JPH1187954A - Extension wiring device for board test use - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce high-frequency noise, which is generated in an extension wiring device for board test use, variation in the propagation delay time of the noise and reflected noise and to facilitate and make precise a test for a printed circuit board to be tested, in which a high-speed signal is handled. SOLUTION: This extension wiring device 1 has a board main body, having an extension wiring and front and back side connectors 9 and 7 for extension wiring use provided on the front and back lateral faces, which face each other of the board main body, and the device 1 is connected with a back board 110 of a shelf 105 through the connector 7 and is connected with a printed circuit board 101 to be tested through the connector 9 to enable a test for the operation of the board 101 in a state such that the device 1 is projected from the front surface of the shelf 105. This device 1 is constituted into a structure, wherein chip capacitors 12 which are mounted on the board main body for connecting a power supply layer with a ground layer are provided, the wiring lengths between terminals on the connectors 9 and 7 are made equal also with any one of the wiring lengths between a plurality of signal wirings 11 and moreover for the impedances of the signal wirings 11 are matched with those of the wirings of the board 101.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an extension wiring device for testing a board, and more particularly to an operation test in which a printed circuit board on which a plurality of circuit elements are mounted is projected forward from a shelf for storing and operating them. The present invention relates to an extension wiring device for a board test for performing the following. 2. Description of the Related Art In recent years, in general with respect to electronic devices, as the speed and density of systems increase, the speed and voltage of semiconductor integrated circuit elements, which are main components in electronic devices, have been reduced.

Therefore, in a printed circuit board on which a plurality of circuit elements are mounted, in order to transmit a high-speed signal, setting of timing and measures against noise are important issues.

[0003]

2. Description of the Related Art Under such circumstances, when an operation test of a circuit element mounted on a printed circuit board is performed, a detection element for detecting an operation signal is easily and accurately brought into contact with a signal terminal of the circuit element. Must be electrically connected.
FIG. 5 is a perspective view showing a state where the printed circuit board is stored and mounted on the shelf.

[0004] A shelf 105 in which the printed circuit board 101 is stored has an opening on the front surface, and a backboard connector 106 on the back surface opposite to the opening front surface to provide operation of circuit elements on the printed circuit board 101. For this purpose, a back board 110 capable of being electrically connected to the printed circuit board 101 stored therein is provided. The printed circuit board 101 is inserted into the shelf 105 from the connection connector 108 side provided, and the connection connector 108 is inserted into the backboard connector 106 on the backboard 110 to be electrically connected and stored. Then, the operation of the circuit elements on the printed circuit board 101 is controlled.

At this time, FIG. 5 shows a method of storing one printed circuit board 101 for convenience. However, in practice, the shelf 105 stores a large number of printed circuit boards, and the interval between the stored printed circuit boards is small. In order to perform an operation test of a circuit element mounted on the printed circuit board 101, it is very difficult to easily and accurately contact the signal terminal of the circuit element and electrically connect it while storing the circuit element.

[0006] Therefore, in general, a printed circuit board is tested by using an extension wiring device for board test. FIG. 6 is a diagram illustrating a method of using a conventional extension wiring device for board test for testing a printed circuit board. Conventional extension wiring device for board test 2
Reference numeral 01 denotes a board main body 202 having an extension wiring 211, and a front connector 209 and a rear connector 207 connected to both ends of the extension wiring 211 and provided on opposed front and rear sides of the board main body 202, respectively. It is composed.

[0007] The conventional shelf 105 is mounted and used. Specifically, the shelf 105 is inserted into the shelf 105 having the backboard 110 on the back from the rear connector 207 side, and The printed circuit board 101 to be tested is electrically connected to the front connector 209 by using the connection connector 108, and the printed circuit board 101 to be tested is connected to the back board connector 106 of the connector 110. Shelf 1
05 so as to protrude from the front surface, so that an operation test of a circuit element of the printed circuit board 101 to be tested is enabled.

At this time, the extension wiring device 201 for board test is used.
Is provided with a guide arm 203 for supporting the printed circuit board 101 to be tested during the test, and the printed circuit board 101 to be tested during the test is stably supported.

[0009]

As described above, the operation test of the circuit elements of the printed circuit board 101 to be tested has been performed by using the conventional extension wiring device 201 for a board test. It is sufficient that low-speed signals are handled. In the board test extension wiring device 201, the front connector 209 and the rear connector 2 are connected to the board body 202.
No. 07 was mounted, and no attention was paid to the wiring pattern and the like for the wiring between them.

