JPH1187004A - Contact member - Google Patents
Contact memberInfo
- Publication number
- JPH1187004A JPH1187004A JP10163392A JP16339298A JPH1187004A JP H1187004 A JPH1187004 A JP H1187004A JP 10163392 A JP10163392 A JP 10163392A JP 16339298 A JP16339298 A JP 16339298A JP H1187004 A JPH1187004 A JP H1187004A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact member
- hole
- present
- wire material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ＬＳＩ等の半導
体デバイスを検査するためのテスト用ソケットや、各種
の回路基板等の穴に装着される接触部材に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test socket for inspecting a semiconductor device such as an LSI, and a contact member to be mounted on a hole of various circuit boards.
【０００２】[0002]
【従来の技術】従来より、半導体デバイス等の導通検査
のため、図１に示したようなテスト用ソケットが使用さ
れている。このテスト用ソケットは、ソケット２にアレ
イ状に設けられた多数の穴３に接触部材を装着し、この
穴３に検査対象の半導体デバイスの端子を差し込むよう
にしたものである。2. Description of the Related Art Conventionally, a test socket as shown in FIG. 1 has been used for testing the continuity of a semiconductor device or the like. In this test socket, contact members are attached to a large number of holes 3 provided in an array on the socket 2, and terminals of a semiconductor device to be inspected are inserted into the holes 3.
【０００３】この従来のテスト用ソケットの接触部材で
は、微小な筒状の接触部材本体の先端に、金属製のピン
状の接触体を突出付勢して取り付け、この接触体を検査
対象の被接触箇所（前記半導体デバイスの端子）に接触
させるようにしていた（図示せず）。In this conventional contact member of a test socket, a metal pin-shaped contact member is protruded and attached to the tip of a minute cylindrical contact member body, and this contact member is to be inspected. The contact point (the terminal of the semiconductor device) was brought into contact (not shown).
【０００４】しかし、前記ピン状の接触体は、検査対象
の被接触箇所に先端の一点でしか接触しないため、被接
触箇所が損傷することが多く、また、電気抵抗値が大き
いため、埃や汚れ等に弱く、確実な電気的接触を得るこ
とが困難であった。[0004] However, the pin-shaped contact body comes into contact with only a single point at the tip of the contacted portion to be inspected, so that the contacted portion is often damaged. It is weak to dirt and the like, and it has been difficult to obtain reliable electrical contact.
【０００５】[0005]
【発明が解決しようとする課題】そこで、この発明は、
被接触箇所を損傷するおそれが少なく、また、電気抵抗
値が小さく、確実な電気的接触を得ることが容易な接触
部材を提供することを課題とする。SUMMARY OF THE INVENTION Therefore, the present invention
An object of the present invention is to provide a contact member which has a low risk of damaging a contacted portion, has a small electric resistance value, and can easily obtain a reliable electric contact.
【０００６】[0006]
【課題を解決するための手段】前記課題を解決するた
め、この発明は次のような技術的手段を講じている。In order to solve the above-mentioned problems, the present invention employs the following technical means.
【０００７】この発明の接触部材１は、導電性の線材を
螺旋状に巻回してなり、被接触箇所４との接触時におい
て、線材の輪が密着して筒状になるようにしている。The contact member 1 of the present invention is formed by spirally winding a conductive wire so that the ring of the wire is brought into close contact with the contact point 4 so as to be cylindrical.
【０００８】被接触箇所４との接触時において、線材の
輪が密着した状態のまま曲がることにより、接触圧が減
じるようにしてもよい。At the time of contact with the contacted portion 4, the contact pressure may be reduced by bending the wire rod while keeping it in a tight contact state.
【０００９】導電性の線材を螺旋状に巻回し、その内側
に導電性の内挿ピン９を圧入してなるものとすることも
できる。A conductive wire may be spirally wound, and a conductive insertion pin 9 may be press-fitted inside the spirally wound conductive wire.
【００１０】被接触箇所４に接する先端の接触部１ａを
先端方向に拡径した形状としてもよい。[0010] The contact portion 1a at the distal end that contacts the contacted portion 4 may have a shape whose diameter is increased in the distal direction.
