fixed to the brazing portion 7 by brazing.
【０００９】図２は、上面が焼結ダイヤモンド２、下方
は超硬合金３からなる素材４の斜視図である。FIG. 2 is a perspective view of a raw material 4 made of a sintered diamond 2 on the upper surface and a cemented carbide 3 on the lower side.
【００１０】図３は、素材４の切断、分割方法を示した
側面図であり、すくい角９と先端にげ角１０を計算した
角度の、カット線５で切断、分割と同時に溝８を設け
る。FIG. 3 is a side view showing a method of cutting and dividing the raw material 4. The cutting line 5 is cut and divided at the same angle as the rake angle 9 and the angle of inclination 10 calculated at the tip, and the groove 8 is provided at the same time. .
【００１１】図４は、図３で説明した、すくい角９と先
端にげ角１０の位置及び、焼結ダイヤモンド２、超硬合
金３並びに、溝８を示した側面図である。FIG. 4 is a side view showing the position of the rake angle 9 and the angle of inclination 10 at the tip, the sintered diamond 2, the cemented carbide 3, and the groove 8 described in FIG.
【００１２】図５は、素材４を分割した焼結ダイヤモン
ドチップの上面図であり、２は焼結ダイヤモンド、８は
溝、１５は側面にげ角を示している。FIG. 5 is a top view of a sintered diamond chip obtained by dividing the raw material 4, wherein 2 is a sintered diamond, 8 is a groove, and 15 is a bevel on a side surface.
【００１３】図６は、図１の円部Ａの拡大側面図であ
り、図３で説明のように素材を切断、分割と同時に設け
られた溝８に台金１を埋め込み、ろう付け部７に、ろう
付けして固定する。FIG. 6 is an enlarged side view of the circle portion A in FIG. 1. As shown in FIG. 3, the base metal 1 is embedded in the groove 8 provided at the same time as cutting and dividing the material, and the brazing portion 7 is formed. And fix it by brazing.
【００１４】図７は、図６のＢ−Ｂ拡大断面図であり、
２は焼結ダイヤモンド、１は台金、８は溝、３は超硬合
金を示している。FIG. 7 is an enlarged sectional view taken along the line BB of FIG.
2 indicates a sintered diamond, 1 indicates a base metal, 8 indicates a groove, and 3 indicates a cemented carbide.
【００１５】図８は、図６のＣ−Ｃ拡大断面図であり、
１は台金、３は超硬合金、１４は向心角を示している
が、本発明の研磨時間は従来の１０分の１時間位で完了
する。FIG. 8 is an enlarged sectional view taken along the line CC of FIG.
Reference numeral 1 denotes a base metal, 3 denotes a cemented carbide, and 14 denotes a centripetal angle. The polishing time of the present invention is completed in about one tenth of the conventional time.
【００１６】図９は、従来の素材の切断、分割方法を示
した平面図であり、素材４に対して任意に設けた第２カ
ット線６により、ワイヤーカット切断、分割していた。FIG. 9 is a plan view showing a conventional method of cutting and dividing a material, in which the material 4 is cut and divided by a second cut line 6 arbitrarily provided for the material 4.
【００１７】図１０は、従来の焼結ダイヤモンド付きチ
ップソーの一部の刃の構造を示したものであり前記、図
９で切断、分割された焼結ダイヤモンドチップを、台金
１の、ろう付け部７に、ろう付けして固定するが、すく
い面１１に焼結ダイヤモンド２が設けられており、先端
研磨部１２の斜線部分を研磨する。FIG. 10 shows the structure of a part of a blade of a conventional saw with a diamond diamond. The sintered diamond chip cut and divided in FIG. The portion 7 is fixed by brazing, but the sintered diamond 2 is provided on the rake face 11, and the hatched portion of the tip polishing portion 12 is polished.
【００１８】図１１は、図１０で示した従来のもののＣ
−Ｃ拡大断面図であり、ろう付け部７で台金１に固定さ
れた焼結ダイヤモンド２と、その側面研磨部１３を研磨
して仕上げるが、従来のものは溝が設けられていない。FIG. 11 shows the conventional C shown in FIG.
FIG. 3 is an enlarged cross-sectional view of the sintered diamond 2 fixed to the base metal 1 by the brazing portion 7 and the side polishing portion 13 of the sintered diamond 2, but the conventional one has no groove.
【００１９】[0019]
【発明の効果】本発明は、以上説明したような形態で実
施され、以下に記載されるような効果を奏する。The present invention is embodied in the form described above and has the following effects.
【００２０】本発明は、焼結ダイヤモンドを先端部分に
使用しているので、使用量が少なくて済み、経済的であ
る。In the present invention, since the sintered diamond is used for the tip portion, the amount of use is small, and it is economical.
【００２１】また、本発明の焼結ダイヤモンド付きチッ
プは、先端にげ角と、すくい角を計算した角度で焼結ダ
イヤモンドを切断してあるので、先端部分は研磨する必
要がなく、研磨部分は両側面の、側面にげ角と向心角だ
けだから研磨範囲が狭く、研磨時間も短縮でき、従来の
１０分の１時間位で仕上がるので、作業性も大幅に向上
する。In the tip with a sintered diamond of the present invention, since the sintered diamond is cut at the tip at an angle calculated from the angle of rake and the rake angle, the tip does not need to be polished. The polishing range is narrow and the polishing time can be shortened by only the angle of inclination and the centroid angle on both sides, and the work is completed in about one tenth of the conventional time, so that the workability is greatly improved.