Accordingly, the wiring pattern between the front connector 209 and the rear connector 207 has a simple pattern shape as shown in FIG. 6, and merely provides an electrical connection for extension. . However,
When the printed circuit board is made to protrude forward from the shelf by using the board test extension wiring device, and the test is performed, the speed of the semiconductor integrated circuit element, which is a main component in the electronic device as described above, is increased. With the use of low-voltage driving, the speed of signals to be handled increases, and the higher the speed of the signal, the higher the problem of high-frequency noise of the power supply generated in the extension wiring device for board testing. I have.

Under the same situation, the propagation delay time varies due to the difference in the length of the connector pins of the subsequent connector and the front connector of the extension wiring device for board test and the length of the wiring in the board body. Problems also arise with respect to the timing of signals and clocks, and their avoidance is still an issue. Furthermore, from the viewpoint of a wiring board,
With the speeding up of signals to be handled, it is necessary to minimize reflection noise due to impedance mismatch of wiring patterns, and therefore, impedance matching of wiring groups is required.

Conventionally, the impedance matching is only devised such that the power supply and the ground are so-called solid inner layers, or the ground pattern is wired in parallel between the signal wiring patterns. Not been. For example, Japanese Patent Laid-Open Publication No. 4-61298 discloses a structure in which the impedance of the wiring pattern of the extension wiring device for board testing is matched to the impedance of the connector. However, the fitting length of the connector is originally short and is derived from the connector. It is considered that a degree of impedance mismatch is not a problem and is acceptable, and the effect of suppressing the reflection noise caused by using the extension wiring device for board test is not sufficient.

Accordingly, an object of the present invention is to provide a novel extension wiring apparatus for testing a board which solves the above-mentioned problems. Another object of the present invention is to provide an extension wiring device for a board test capable of reducing high-frequency noise and variation in propagation delay time generated in the extension wiring device for a board test and reflection noise due to impedance mismatch of a wiring pattern. To provide.

[0014]

According to the first aspect of the present invention,
A substrate main body having an extension wiring composed of a power supply layer, a ground layer, and a signal wiring; and a front connector and a rear side connected to both ends of the extension wiring and provided on opposed front and rear sides of the substrate main body, respectively. A printed circuit board to be tested is connected to the back board, and the printed circuit board under test is connected to the front connector. The circuit board is projected from the front of the shelf,
An extension wiring device for board test that enables an operation test of the printed circuit board under test, wherein a chip capacitor mounted on the board body and connecting between the power supply layer and the ground layer is provided. I do.

According to a second aspect of the present invention, in the extension wiring device for a board test according to the first aspect, the power supply layer comprises a plurality of power supply wiring patterns of different types of power supply, and the power supply layer and the ground layer are connected to each other. It is characterized in that the connection between the chip capacitors is performed by using a plurality of chip capacitors for each power supply wiring pattern having a different type of power supply and by substantially uniformly arranging and mounting the chip capacitors.

According to a third aspect of the present invention, there is provided a substrate body having an extension wiring including a power supply layer, a ground layer, and a signal wiring;
A front connector and a rear connector respectively connected to both ends of the extension wiring and provided on opposed front and rear sides of the board main body. The printed circuit board under test is inserted from the side of the side connector and connected to the back board, the printed circuit board under test is connected to the front connector, and the printed circuit board under test is projected from the front surface of the shelf. In the extension wiring device for board test which enables the operation test of the above, there are a plurality of the signal wirings, the length of the signal wiring pattern is adjusted, and the terminal length from the contact portion of the rear connector to the substrate main body is adjusted. The signal path composed of the terminal length from the contact portion of the front connector to the board body and the length of the signal wiring pattern has the same length in any of the plurality of signal paths. It is characterized in.

According to a fourth aspect of the present invention, there is provided a substrate body having an extension wiring comprising a power supply layer, a ground layer, and a signal wiring;
A front connector and a rear connector respectively connected to both ends of the extension wiring and provided on opposed front and rear sides of the board main body. The printed circuit board under test is inserted from the side of the side connector and connected to the back board, the printed circuit board under test is connected to the front connector, and the printed circuit board under test is projected from the front surface of the shelf. In the extension wiring device for board test which enables the operation test of the above, the impedance of the signal wiring is matched with the impedance of the wiring group of the printed circuit board under test.

