JPH1187378A - Device and method for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of breakings and cracks of a semiconductor element, while obviating the generation of smears, hollowed sections, voids and unfilling as defectives on a semiconductor device after resin seal. SOLUTION: Whether a position of the lower end of a scale fixed onto a bottom force 2 is positioned at a section upper than or a section lower than a specified place is detected, the lowering speed of the bottom force 2 is changed on the basis of the detected result, and the load on the semiconductor device at a time when the semiconductor device is released from a top force 1 and the bottom force 2 is made light. The load at the time of release is detected by load cells 24a, 24b, and a warning is conducted by an alarm, etc., when the detecting value exceeds a fixed value or greater.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device using a resin mold having an upper mold and a lower mold that can be opened and closed. The present invention relates to a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method.

[0002]

2. Description of the Related Art At present, with the increasing importance of semiconductor devices,
It is desired to manufacture semiconductor devices quickly and accurately. Therefore, in order to manufacture a semiconductor device accurately and quickly, a method of executing resin encapsulation at the time of manufacturing a semiconductor device by using a resin sealing mold is often used.

Here, the configuration of a resin sealing mold used in a conventional semiconductor device manufacturing apparatus or a semiconductor device manufacturing method will be described with reference to FIG. FIG. 10 shows a cross-sectional view of a resin mold used in a conventional semiconductor device manufacturing apparatus.

As shown in FIG. 10, a resin mold for a semiconductor device manufacturing apparatus according to the prior art comprises an upper mold 1 and a lower mold 2 which can be opened and closed with each other. The upper mold 1 includes an upper cavity 3 which is a resin sealing portion when performing resin sealing on the semiconductor device;
A cull 4 as a resin flow path is provided. The upper cavity 3 and the cull 4 are formed with holes at appropriate positions, and the upper ejector pins 5 are inserted into the holes.
The upper ejector pin 5 is attached to an upper ejector plate 6.

The upper ejector plate 6 is supported by bolts (not shown) with respect to the upper die 1, but can move downward. Above the upper ejector plate 6, an upper knockout plate 7 is fixed to the upper ejector plate 6 by a bolt (not shown).

A plurality of springs 8a are mounted between the upper ejector plate 6 and the upper die 1. A hole is formed in an appropriate position of the upper mold 1, and an upper return pin 9 is inserted into this hole so as to protrude from a contact surface between the upper mold 1 and the lower mold 2. The upper return pin 9 is attached to the upper ejector plate 6.

On the other hand, the lower mold 2 has a lower cavity 10, a pot 11 as a resin charging section, and a runner 1 as a resin flow path.
2 are provided. The lower cavity 10 is provided at a position of the lower die 2 corresponding to the upper cavity 3 of the upper die 1. The pot 11 is provided at the position of the lower die 2 corresponding to the cull 4 of the upper die 1. As in the upper die 1, a hole is formed in the lower cavity 10 and the runner 12, and a lower ejector pin 13 is inserted into the hole.

The lower ejector pin 13 is attached to a lower ejector plate 14. The lower ejector plate 14 is fixed to the lower knockout plate 15 by bolts (not shown).

The lower knockout plate 15 is supported by the lower mold 2 by bolts (not shown), but can move upward. Lower ejector plate 14 and lower mold 2
Between them, a plurality of springs 8b are attached. Further, similarly to the upper mold 1, the lower return pin 16 is attached to the lower mold 2.

The lower ejector plate 14 is pushed up by the force of the spring 8b.
Unlike the upper return pin 9 attached to the upper mold 1,
In the mold open state as shown in FIG. 10, the lower return pin 16 does not protrude from the contact surface between the lower mold 2 and the upper mold 1.

It is the role of the lower return pin 16 to assist the pressing force of the spring 8b when the lower ejector plate 14 is pushed up. The above is the configuration of the resin sealing mold in the conventional technology.

Next, the operation of manufacturing a semiconductor device using the conventional resin-sealed mold shown in FIG. 10 will be described with reference to FIGS.

FIG. 11 shows a state of a resin-sealing mold in which the lead frame 17 and the resin 18 are supplied to the lower mold 2.

After the lead frame 17 and the resin 18 are supplied to the lower mold 2 as shown in FIG. 11 by transport means (not shown), the upper mold 1 and the lower mold 2 are moved by the raising operation of the lower mold 2. The so-called mold clamping for contacting

In the mold clamping operation, when the clearance between the upper mold 1 and the lower mold 2 becomes about 2 to 5 mm, a change occurs in which the rising speed of the lower mold 2 is switched from a high speed to a low speed. The point at which this change occurs is called a shift point.

In the conventional method of manufacturing a semiconductor device, the reason why the above-described shift point is provided to change the rising speed of the lower mold 2 is to reduce the impact between the upper mold 1 and the lower mold 2 during mold clamping. That's why.

In general, the lower speed of the lower mold 2 is as follows:
30 to 50 mm / s, and the low ascending speed is 1 to 5
mm / s.

The shift point will be described with reference to FIGS. 17 and 18, which are schematic views of the entire conventional semiconductor device manufacturing apparatus.

FIGS. 17 and 18 are general schematic views of a conventional semiconductor device manufacturing apparatus. As shown in FIG. 17, this conventional semiconductor device manufacturing apparatus includes an upper press 19a to which an upper die 1 is fixed, a lower press 19b to which a lower die 2 is fixed, an upper die 1 and a lower die 2 And a knockout rod 23 for pushing up the lower knockout plate of the lower mold 2
And a scale 20 fixed to the lower press 19b to which the lower mold 2 is fixed, and a transmission sensor 21 for detecting whether or not the lower end of the scale 20 has passed.

The apparatus for manufacturing a semiconductor device in the state shown in FIG. 17 shows a state in which the lower end of the scale 20 rises with the rise of the lower mold 2 and the rising speed is low.
The semiconductor device manufacturing apparatus shown in FIG.
However, this shows a state where the upper mold 1 is sufficiently separated from the upper mold 1 and the lower end of the scale 20 is located below the transmission sensor 21 and the ascending speed is high.

As shown in FIGS. 17 and 18, the shift point can be set by the positional relationship between the scale 20 attached to the lower press 19b on which the resin sealing mold is mounted and the transmission sensor 21.

The light blocking state of the transmission sensor 21 by the scale 20 is set to an OFF state, and the light passing state of the transmission sensor 21 is set to an ON state. Therefore, the scale 20 passes through the transmission sensor 21 at the position where the lower mold 2 has risen to the shift point, and is turned ON.
State.

Based on the ON state signal, the conventional semiconductor device manufacturing apparatus changes the rising speed of the lower mold 2 to
The mold closing speed has been changed.