【００２２】さらに、本発明は台金を焼結ダイヤモンド
チップに埋め込んであるので、従来のものより強度が倍
増した。Further, in the present invention, since the base metal is embedded in the sintered diamond chip, the strength is doubled as compared with the conventional one.
【図１】本発明を使用して作成した焼結ダイヤモンド付
きチップソーの、部分拡大側面図である。FIG. 1 is a partially enlarged side view of a tip saw with a sintered diamond prepared using the present invention.
【図２】本発明で使用する素材の斜視図である。FIG. 2 is a perspective view of a material used in the present invention.
【図３】本発明の素材４の分割方法を示した側面図であ
る。FIG. 3 is a side view showing a method of dividing the material 4 according to the present invention.
【図４】本発明の、すくい角９及び先端にげ角１０の詳
細を示した側面図である。FIG. 4 is a side view showing details of a rake angle 9 and a bevel angle 10 at the tip of the present invention.
【図５】本発明の、焼結ダイヤモンド付きチップの上面
図である。FIG. 5 is a top view of a tip with a sintered diamond according to the present invention.
【図６】本発明の、図１の円部Ａの拡大側面図である。FIG. 6 is an enlarged side view of a circle A in FIG. 1 according to the present invention.
【図７】本発明の、図６のＢ−Ｂ拡大断面図である。FIG. 7 is an enlarged sectional view taken along the line BB of FIG. 6 of the present invention.
【図８】本発明の、図６のＣ−Ｃ拡大断面図である。8 is an enlarged cross-sectional view taken along the line CC of FIG. 6 of the present invention.
【図９】従来のものの素材の切断、分割方法を示した平
面図である。FIG. 9 is a plan view showing a conventional method of cutting and dividing a material.
【図１０】従来の焼結ダイヤモンド付きチップソーの一
部の刃の構造を示した側面図である。FIG. 10 is a side view showing the structure of a part of a blade of a conventional tip saw with a sintered diamond.
【図１１】従来のものの図１０のＣ−Ｃ拡大断面図であ
る。FIG. 11 is an enlarged cross-sectional view taken along the line CC of FIG.
Ａ…円部 １…台金 ２…焼結ダイヤモンド ３…超硬合金 ４…素材 ５…カット線 ６…第２カット線 ７…ろう付け部 ８…溝 ９…すくい角 １０…洗端にげ角 １１…すくい面 １２…先端研磨部 １３…側面研磨部 １４…向心角 １５…側面にげ角 １６…中心 A: Circular part 1: Base metal 2 ... Sintered diamond 3 ... Cemented carbide 4 ... Material 5 ... Cut line 6 ... Second cut line 7 ... Brazing part 8 ... Groove 9 ... Rake angle 10 ... Rake angle DESCRIPTION OF SYMBOLS 11 ... Rake surface 12 ... Tip grinding | polishing part 13 ... Side grinding | polishing part 14 ... Centroid angle 15 ... Side angle 16 ... Center
Claims (1)
に設けられた多数の刃は、素材（４）を任意な大きさに
ワイヤーカットして台金（１）の、ろう付け部（７）
に、ろう付けしたものであるが本発明の製造方法は上面
に焼結ダイヤモンド（２）、下面は超硬合金（３）から
なる素材（４）を、すくい角（９）と、先端にげ角（１
０）を計算したカット線（５）により斜めに切断、ワイ
ヤーカットと同時に溝（８）を設けて台金（１）を埋め
込み、その接点の、ろう付け部（７）を、ろう付けして
台金（１）に固定し、仕上げは焼結ダイヤモンドチップ
の両側面のみを研磨して完了することを特徴とする、焼
結ダイヤモンド付きチップ素材の分割と研磨方法。A large number of blades provided on the periphery of a base metal (1) formed in a disk shape cut a material (4) into an arbitrary size by wire cutting the base metal (1). , Brazing part (7)
According to the manufacturing method of the present invention, a material (4) made of sintered diamond (2) on the upper surface and a cemented carbide (3) on the lower surface is raked to the rake angle (9) and the tip is brazed. Corner (1
Cut obliquely along the cut line (5) calculated from 0), cut the wire, and at the same time provide a groove (8) to embed the base metal (1), and braze the brazing part (7) of the contact point. A method of dividing and polishing a chip material with sintered diamond, wherein the method is fixed to a base metal (1) and finishing is performed by polishing only both side surfaces of the sintered diamond chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30231197A JPH1199412A (en) | 1997-09-29 | 1997-09-29 | Dividing and polishing method for chip raw material with sintered diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30231197A JPH1199412A (en) | 1997-09-29 | 1997-09-29 | Dividing and polishing method for chip raw material with sintered diamond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1199412A true JPH1199412A (en) | 1999-04-13 |
Family
ID=17907435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30231197A Pending JPH1199412A (en) | 1997-09-29 | 1997-09-29 | Dividing and polishing method for chip raw material with sintered diamond |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1199412A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106737242A (en) * | 2016-12-20 | 2017-05-31 | 江苏索力德机电科技股份有限公司 | The soldering super hard abrasive emery wheel and preparation method in a kind of energy grinding perpendicular type face |
-
1997
- 1997-09-29 JP JP30231197A patent/JPH1199412A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106737242A (en) * | 2016-12-20 | 2017-05-31 | 江苏索力德机电科技股份有限公司 | The soldering super hard abrasive emery wheel and preparation method in a kind of energy grinding perpendicular type face |
| CN106737242B (en) * | 2016-12-20 | 2018-09-25 | 江苏索力德机电科技股份有限公司 | A kind of the soldering super hard abrasive emery wheel and preparation method in energy grinding perpendicular type face |
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