According to a fifth aspect of the present invention, in the extension wiring device for board test according to any one of the first and second aspects, there are a plurality of the signal wirings, and the length of the signal wiring pattern is adjusted. The length of a signal path consisting of a terminal length from the contact portion of the rear connector to the board main body, a terminal length from the contact portion of the front connector to the board main body, and a length of the signal wiring pattern is a plural number. And the impedance of the signal wiring is matched to the impedance of the wiring group of the printed circuit board under test.

According to the first aspect of the present invention, the high frequency noise on the power supply layer is efficiently bypassed to the ground layer by the action of the capacitor provided between the power supply layer and the ground layer, and the power supply voltage is affected by the high frequency. Can be reduced. Therefore, the test of the printed circuit board under test, which handles high-speed signals, can be easily and accurately performed without the influence of high-frequency noise.

According to the second aspect of the present invention, high-frequency noise on a plurality of power supply wiring patterns constituting the power supply layer is efficiently bypassed to the ground layer for each power supply wiring pattern of a different type of power supply. It is possible to effectively reduce the influence of the high frequency on the power supply layer constituted by the wiring pattern. Therefore, handling high-speed signals,
The test of the printed circuit board under test can be easily and accurately performed without the influence of high frequency noise.

According to the third aspect of the invention, it is possible to equalize the lengths of the signal paths between the corresponding terminals of the rear connector and the front connector, thereby suppressing variations in signal propagation delay time. . Therefore, a test of a printed circuit board under test, which handles high-speed signals, can be easily and accurately performed without being affected by variations in propagation delay time between parallel signals and block signals.

According to the present invention, the impedance of the signal wiring pattern is matched with the impedance of the wiring group of the printed circuit board under test,
It is possible to efficiently suppress the reflection noise caused by the impedance mismatch. Therefore, it is possible to easily and accurately test a printed circuit board under test, which handles high-speed signals, without being affected by reflection noise caused by impedance mismatch.

According to the fifth aspect of the present invention, the high frequency noise on the power supply layer is efficiently bypassed to the ground layer by the action of the capacitor provided between the power supply layer and the ground layer, so that the power supply voltage is not affected by the high frequency. By reducing the length of the signal path between each terminal and suppressing the variation in the signal propagation delay time, and matching the impedance of the signal wiring pattern with the impedance of the wiring group of the printed circuit board under test, It is possible to efficiently suppress the reflection noise caused by the mismatch of

Therefore, the test of the printed circuit board under test, which handles high-speed signals, is performed without the influence of high-frequency noise, the influence of variation in propagation delay time between the parallel signal and the block signal, and the influence of reflection noise caused by impedance mismatch. In addition, it can be performed easily and accurately.

[0025]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a method of using an extension wiring device for board testing according to an embodiment of the present invention for testing a printed circuit board. The board testing extension wiring device 1 includes a board body 2 having a power supply layer 14 including a plurality of power supply wiring patterns of different types of power supply, an extension wiring including a ground layer 15 serving as a ground wiring, and a plurality of signal wirings 11, It has a front connector 9 and a rear connector 7 which are connected to both ends of the extension wiring and are respectively provided on the front side and the rear side of the board body 2 facing each other. still,
The plurality of power supply layers 14 are respectively provided inside the substrate main body 2, and the ground layer 15 is configured as a solid inner layer. This board testing extension wiring device 1 can be used with the conventional shelf 105 mounted thereon. The rear board 7 is inserted into the shelf 105 having the back board 110 on the back side from the rear connector 7 side, and is inserted into the back board connector 106 of the back board 110 to be electrically connected.

Subsequently, the printed circuit board 101 to be tested is electrically connected to the front connector 9 using the connection connector 108, and the printed circuit board 101 to be tested is projected from the front surface of the shelf 105. An operation test of a circuit element of the circuit board 101 is enabled. At this time, the extension wiring device 1 for board test is provided with the guide arm 3 for supporting the printed circuit board 101 to be tested at the time of testing, and the stability of the printed circuit board 101 to be tested at the time of testing is ensured. I have.

The power supply layer 1 mounted on the substrate body 2 is
A chip capacitor 12 is provided for connecting between the grounding layer 4 and the ground layer 15. With this configuration, high-frequency noise on the power supply layer 14, that is, high-frequency noise on the power supply voltage can be efficiently bypassed to the ground layer 15. As a result, high-frequency noise that reaches the printed circuit board 101 can be reduced or substantially suppressed.

Thus, the test of the printed circuit board 101 can be performed more accurately. FIG. 2 is a plan view of an extension wiring device for board test according to an embodiment of the present invention, and FIG. 3 is an enlarged view of a mounting portion of a chip capacitor of the extension wiring device for board test according to the embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a state in which the chip capacitor 12 is mounted.