For example, when the driving device for raising the lower mold 2 is a hydraulic press, the mold clamping speed is reduced by decreasing the flow rate of oil discharged from the pump.
In the case of an electric press such as a servomotor, the mold clamping speed is reduced by reducing the motor rotation speed.

Next, a state in which the upper mold and the lower mold are in close contact with each other and the mold is clamped in a conventional semiconductor device manufacturing apparatus will be described with reference to FIG.

FIG. 12 is a sectional view of a resin mold used in a conventional semiconductor device manufacturing apparatus. As shown in FIG. 12, at the time of mold clamping, the upper return pin 9 attached to the upper mold 1 rises due to the mold clamping force.

As the upper return pin 9 rises, the upper ejector plate 6 to which the upper return pin 9 is fixed
Also rises. At this time, the spring 8a attached to the upper die 1 is compressed and bent.

On the other hand, as described above, the lower return pin 16 of the lower mold 2 is pushed up by the mold clamping force only when it protrudes from the contact surface between the upper mold 1 and the lower mold 2. Further, as the lower return pin 16 is lowered, the lower ejector plate 14 is also lowered.

After a predetermined time has elapsed from the mold clamping state shown in FIG. 12, the resin 18 in the pot 11 is in a softened state suitable for resin sealing. When the resin 18 is in a softened state, the injection operation of the resin 18 starts. The injection operation means that the softened resin is melted and brought into a fluid state by raising the plunger 22 while maintaining a predetermined pressure.

FIG. 13 shows a state in which the plunger 22 is being raised. As shown in FIG. 13, the resin 18 in a molten and flowing state flows into the lower cavity 10 from the cull 4 via the runner 12.

Next, FIG. 14 shows the resin sealing mold in a state where the resin has flowed into the upper cavity 3 and the lower cavity 10.

This state is an injection completed state, in which the plunger 22 is stopped at a predetermined position while maintaining a predetermined pressure.

The state shown in FIG.
Is maintained until the resin in the lower cavity 4 is sufficiently cured.

Next, from the state shown in FIG. 14, after the resin is sufficiently cured, the lower mold 2 is moved down to open the mold.

FIG. 15 shows a resin-sealing mold in a state where the semiconductor production after resin-sealing from the upper cavity 3 is released by opening the mold.

When the mold is opened, the spring 8a is released from the force pushing up the upper return pin 9 and contracts, whereby the upper ejector plate 6 is pushed down.

By the lowering operation of the upper ejector plate 6, the upper ejector pin 5 attached to the upper ejector plate 6 also moves down. When the upper ejector pins 5 descend, the upper ejector pins 5 protrude into the upper cavity 3, and the semiconductor device after resin sealing is released from the upper cavity 3.

Next, an operation of releasing the semiconductor device after resin sealing from the lower mold 2 will be described with reference to FIG. FIG. 16 shows a cross-sectional view of a resin sealing mold included in a conventional semiconductor device manufacturing apparatus.

As shown in FIG. 16, when the semiconductor device after resin sealing is released from the lower mold 2, the knockout rod 23 rises with respect to the lower knockout plate 15, so that the lower knockout plate 15 is lifted. Is pushed up.

However, there is a case where the position of the knockout rod 23 is a fixed position and the lower die 2 is lowered with respect to the knockout rod 23.

In any case, the lower knockout plate 15 is pushed up by the knockout rod 23 as shown in FIG. As the lower knockout plate 15 rises, the lower ejector plate 14 rises, and the lower ejector pin 13 attached to the lower ejector plate 14 also rises. By raising the lower ejector pin 13, the semiconductor device after resin sealing is released from the lower mold 2 as shown in FIG.

Next, the timing of the above operation will be described.
This will be described with reference to FIG. FIG. 19 shows a timing chart of the above operation.

In FIG. 19, the horizontal axis indicates elapsed time,
The vertical axis of the press operation indicates the position of the lower die 2, the vertical axis of the injection operation indicates the filling ratio, and the vertical axis of the knockout operation indicates the position of the knockout plate.

Therefore, if the semiconductor device manufacturing apparatus shown in FIG. 10 or the semiconductor device manufacturing method using this apparatus is used, the semiconductor device can be manufactured quickly and accurately.

[0045]

However, in the above-described prior art, although the ascent speed of the lower mold at the time of mold clamping is controlled, an appropriate value for the mold opening speed is verified. As for the speed of mold opening, the emphasis is on production capacity, so the mold opening is performed as fast as possible, and the semiconductor Although the device has been released from the mold, as described above, when the mold is opened at an arbitrary high speed, the thickness of the semiconductor device is progressing at present. The load applied to the semiconductor device causes a phenomenon that a semiconductor element included in the semiconductor device is broken or cracked, which causes a problem that a failure of the semiconductor device occurs.

In addition, when the semiconductor device is released from the lower mold, the lower knockout plate has been lifted at the fastest possible speed because the proper value has not been verified for the speed at which the lower knockout plate is raised. . Although the semiconductor device after resin sealing is released from the lower mold of the resin sealing mold by this knockout operation, when the mold is opened at an arbitrarily high speed, the semiconductor device is becoming thinner at present. In this case, there is a problem that a load applied to the semiconductor device at the time of mold release causes a phenomenon that a semiconductor element is cracked or cracked, thereby causing a failure of the semiconductor device.

Furthermore, in the conventional method for manufacturing a semiconductor device and the apparatus for manufacturing a semiconductor device, in order to achieve high reliability of the manufactured semiconductor device, the adhesion to a semiconductor element or a lead frame is improved. Although the use of resin has been adopted, since the adhesive strength between the resin and the resin sealing mold also increases, there is a problem that the resin is easily adhered to the resin sealing mold and dirt is easily generated. ing.

As described above, when the adhesion of the resin to the resin-sealing mold and the dirt progress, the dirt is transferred or scoured on the surface of the resin-sealed semiconductor device. Further, the resin easily adheres to the air vent for bleeding air in the cavity, which is a resin sealing portion, and voids and unfilled portions are generated. There is a problem that it occurs frequently.

The present invention has been made in view of the above circumstances, and prevents a semiconductor element from being cracked or cracked, and has a dirt, scour, void, or the like which is a defect in appearance of a semiconductor device after resin sealing. An object of the present invention is to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of preventing unfilling from occurring.

[0050]

According to the first aspect of the present invention,
In a semiconductor device manufacturing apparatus having a resin-sealed mold having an upper mold and a lower mold that can be opened and closed with each other, one end is fixed to the lower mold, and the other end is moved up and down as the lower mold is moved up and down. And a detecting means for detecting whether the other end of the scale is located above or below a predetermined position, and based on the detection of the detecting means, However, if it is detected that it is located at the predetermined position or more, the lower speed of the lower mold is set to a predetermined first speed or less, based on the detection of the detection means, the other end, When it is detected that the lower die is located below the predetermined position, the lowering speed of the lower mold is set to a predetermined second speed which is higher than the first speed. .

Therefore, according to the present invention, when the lower mold descends after the resin sealing is performed, the lower mold descends at the first speed until the lower mold reaches a certain descending position. After passing through a certain descending position, since the semiconductor device descends at a second speed higher than the first speed, the semiconductor device in which the resin is hardened is released from the upper mold and the lower mold. Since the load on the semiconductor device can be controlled, the semiconductor element included in the semiconductor device can be prevented from cracking and cracking.

According to a second aspect of the present invention, in the first aspect, the predetermined first speed is 1.0 mm / sec.

Therefore, according to the present invention, the operation of the first aspect can be obtained, and the predetermined first speed is
Since the speed is 1.0 mm / sec, the load on the semiconductor device can be sufficiently reduced, and cracking and cracking of the semiconductor element included in the semiconductor device can be further prevented.

According to a third aspect of the present invention, in the first or second aspect of the invention, the upper mold includes at least one or more upper cavities in which a resin is sealed, and a cull as an inflow path of the resin. At least one or more first upper ejector pins penetrating the upper cavity, and at least one or more second upper ejector pins penetrating the cull;
An upper ejector plate that is supported by the upper mold and has the first upper ejector pin and the second upper ejector pin attached thereto, an upper knockout plate to which the upper ejector plate is fixed, and an upper ejector plate. A surface where the upper ejector plate is not in contact with the upper knockout plate, at least one or more first springs sandwiched between the upper mold and the first upper ejector pin and a second upper ejector A pin, and first detection means formed between the upper knockout plate and detecting a load when the resin separates from the upper mold, wherein the lower mold has at least one or more resin in which the resin is sealed. A lower cavity, a pot which is a charging portion of the resin to be sealed in the lower cavity, A plunger for charging a resin, at least one or more lower ejector pins penetrating into the lower cavity, a lower ejector plate supported by the lower mold and having the lower ejector pins attached thereto, and the lower ejector plate A fixed lower knockout plate, a surface of the lower ejector plate where the lower ejector plate is not in contact with the lower knockout plate, and at least one or more second springs sandwiched between the upper die and A second detection unit formed between the lower ejector pin and the lower knockout plate, the second detection unit detecting a load when the resin separates from the lower mold, and is detected by the first detection unit. When the load when the resin separates from the upper mold is a specified value or more A first warning unit for giving a warning, and a second warning unit for giving a warning when the load when the resin separates from the lower mold detected by the second detection unit is equal to or more than a predetermined value. It is characterized by having.

Therefore, according to the present invention, the operation of the invention described in claim 1 or 2 can be obtained, and the resin can be put into the plunger from the pot, so that the cull can be put into the upper cavity and the lower cavity. The semiconductor device formed by flowing the resin is opened by opening the upper mold and the lower mold, and the first upper ejector pin, the second upper ejector pin, and the lower ejector pin are fixed to the upper ejector plate and the upper ejector plate. When the upper knockout plate is separated from the lower ejector plate and the lower knockout plate fixed thereto by the first spring and the second spring, the first detection means Detecting the load of the semiconductor device when the mold is released from the upper mold, the first warning means issues a warning based on the detection result,
Detecting means detects the load on the semiconductor device when the mold is released from the lower mold, and the second warning means gives a warning based on the detection result. It is possible to prevent the occurrence of defective dirt, scouring, voids and unfilling.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the first warning means is constituted by an alarm or an optical display device.

Therefore, according to the present invention, the effect of the third aspect of the present invention can be obtained, and the first warning means is constituted by an alarm or an optical display device. Alternatively, it can be confirmed visually and accurately, and the occurrence of dirt, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

According to a fifth aspect of the present invention, in the third or fourth aspect, the second warning means is constituted by an alarm or an optical display device.

Therefore, according to the present invention, the effect of the invention described in claim 3 or 4 can be obtained, and the second warning means is constituted by an alarm or an optical display device. Can be accurately confirmed by hearing or visual observation, and the occurrence of contamination, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

According to a sixth aspect of the present invention, there is provided an apparatus for manufacturing a semiconductor device having a resin-sealing mold having an upper mold and a lower mold which can be opened and closed with respect to each other. The above upper cavity, a cull as an inflow path of the resin, at least one or more first upper ejector pins penetrating the upper cavity, and at least one or more second upper ejector pins penetrating the cull,
An upper ejector plate that is supported by the upper mold and has the first upper ejector pin and the second upper ejector pin attached thereto, an upper knockout plate to which the upper ejector plate is fixed, and an upper ejector plate. A surface where the upper ejector plate is not in contact with the upper knockout plate, at least one or more first springs sandwiched between the upper mold and the first upper ejector pin and a second upper ejector A pin, and first detection means formed between the upper knockout plate and detecting a load when the resin separates from the upper mold, wherein the lower mold has at least one or more resin in which the resin is sealed. A lower cavity, a pot which is a charging portion of the resin to be sealed in the lower cavity, A plunger for charging a resin, at least one or more lower ejector pins penetrating into the lower cavity, a lower ejector plate supported by the lower mold and having the lower ejector pins attached thereto, and the lower ejector plate A fixed lower knockout plate, a surface of the lower ejector plate where the lower ejector plate is not in contact with the lower knockout plate, and at least one or more second springs sandwiched between the upper die and A second detection unit formed between the lower ejector pin and the lower knockout plate, the second detection unit detecting a load when the resin separates from the lower mold, and is detected by the first detection unit. When the load when the resin separates from the upper mold is a specified value or more A first warning unit for giving a warning, and a second warning unit for giving a warning when the load when the resin separates from the lower mold detected by the second detection unit is equal to or more than a predetermined value. It is characterized by having.

Therefore, according to the present invention, the resin is injected from the pot into the plunger, so that the cull is formed by flowing the resin into the upper cavity and the lower cavity. The mold is opened, and the first upper ejector pin, the second upper ejector pin, and the lower ejector pin are fixed to the upper ejector plate and the upper knockout plate fixed thereto, and the lower ejector plate and the lower ejector plate. When the mold is released via the first spring and the second spring when the lower knockout plate is separated, the first detecting means includes:
The load of the semiconductor device at the time of releasing from the upper mold is detected, the first warning means issues a warning based on the detection result, and the second detecting means at the time of releasing the semiconductor device from the lower mold. Since the load of the device is detected and the second warning means gives a warning based on the detection result, the occurrence of dirt, scouring, voids, and unfilling, which are defects in the appearance of the semiconductor device after resin sealing, can be anticipated. Can be prevented.