In this embodiment, in order to further enhance the high frequency noise bypass effect, the chip capacitor 1
2 is, for example, + 5V, + 12V, -15V, -4
A plurality of power supply wiring patterns 1 having different types of power supply such as 8V
The connection of the chip capacitor 12 between the power supply layer 14 including the power supply layers 4a, 14b, 14c, and 14d and the ground layer 15 is performed by using a plurality of chip capacitors 12 and using different power supply wiring patterns 14a, 14b, 14c, and 14d. In each case, the placement and mounting of the chip capacitors 12 are substantially uniform.

At this time, the connection between the chip capacitor 12 and the power supply layer 14 and the ground layer 15 in the substrate body 2 is made by using the via holes 23-1 and 23-2. Is drawn out onto the substrate main body 2 and is performed on the substrate main body 2, and the connection is unnecessary by providing a clearance 24 to prevent connection.

With the above configuration, the effect of bypassing the high frequency noise of the power supply voltage can be obtained uniformly for each of the power supply wiring patterns 14a, 14b, 14c, 14d. . Further, by adjusting the length of the wiring pattern of the signal wiring 11, the terminal length from the contact portion of the rear connector 7 to the substrate body 2, the terminal length from the contact portion of the front connector 9 to the substrate body 2, and the signal wiring 11 The length of the signal path 27 including the length of the wiring pattern is made equal in any of the plurality of signal paths 27.

The specific configuration will be described in more detail with reference to FIG. FIG. 4 is a diagram illustrating a configuration of a signal wiring portion of a board testing extension wiring device according to an embodiment of the present invention. FIG. 4A is a front view of the board testing extension wiring device according to the embodiment. The chip capacitor is omitted for convenience, and the wiring pattern of the signal wiring provided on the back side is shown by a solid line in the figure. Further, a guide arm for supporting the printed circuit board under test at the time of the test is omitted for convenience. FIG. 4B is an enlarged longitudinal sectional view showing a part of the rear connector 7 (part B in the figure) and a part of the front connector 9 (part A in the figure).

The provided connector lead 25-1 has a length L
1, the connector lead 25-2 has a length L2,
Connector lead 25-3 has a length L1 'and connector lead 25-4 has a length L2'. The differences between the lengths L1 and L2 and L1 'and L2' of the connector leads 25, which are individually referred to, are adjusted by providing a plurality of bent portions 26 in the wiring pattern of the signal wiring 11 on the substrate main body 2, and The length of the signal path 27 obtained by adding the length of the connector leads 25 at both ends to the length is configured to be equal in any of the plurality of signal paths.

In order to reduce the propagation delay caused by the via hole, no via hole is used for wiring between the rear connector 7 and the front connector 9. As a result, a timing difference between the parallel signal and the clock does not occur, so that the printed circuit board 101 can be tested accurately. Further, the width of the wiring pattern of the signal wiring 11, the wiring pattern of the signal wiring 11, and the power supply layer 1
4 or the ground layer 15 and the dielectric constant of the material of the substrate main body 2 are adjusted to form an impedance-matched extended wiring device for a substrate test, and the impedance of the wiring group of the printed circuit board 101 under test is adjusted. To match.

Thus, the extension wiring device 1 for board test
No reflection noise is generated due to the mismatch between the impedance of the printed circuit board 101 and the impedance of the printed circuit board 101, and the test of the printed circuit board 101 can be performed accurately.
The extension wiring device for board test which is an embodiment according to the present invention has the above configuration, thereby enabling a test in a state where the printed circuit board under test is extended and protruded to the front from the shelf, , Reduces high-frequency noise generated in the board test extension wiring device, suppresses variation in propagation delay time, and reduces reflection noise caused by impedance mismatch of the wiring pattern of signal wiring. This makes it easy to test printed circuit boards under test that handle high-speed signals.

Therefore, if a waveform distortion is generated as a result of the test, the cause of the distortion can be considered to be in the printed circuit board under test, and therefore, the cause of the waveform distortion can be quickly searched. Can be.

[0037]

According to the first aspect of the present invention, it is possible to easily and accurately test a printed circuit board under test, which handles high-speed signals, without being affected by high-frequency noise.
According to the invention described in claim 2, the test of the printed circuit board under test, which handles high-speed signals, is performed without the influence of high-frequency noise.
This can be performed easily and accurately.