The invention according to claim 7 is characterized in that, in the invention according to claim 6, the first warning means is constituted by an alarm or an optical display device.

Therefore, according to the present invention, the effect of the invention described in claim 6 can be obtained, and the first warning means is constituted by an alarm or an optical display device. Alternatively, it can be confirmed visually and accurately, and the occurrence of dirt, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

The invention according to claim 8 is characterized in that, in the invention according to claim 6 or 7, the second warning means is constituted by an alarm or an optical display device.

Therefore, according to the present invention, the operation of the invention described in claim 6 or 7 can be obtained, and the second warning means is constituted by an alarm or an optical display device. Can be accurately confirmed by hearing or visual observation, and the occurrence of contamination, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

According to a ninth aspect of the present invention, in a method of manufacturing a semiconductor device using a resin-sealing mold having an upper mold and a lower mold that can be opened and closed with respect to each other, the method comprises the steps of: One end is fixed to the lower mold, and the other end of the scale, the other end of which rises and descends with the upward and downward movement of the lower mold, is located above a predetermined position or is located below. When the other end is detected to be located at the predetermined position or more based on the detection step of detecting and the detection in the detection step, the lowering speed of the lower mold is set to a predetermined first speed or less. Set, based on the detection in the detection step, if the other end is detected to be located below the predetermined position, the lowering speed of the lower mold,
A speed setting step of setting the speed to a predetermined second speed that is equal to or higher than the first speed.

Therefore, according to the present invention, when the lower mold descends after the resin sealing is performed, the lower mold descends at the first speed until the lower mold reaches a certain descending position. After passing through a certain descending position, since the semiconductor device descends at a second speed higher than the first speed, the semiconductor device in which the resin is hardened is released from the upper mold and the lower mold. Since the load on the semiconductor device can be controlled, the semiconductor element included in the semiconductor device can be prevented from cracking and cracking.

According to a tenth aspect of the present invention, in the ninth aspect, the predetermined first speed is 1.0 mm / mm.
Seconds.

Therefore, according to the present invention, the operation of the ninth aspect can be obtained, and the predetermined first speed is
Since the speed is 1.0 mm / sec, the load on the semiconductor device can be sufficiently reduced, and cracking and cracking of the semiconductor element included in the semiconductor device can be further prevented.

The eleventh aspect of the present invention provides the ninth or the first aspect.
0, wherein the upper die has at least one or more upper cavities in which resin is sealed, a cull as an inflow path of the resin, and at least one or more first upper ejectors penetrating the upper cavities. A pin, at least one or more second upper ejector pins penetrating the cull, an upper ejector plate supported by the upper die, and having the first upper ejector pin and the second upper ejector pin attached thereto, An upper knockout plate to which an upper ejector plate is fixed, at least one or more first knockout plates sandwiched between the upper ejector plate and a surface of the upper ejector plate where the upper ejector plate is not in contact with the upper knockout plate; And at least one of the lower molds, in which a resin is sealed. The lower cavity, a pot that is a charging portion of the resin to be filled in the lower cavity, a plunger for charging the resin in the pot, at least one or more lower ejector pins penetrating the lower cavity, A lower ejector plate supported by a lower mold and to which the lower ejector pin is attached, a lower knockout plate to which the lower ejector plate is fixed, and the lower ejector plate in the lower ejector plate is in contact with the lower knockout plate. A first spring and a second spring interposed between the upper die and the first upper ejector pin, the second upper ejector pin, and the upper knockout plate. The first detecting means formed between the first A first detecting step of detecting a load when the resin separates from the lower mold, and a second detecting means formed between the lower ejector pin and the lower knockout plate, the load when the resin separates from the lower mold. A second detecting step of detecting
A warning is issued when the load when the resin is separated from the upper mold detected in the detecting step of the above is equal to or more than a predetermined value.
And a second warning step for giving a warning when the load when the resin separates from the lower mold detected in the second detection step is equal to or more than a predetermined value. I do.

Therefore, according to the present invention, the operation of the ninth or tenth aspect can be obtained, and the resin can be put into the plunger from the pot, so that the cull can be put into the upper cavity and the lower cavity. The semiconductor device formed by flowing the resin is opened by opening the upper mold and the lower mold, and the first upper ejector pin, the second upper ejector pin, and the lower ejector pin are fixed to the upper ejector plate and the upper ejector plate. When the upper knockout plate and the lower ejector plate and the lower knockout plate fixed thereto are separated from each other and released from the first spring and the second spring, in the first detection step, Detecting the load of the semiconductor device when the mold is released from the upper mold, and issuing a warning in a first warning step based on the detection result; In the detection step, the load on the semiconductor device when the mold is released from the lower mold is detected, and a warning is issued in the second warning step based on the detection result. Dirt, scouring,
The occurrence of voids and unfilling can be prevented.

According to a twelfth aspect of the present invention, in the eleventh aspect, the first warning step is performed by an alarm or an optical display device.

Therefore, according to the present invention, the effect of the invention described in claim 11 can be obtained, and the first warning step is performed by an alarm or an optical display device. Alternatively, it can be confirmed visually and accurately, and the occurrence of dirt, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

According to a thirteenth aspect, in the eleventh or twelfth aspect, the second warning step is performed by an alarm or an optical display device.

Therefore, according to the present invention, the operation of the invention described in claim 11 or 12 can be obtained, and the second warning step is performed by an alarm or an optical display device. Can be accurately confirmed by hearing or visual observation, and the occurrence of contamination, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

According to a fourteenth aspect of the present invention, in a method of manufacturing a semiconductor device using a resin-sealing mold having an upper mold and a lower mold that can be opened and closed with respect to each other, the upper mold is made of a resin. At least one or more upper cavities in which is filled, a cull as an inflow path of the resin, at least one or more first upper ejector pins penetrating the upper cavity, and at least one or more second piercing pins penetrating the cull. An upper ejector pin, an upper ejector plate supported by the upper mold, to which the first upper ejector pin and the second upper ejector pin are attached, and an upper knockout plate to which the upper ejector plate is fixed; The upper ejector plate in the upper ejector plate is not in contact with the upper knockout plate. A surface, and at least one or more first springs sandwiched between the upper mold, wherein the lower mold encloses at least one or more lower cavities in which resin is encapsulated and the lower cavity. A pot serving as a resin charging unit, a plunger for charging the resin in the pot, and at least one plunger penetrating the lower cavity.
The lower ejector pin, the lower ejector plate supported by the lower mold and having the lower ejector pin attached thereto, the lower knockout plate to which the lower ejector plate is fixed, and the lower ejector plate in the lower ejector plate Has a surface not in contact with the lower knockout plate, and at least one or more second springs sandwiched between the upper die and the first upper ejector pin and the second upper ejector pin. A first detection step formed between the upper knockout plate and the upper knockout plate to detect a load when the resin is separated from the upper mold, and a first detection step between the lower ejector pin and the lower knockout plate. The resin is separated from the lower mold by the second detecting means formed in A second detection step of detecting a load at the time of the first step, and a first warning for issuing a warning when the load when the resin is separated from the upper mold detected by the first detection step is equal to or more than a predetermined value. And a second warning step of giving a warning when the load when the resin separates from the lower mold detected in the second detection step is equal to or more than a predetermined value.

Therefore, according to the present invention, the resin is injected into the plunger from the pot, so that the cull is formed by flowing the resin into the upper cavity and the lower cavity. The mold is opened, and the first upper ejector pin, the second upper ejector pin, and the lower ejector pin are fixed to the upper ejector plate and the upper knockout plate fixed thereto, and the lower ejector plate and the lower ejector plate. When the mold is released via the first spring and the second spring when the lower knockout plate is separated, the load of the semiconductor device when the mold is released from the upper mold is detected in the first detection step. Then, based on this detection result, a warning is issued in a first warning step, and in the second detection step, the semiconductor device when releasing from the lower mold is released. Since the load is detected and a warning is issued in the second warning step based on the detection result, the occurrence of dirt, scouring, voids, and unfilling, which are defective in the appearance of the semiconductor device after resin sealing, is prevented. can do.

A fifteenth aspect of the present invention is characterized in that, in the fourteenth aspect of the present invention, the first warning step is performed by an alarm or an optical display device.

Therefore, according to the present invention, the effect of the invention described in claim 14 is obtained, and the first warning step is performed by an alarm or an optical display device. Or, it can be accurately confirmed visually, and the occurrence of dirt, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

The invention according to claim 16 is characterized in that, in the invention according to claim 14 or 15, the second warning step is performed by an alarm or an optical display device.

Therefore, according to the present invention, the operation of the invention described in claim 14 or 15 can be obtained, and the second warning step is performed by an alarm or an optical display device. Can be accurately confirmed by hearing or visual observation, and the occurrence of contamination, scouring, voids, and unfilling, which are defects in appearance of the semiconductor device after resin sealing, can be further prevented.

Therefore, the operation of the semiconductor device manufacturing apparatus and the semiconductor device manufacturing method according to the present invention will be further described. The semiconductor device can be manufactured by reducing the load caused by mold opening after resin sealing of the semiconductor device. The impact force to the included semiconductor element can be reduced.

In particular, by setting the mold opening speed to 1 mm / sec or less, it becomes possible to prevent the semiconductor element from cracking or cracking when the mold is opened.

Further, when the semiconductor device after resin sealing is released from the lower mold of the resin-sealing mold, the lifting speed of the ejector pins is set to 1.0 mm / sec or less, thereby releasing the semiconductor device from the lower mold. It is possible to prevent the semiconductor element from cracking or cracking at the time.

Further, by measuring and monitoring the release load at the time of opening the mold and warning the result, it is possible to know the deterioration of the release state. Further, since the maintenance of the resin sealing device and the cleaning of the resin sealing mold can be performed before the release state deteriorates, a problem in appearance of the semiconductor device can be prevented.

[0086]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method according to the present invention will now be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view of a semiconductor device manufacturing apparatus according to the present invention and a resin mold used in an embodiment of the semiconductor device manufacturing method according to the present invention. However, the same members as those of the resin sealing mold used in the conventional semiconductor device manufacturing apparatus shown in FIG.

The configuration of the resin sealing mold shown in FIG. 1 is different from the conventional resin sealing mold shown in FIG. 10 in that the upper and lower surfaces of the upper ejector pin 5 shown in FIG. The point is that the load cells 24a and 24b are attached so as to be in contact with the knockout plate 7 and between the lower ejector pin 13 and the lower ejector plate 14, respectively. Other points are
The same is true.

The state of the resin sealing mold shown in FIG. 1 shows a state in which the resin 18 and the lead frame 17 are transported by a transport mechanism (not shown) and are set at the positions shown in FIG. .

The load cell 24a attached to the upper surface of the upper ejector pin 5 senses the reaction force of the upper ejector pin 5 pushing the semiconductor device after resin sealing when the mold is opened, and uses this reaction force as an electric signal. Output.

Similarly, the load cell 24b attached to the lower surface of the lower ejector pin 13 senses a reaction force of the lower ejector pin 13 pushing out the semiconductor device after resin sealing when the mold is opened, and detects this reaction force. Output as an electric signal.

The electric signal output from each of the load cells 24a and 24b is input to a warning unit (not shown) to execute a warning operation. As this warning means, for example, a known warning means such as an alarm stimulating auditory sense, an optical display device such as a light emitting lamp, a light emitting diode or the like which stimulates visual perception can be used. It may be something.

Next, FIG. 2 is a cross-sectional view of the resin-sealing mold after the upper mold 1 and the lower mold 2 have been brought into contact with each other to perform mold clamping and fill the respective cavities with the resin. . This resin filling operation is the same as the conventional resin filling operation described with reference to FIG.

Next, in FIG. 3, after the resin filled in each cavity is sufficiently cured, the lower mold 2 is lowered,
The state of the resin sealing mold when the semiconductor device in which the resin is cured from the upper mold 1 is released is shown.

FIG. 4 shows a state of the resin sealing mold when the semiconductor device is released from the lower die 2 after the semiconductor device is released from the upper die 1. As shown in FIG.
When the semiconductor device is released from the mold, the knockout rod 23 pushes up the lower knockout plate 15.

The operation of releasing the semiconductor device shown in FIGS. 3 and 4 from the upper die 1 and the lower die 2 is to release the semiconductor device from the conventional resin mold. The operation is substantially the same as that of the lower die 2 in the present invention.
This is different from the prior art in that no warning is issued based on the lowering speed of the semiconductor device and the load at the time of releasing the semiconductor device.

First, regarding the lowering speed of the lower mold 2 described above,
This will be described with reference to FIGS. 6, 7, and 8. FIG. FIGS. 6, 7 and 8 are schematic views showing an entire embodiment of a semiconductor device manufacturing apparatus provided with the resin sealing mold shown in FIG. 1 according to the present invention.