According to the third aspect of the present invention, a test of a printed circuit board under test, which handles high-speed signals, can be easily and accurately performed without being affected by a variation in propagation delay time between a parallel signal and a clock signal. It becomes possible. According to the fourth aspect of the present invention, it is possible to easily and accurately test a printed circuit board under test, which handles high-speed signals, without being affected by reflected noise caused by impedance mismatch.

According to the fifth aspect of the present invention, the test of the printed circuit board under test, which handles a high-speed signal, is performed under the influence of high-frequency noise, the influence of variation in propagation delay time between a parallel signal and a clock signal, and impedance mismatch. Can be easily and accurately performed without the influence of the reflection noise caused by the above.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a method of using an extension wiring device for board testing according to an embodiment of the present invention for testing a printed circuit board.

FIG. 2 is a plan view of an extension wiring device for board test according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing, on an enlarged scale, a mounting portion of a chip capacitor of an extension wiring device for board testing according to an embodiment of the present invention.

FIG. 4 is a diagram illustrating a configuration of a signal wiring portion of the extension wiring device for board test according to the embodiment of the present invention.

FIG. 5 is a perspective view showing a state where the printed circuit board is stored and mounted on a shelf.

FIG. 6 is a diagram illustrating a method of using a conventional board test extension wiring device for testing a printed circuit board.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 Extension wiring device for board test 2 Board body 3 Guide arm 7 Rear connector 9 Front connector 11 Signal wiring 12 Chip capacitor 14 Power supply layer 14 a, b, c, d Power supply wiring pattern 15 Ground layer 23 Via hole 24 Clearance 25-1 , 25-2, 25-3, 25-4 Connector lead 26 Bend 27 Signal path L1, L1 ', L2, L2' Length of connector lead

Claims (5)

[Claims] 1. A substrate main body having an extension wiring composed of a power supply layer, a ground layer, and a signal wiring, and provided on opposing front and rear sides of the substrate main body connected to both ends of the extension wiring. A shelf having a front connector and a rear connector, is inserted from the rear connector side into a shelf having a backboard on the back side and connected to the backboard, and a printed circuit board to be tested is connected to the front connector. An extension wiring device for board test, wherein the printed circuit board under test is made to protrude from the front of the shelf to enable an operation test of the printed circuit board under test. An extension wiring device for a board test, comprising a chip capacitor for connection with the ground layer. 2. The extension wiring device for board test according to claim 1, wherein the power supply layer is composed of a plurality of power supply wiring patterns of different types of power supply, and the connection between the power supply layer and the ground layer is made by a chip capacitor. Using a plurality of chip capacitors for each power supply wiring pattern of a different type of power supply, and
An extension wiring device for board test, wherein the configuration is such that the placement and mounting of chip capacitors are substantially uniform. 3. A substrate main body having an extension wiring composed of a power supply layer, a ground layer, and a signal wiring, and provided on opposing front and rear sides of the substrate main body connected to both ends of the extension wiring. A front connector and a rear connector, and a shelf having a backboard on the back is inserted from the side of the rear connector and connected to the backboard, and a printed circuit board under test is connected to the front connector. An extension wiring device for board test, wherein the printed circuit board under test is projected from the front surface of the shelf to enable an operation test of the printed circuit board under test; By adjusting the length, the terminal length from the contact portion of the rear connector to the board body, the terminal length from the contact portion of the front connector to the board body, and the signal wiring pattern The length of the signal path consists of a length, extension wiring device substrate test, characterized in that it also equal configuration in both of the plurality of signal paths. 4. A substrate main body having an extension wiring composed of a power supply layer, a ground layer, and a signal wiring, and provided on opposite front sides and rear sides of the substrate main body connected to both ends of the extension wiring. A front connector and a rear connector, and a shelf having a backboard on the back is inserted from the side of the rear connector and connected to the backboard, and a printed circuit board under test is connected to the front connector. An extension wiring apparatus for testing the printed circuit board under test, wherein the printed circuit board under test is projected from the front surface of the shelf to enable an operation test of the printed circuit board under test; An extended wiring device for testing a substrate, wherein the impedance is matched to the impedance of a wiring group of the substrate. 5. The extension wiring device for board test according to claim 1, wherein a plurality of the signal wirings are provided, and a length of the signal wiring pattern is adjusted so as to adjust the length of the rear connector. In any of the plurality of signal paths, the length of a signal path including a terminal length from a contact portion to the substrate main body, a terminal length from a contact portion of the front connector to the substrate main body, and a length of the signal wiring pattern is set. And an impedance of said signal wiring is matched with an impedance of a wiring group of said printed circuit board under test.