FIG. 6, FIG. 7, and FIG. 8 are general schematic views of a semiconductor device manufacturing apparatus provided with the resin-sealed mold shown in FIG. 1, respectively. FIG. 7 shows an overall schematic view of a semiconductor device manufacturing apparatus in a state where the mold 2 is in contact with and the resin is sealed, and FIG. 7 is a view immediately before or after the upper mold 1 and the lower mold 2 are in contact with each other. (However, scale 2
The lower end of 0 is located above the transmission sensor 21a. 8) shows an overall schematic diagram of the semiconductor device manufacturing apparatus in a state shown in FIG. 8; FIG. 8 shows a state in which the upper mold 1 and the lower mold 2 are sufficiently separated, and the lower end of the scale 20 is located below the transmission sensor 21a. 1 is an overall schematic diagram of a semiconductor device manufacturing apparatus.

As shown in FIG. 6, the apparatus for manufacturing a semiconductor device pushes up an upper press 19a for fixing the upper mold 1, a lower press 19b for fixing the lower mold 2, and a lower knockout plate of the lower mold 2. Knockout rod 23 for
And the scale 20 which goes up and down as the lower mold 2 goes up and down
And a transmission sensor 21a for detecting whether the lower end of the scale 20 is above or below a predetermined position.

As shown in FIG. 6, when the resin is sealed in a resin-sealing mold and the resin is in a standby state for curing, the lower end of the scale 20 is moved from the position of the transmission sensor 21a. Are also located 2-3 mm above. As aforementioned,
The transmission sensor 21a is ON or O depending on the light transmission state.
Since the FF changes and the state shown in FIG. 6 is a state in which light is transmitted, the transmission sensor 21a is in the ON state.

In this ON state, a drive unit (not shown) for lowering the lower die 2 sets the lowering speed of the lower die 2 to a predetermined first lowering speed or less based on a signal from the transmission sensor 21a. . This descent speed is preferably 1.0 mm / sec or less, but in the following description,
The lowering speed of the lower mold 2 is assumed to be 1.0 mm / sec.

Then, as shown in FIG. 7, the mold opening is performed at the above-described first descending speed of 1.0 mm / sec. In the state shown in FIG.
Since the lower end of 0 is still positioned above the transmission sensor 21a, the transmission sensor 21a is in the ON state, and therefore, the lowering speed of the lower mold 2 is also 1.0 mm / sec.

Next, as shown in FIG. 8, when the lower end of the scale 20 fixed to the lower mold 2 is located below the transmission sensor 21a, the transmission sensor 21a is in a light-shielding state, and thus is in an OFF state. The apparatus for manufacturing a semiconductor device sets the lowering speed of the lower die 2 to a second lowering speed higher than the first lowering speed, and causes the lower die 2 to perform the lowering operation.

Here, the timing at the time of opening the mold will be described with reference to FIG. FIG. 5 shows a timing chart of the operation when the mold is opened.

In FIG. 5, the horizontal axis indicates elapsed time, the vertical axis of the press operation indicates the position of the lower die, the vertical axis of the injection operation indicates the filling ratio, and the vertical axis of the knockout operation indicates the knockout. Shows the position of the plate.

As shown in FIG. 5, after performing resin encapsulation in the same manner as in the prior art, the mold opening operation is performed from the point a in FIG. 5, but at a low speed from the point a to the point b. The mold is opened (FIGS. 6 and 7). Thereafter, the mold is opened at high speed from point b to point c (FIG. 8).

As described above, the mold opening amount from point a to point b may be about 2 mm to 3 mm at which the semiconductor device after resin sealing is completely released from the upper cavity 3 of the resin sealing mold. Further, as described above, the mold opening speed in this low speed region is set to 1.0 mm / sec or less.

The above-described setting of the mold opening amount in the low-speed region is performed by changing the position of the transmission sensor 21a as shown in FIG. The transmission sensor 21a is attached about 2 to 3 mm below the lower end of the scale 20 in the clamped state shown in FIG.

In the prior art, the shift point at which the mold closing is switched from high speed to low speed is set according to the position of the transmission sensor 21a. However, when the shift point of mold closing and the shift point of mold opening are desired to be the same, the same transmission point is set. This can be performed using the sensor 21a.

When it is desired to set the mold closing shift point and the mold opening shift point to different positions, as shown in FIG. 9, separately from the transmission sensor 21a, the transmission sensor 21b is newly set to one.
Add one.

As shown in FIG. 5, from the point a to the point b at the start of the mold opening, the transmission sensor 21a is in the ON state.
At this time, when the driving device for lowering the lower mold 2 is a hydraulic press, the oil flow rate for lowering the cylinder is reduced, and the lowering speed of the lower mold 2 is reduced.

After the point b, the scale 20 shields the transmission sensor 21a from light, and the transmission sensor 21a is turned off. At the same time, the oil flow is increased. In the case of an electric press such as a servomotor, when the transmission sensor 21a is in an ON state, the motor rotation speed is set to a low speed,
In the state, the speed is high. After opening the mold, lower mold 2
After that, the semiconductor device after resin sealing is moved by the same operation as the conventional technology.

As shown in FIGS. 6, 7 and 8, during the manufacturing process of the semiconductor device, the lowering speed of the lower mold 2 is changed according to the position of the lower mold 2, whereby
Since the load applied to the semiconductor device when the semiconductor device is released from the upper mold 1 and the lower mold 2 can be reduced, the impact force on the semiconductor element of the semiconductor device can be reduced.

Next, with reference to FIGS. 3 and 4, the mold for opening the resin mold is opened to release the semiconductor device from the upper mold and the lower mold of the resin mold. The warning operation based on the load will be described.

First, as shown in FIG. 3, the load cell 24a attached to the above-described upper ejector pin 5
Detects the release load by the upper ejector pin 5 at the same time as the mold opening starts.

As shown in FIG. 4, the load cell 24b attached to the lower ejector pin 13 senses the release load by the lower ejector pin 13 at the same time when the lower knockout plate 15 is raised.

The release load when the semiconductor device is released from the upper die 1 and the release load when the semiconductor device is released from the lower die 2 are both continuously using a resin-sealed mold. In this case, the resin component is oxidized and accumulated in the resin basin on the resin sealing mold, and the surface of the resin component becomes dirty, thereby increasing the mold release state, thereby increasing the resin release state.

Therefore, when the release load detected by the load cells 24a and 24b exceeds the set load, a warning is issued by the above-mentioned warning means, for example, an alarm or an optical display device. In addition, the semiconductor device manufacturing apparatus can be stopped.

As described above, when the apparatus is stopped, the contaminated resin sealing mold is replaced, or the contaminant is removed using a resin for cleaning the resin sealing mold.

Therefore, according to this embodiment, even when dirt adheres to the resin-sealing mold, the load when the semiconductor device is released from the resin-sealing mold is detected, and this load is detected. If it is larger than the set value, a warning is issued,
Since the device is stopped, the degree of dirt on the resin-sealed mold can be quickly checked, so that dirt is transferred to the surface of the resin-sealed semiconductor device or scouring occurs. In addition, the resin is easily adhered to the air vent for bleeding air in the cavity, which is a resin-sealed portion, so that voids and unfilled portions are generated. Can be avoided.

However, in the description of the above-described embodiment, for example, as shown in FIG. 1, the load at the time when the semiconductor device is released from the resin mold by the load cell 24a and the load cell 24b is detected. , An embodiment that issues a warning,
As shown in FIG. 6, an embodiment in which the scale 20 is fixed to the lower die 2 and the transmission sensor 21a detects whether the lower end of the scale 20 is above or below a predetermined position. Although described in combination, these two embodiments can of course be implemented independently of each other.

Furthermore, the above embodiment is an example of a preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention. is there.

[0122]

As is apparent from the above description, according to the present invention, when the semiconductor device is released from the upper die and the lower die when the lower die is lowered, the release load of the lower die is reduced. Semiconductor device manufacturing apparatus capable of manufacturing a high-quality semiconductor device by preventing the semiconductor element included in the semiconductor device from being cracked or cracked by controlling the descending speed of the semiconductor device. And a method for manufacturing a semiconductor device.

In addition, since the contamination of the resin-sealing mold used for manufacturing the semiconductor device is detected by a change in the release load, and a warning is issued based on this detection, the resin-sealing mold becomes dirty. It is not used in the manufacture of semiconductor devices as they are, and it is necessary to prevent the occurrence of dirt, scouring, voids, and unfilling, which are defective appearances of semiconductor devices due to dirt on the resin sealing mold. Accordingly, it is possible to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of manufacturing a high-quality semiconductor device.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a resin sealing mold used in an embodiment of a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method according to the present invention.

FIG. 2 is a cross-sectional view of a resin sealing mold used in an embodiment of a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method according to the present invention.

FIG. 3 is a cross-sectional view of a resin sealing mold used in an embodiment of a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method according to the present invention.

FIG. 4 is a cross-sectional view of a resin sealing mold used in an embodiment of a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method according to the present invention.

FIG. 5 is a timing chart of the semiconductor device manufacturing apparatus and the semiconductor device manufacturing method shown in FIG. 1;

FIG. 6 is an overall schematic view of an embodiment of a semiconductor device manufacturing apparatus according to the present invention, which includes the resin sealing mold shown in FIG. 1;

FIG. 7 is an overall schematic view of one embodiment of a semiconductor device manufacturing apparatus according to the present invention including the resin sealing mold shown in FIG. 1;

FIG. 8 is an overall schematic view of one embodiment of a semiconductor device manufacturing apparatus according to the present invention, which includes the resin sealing mold shown in FIG. 1;

9 is an overall schematic view of one embodiment of a semiconductor device manufacturing apparatus according to the present invention, including the resin-sealing mold shown in FIG. 1;

FIG. 10 is a cross-sectional view of a resin molding die used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 11 is a cross-sectional view of a resin molding die used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 12 is a cross-sectional view of a resin-sealing mold used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 13 is a sectional view of a resin sealing mold used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 14 is a cross-sectional view of a resin mold used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 15 is a sectional view of a resin sealing mold used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 16 is a cross-sectional view of a resin sealing mold used in a conventional semiconductor device manufacturing apparatus and a conventional semiconductor device manufacturing method.

FIG. 17 is an overall schematic view of a conventional semiconductor device manufacturing apparatus.

FIG. 18 is an overall schematic view of a conventional semiconductor device manufacturing apparatus.

FIG. 19 is a timing chart of a conventional semiconductor device manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper die 2 Lower die 3 Upper cavity 4 Cul 5 Upper ejector pin 6 Upper ejector plate 7 Upper knockout plate 8a, 8b Spring 9 Upper return pin 10 Lower cavity 11 Pot 12 Runner 13 Lower ejector pin 14 Lower ejector plate 15 Lower knockout plate 16 Lower return pin 17 Lead frame 18 Resin 19a, 19b Upper press 20 Scale 21a, 21b Transmission sensor 22 Plunger 23 Knockout rod 24a, 24b Load cell

Claims (16)

[Claims] An apparatus for manufacturing a semiconductor device having a resin mold having an upper mold and a lower mold that can be opened and closed with each other, wherein one end is fixed to the lower mold and the other end is moved up and down by the lower mold. A scale that moves up and down with the sensor, and a detection unit that detects whether the other end of the scale is located above a predetermined position or is located below the predetermined position. If the other end is detected to be located at or above the predetermined position, the lowering speed of the lower mold is set to be equal to or lower than a predetermined first speed, and based on the detection of the detecting unit, When it is detected that the other end is located below the predetermined position, the lower speed of the lower mold is set to a predetermined second speed which is higher than the first speed. An apparatus for manufacturing a semiconductor device, comprising: 2. The method according to claim 1, wherein the predetermined first speed is 1.0 mm /
2. The semiconductor device manufacturing apparatus according to claim 1, wherein the time is seconds. 3. The upper mold has at least one or more upper cavities in which resin is sealed, a cull as an inflow path of the resin, and at least one or more first upper ejector pins penetrating the upper cavities. At least one or more second upper ejector pins that penetrate the cull, an upper ejector plate supported by the upper die and having the first upper ejector pin and the second upper ejector pin attached thereto, and the upper ejector An upper knockout plate to which a plate is fixed; at least one or more first sandwiched between the upper ejector plate and a surface of the upper ejector plate where the upper ejector plate is not in contact with the upper knockout plate; A spring, the first upper ejector pin and the second upper ejector A pin, is formed between the upper knockout plate, first to detect the load when the resin is separated from the upper die
The lower mold has at least one or more lower cavities in which a resin is sealed, a pot as a charging portion of the resin to be sealed in the lower cavity, and a resin in the pot. A lower ejector pin penetrating through the lower cavity, a lower ejector plate supported by the lower mold and having the lower ejector pin attached thereto, and a lower part to which the lower ejector plate is fixed A knockout plate, a surface of the lower ejector plate where the lower ejector plate is not in contact with the lower knockout plate, at least one or more second springs sandwiched between the upper mold and the lower ejector pin; Formed between the lower knockout plate and the lower knockout plate; A second detecting means for detecting a load when the resin separates from the mold, wherein the load when the resin separates from the upper mold detected by the first detecting means is equal to or more than a predetermined value. First warning means for giving a warning to the second warning means, and second warning means for giving a warning when the load when the resin separates from the lower mold detected by the second detection means is equal to or more than a predetermined value. The apparatus for manufacturing a semiconductor device according to claim 1, further comprising: 4. The apparatus for manufacturing a semiconductor device according to claim 3, wherein said first warning means comprises an alarm or an optical display device. 5. The semiconductor device manufacturing apparatus according to claim 3, wherein said second warning means is constituted by an alarm or an optical display device. 6. An apparatus for manufacturing a semiconductor device having a resin-sealing mold having an upper mold and a lower mold that can be opened and closed with each other, wherein the upper mold has at least one or more upper cavities in which resin is sealed, A cull that is an inflow path of the resin, at least one or more first upper ejector pins that penetrate the upper cavity, at least one or more second upper ejector pins that penetrate the cull, and are supported by the upper mold, An upper ejector plate to which the first upper ejector pin and the second upper ejector pin are attached; an upper knockout plate to which the upper ejector plate is fixed; and an upper ejector plate in the upper ejector plate, The small part sandwiched between the surface not in contact with the knockout plate and the upper mold At least one or more first springs, the first upper ejector pin, the second upper ejector pin, and the upper knockout plate are formed between the upper knockout plate and detect a load when the resin separates from the upper mold. First
The lower mold has at least one or more lower cavities in which a resin is sealed, a pot as a charging portion of the resin to be sealed in the lower cavity, and a resin in the pot. A lower ejector pin penetrating through the lower cavity, a lower ejector plate supported by the lower mold and having the lower ejector pin attached thereto, and a lower part to which the lower ejector plate is fixed A knockout plate, a surface of the lower ejector plate where the lower ejector plate is not in contact with the lower knockout plate, at least one or more second springs sandwiched between the upper die, and a lower ejector pin. Formed between the lower knockout plate and the lower knockout plate; A second detecting means for detecting a load when the resin separates from the mold, wherein the load when the resin separates from the upper mold detected by the first detecting means is equal to or more than a predetermined value. First warning means for giving a warning to the second warning means, and second warning means for giving a warning when the load when the resin separates from the lower mold detected by the second detection means is equal to or more than a predetermined value. An apparatus for manufacturing a semiconductor device, comprising: 7. The semiconductor device manufacturing apparatus according to claim 6, wherein said first warning means comprises an alarm or an optical display device. 8. The semiconductor device manufacturing apparatus according to claim 6, wherein said second warning means comprises an alarm or an optical display device. 9. A method of manufacturing a semiconductor device using a resin-sealing mold having an upper mold and a lower mold that can be opened and closed with each other, wherein one end of the lower mold is formed after resin encapsulation is completed. Fixed to
The other end of the scale, the other end of which is moved up and down with the upward and downward movement of the lower mold, is located above a predetermined position, a detecting step of detecting whether it is located below, and in the detecting step, Based on the detection, when it is detected that the other end is located at or above the predetermined position, the lowering speed of the lower mold is set to be equal to or lower than a predetermined first speed. When the other end is detected to be located below the predetermined position, the lowering speed of the lower mold is changed to a predetermined second speed which is higher than the first speed. And a speed setting step. 10. The method according to claim 1, wherein the predetermined first speed is 1.0 mm
10. The method of manufacturing a semiconductor device according to claim 9, wherein the rate is / sec. 11. The upper mold includes at least one or more upper cavities in which resin is sealed, a cull as an inflow path of the resin, and at least one or more first upper ejector pins penetrating the upper cavities. At least one or more second upper ejector pins that penetrate the cull, an upper ejector plate supported by the upper die and having the first upper ejector pin and the second upper ejector pin attached thereto, and the upper ejector An upper knockout plate to which a plate is fixed; at least one or more first sandwiched between the upper ejector plate and a surface of the upper ejector plate where the upper ejector plate is not in contact with the upper knockout plate; A spring, wherein the lower mold has at least one or more resin encapsulated therein. An upper lower cavity, a pot which is a charging portion of the resin to be filled in the lower cavity, a plunger for charging the resin in the pot, at least one or more lower ejector pins penetrating the lower cavity, A lower ejector plate which is supported by a lower mold and to which the lower ejector pin is attached; a lower knockout plate to which the lower ejector plate is fixed; and the lower ejector plate in the lower ejector plate contacts the lower knockout plate. A first spring and a second spring interposed between the upper die and the first upper ejector pin and the second upper ejector pin, and the upper knockout plate. The first detecting means formed between the first A first detecting step of detecting a load when the resin separates from the mold; and a second detecting means formed between the lower ejector pin and the lower knockout plate, when the resin separates from the lower mold. A second detection step of detecting a load, and a first warning step of giving a warning when the load when the resin separates from the upper mold detected in the first detection step is equal to or more than a predetermined value. And a second warning step for giving a warning when a load when the resin is separated from the lower mold detected in the second detection step is equal to or more than a predetermined value. Or a method for manufacturing a semiconductor device according to item 10. 12. The method according to claim 11, wherein the first warning step is performed by an alarm or an optical display device. 13. The method according to claim 11, wherein the second warning step is performed by an alarm or an optical display device. 14. A method of manufacturing a semiconductor device using a resin-sealed mold having an upper mold and a lower mold that can be opened and closed with each other, wherein the upper mold has at least one resin encapsulated therein. The above upper cavity, a cull as an inflow path of the resin, at least one or more first upper ejector pins penetrating the upper cavity, at least one or more second upper ejector pins penetrating the cull, An upper ejector plate supported by an upper mold, to which the first upper ejector pin and the second upper ejector pin are attached; an upper knockout plate to which the upper ejector plate is fixed; A surface where the upper ejector plate is not in contact with the upper knockout plate; A pot having at least one or more first springs interposed therebetween, wherein the lower die is at least one or more lower cavities in which a resin is sealed, and a resin charging portion for charging the lower cavity; A plunger for charging the resin in the pot, at least one or more lower ejector pins penetrating the lower cavity, and a lower ejector plate supported by the lower mold and having the lower ejector pins attached thereto. A lower knockout plate to which the lower ejector plate is fixed; and at least one or more sandwiched between the lower ejector plate and a surface of the lower ejector plate where the lower ejector plate is not in contact with the lower knockout plate and the upper mold. A second spring of the first upper ejector A first detecting step formed between the upper and lower ejector pins and the upper knockout plate to detect a load when the resin is separated from the upper mold, and a first detecting step; A second detecting step formed between the lower mold and the lower knockout plate to detect a load when the resin is separated from the lower mold; A first warning step for giving a warning when the load when the resin is separated from the mold is equal to or more than a predetermined value; and a load when the resin is separated from the lower mold detected by the second detection step is predetermined. And a second warning step of giving a warning when the value is equal to or more than the value of the semiconductor device. 15. The method according to claim 14, wherein the first warning step is performed by an alarm or an optical display device. 16. The method according to claim 14, wherein the second warning step is performed by an alarm or an optical display device.