【００１１】[0011]
【発明の実施の形態】以下、この発明の実施の形態を図
面を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１２】この発明の接触部材１は、例えば、図１に
示したような半導体デバイスのテスト用のソケット２等
に設けられた穴３に挿入して使用される。The contact member 1 of the present invention is used, for example, by inserting it into a hole 3 provided in a test socket 2 of a semiconductor device as shown in FIG.
【００１３】図２以下は、この発明の接触部材１の実施
形態を示した図である。この発明の接触部材１は、全体
を、例えばリン青銅やベリリューム銅、ピアノ線等の適
宜の金属製の線材を螺旋状に巻回し、金や銀のメッキを
施すことにより作製することができる。FIG. 2 et seq. Show an embodiment of the contact member 1 of the present invention. The entire contact member 1 of the present invention can be manufactured by spirally winding an appropriate metal wire such as phosphor bronze, beryllium copper, or piano wire, and plating it with gold or silver.
【００１４】図２は、被接触箇所４との接触時におい
て、線材の輪が密着して筒状になるようにした接触部材
１を、ソケット又は基板２の穴３に挿入し、被接触箇所
４であるデバイスの端子に接触させた状態を示したもの
である。FIG. 2 shows a state in which a contact member 1 in which a loop of a wire is brought into close contact with the contact point 4 so as to form a cylindrical shape at the time of contact with the contact point 4 is inserted into a hole 3 of a socket or a substrate 2. 4 shows a state in which the terminal is in contact with the terminal of the device No. 4.
【００１５】この接触部材１は、上端の接触部１ａを先
端方向にラッパ状に拡径させ、その部分断面図である図
３に示すように、被接触箇所４の球状に盛り上がったハ
ンダボールの曲面によく沿うようにしている。この接触
部材１は、主にＢＧＡ（ボールグリッドアレイ）を採用
したデバイスを検査対象とする場合に適している。The contact member 1 has a contact portion 1a at the upper end whose diameter is increased in a trumpet shape in the tip direction, and as shown in a partial sectional view of FIG. I try to follow the curved surface well. This contact member 1 is suitable mainly when a device employing a BGA (ball grid array) is to be inspected.
【００１６】接触部材１の下端にも、検査装置等の基板
５に接続するための接触部１ｂを形成している。なお、
この例では、下端の接触部１ｂを、基板５の端子６に固
着している。At the lower end of the contact member 1, a contact portion 1b for connecting to a substrate 5 such as an inspection device is formed. In addition,
In this example, the contact portion 1b at the lower end is fixed to the terminal 6 of the substrate 5.
【００１７】接触部材１の中間部１ｃ（上端の接触部１
ａと下端の接触部１ｂを除く部分）の径は、穴３の径よ
りも小さくし、被接触箇所４との接触時において押圧さ
れると、線材の輪が密着した状態のまま、穴３内におい
て「く」の字状に曲がることができるようにしている。
このように接触部材１が曲がることにより、接触圧が減
じ、被接触箇所４の損傷を防止することができる。The intermediate portion 1c of the contact member 1 (the contact portion 1 at the upper end)
a and the diameter of the lower end portion (excluding the contact portion 1b) are smaller than the diameter of the hole 3, and when pressed at the time of contact with the contacted portion 4, the diameter of the hole It is designed to be able to bend in the shape of a "ku".
By bending the contact member 1 in this manner, the contact pressure is reduced, and damage to the contacted portion 4 can be prevented.
【００１８】接触部材１は、被接触箇所４との接触時に
おいて、押圧されることにより、図２に示したように、
線材の輪が密着し、筒状になる。これにより、電気抵抗
値を極めて低くすることができる。接触部材１の接触部
１ａの上端の周は、被接触箇所４との接触面積を大きく
するために、傾きが水平になっていることが望ましい。As shown in FIG. 2, the contact member 1 is pressed when it comes into contact with the contact portion 4,
The loops of the wire rods adhere to each other and become cylindrical. Thereby, the electric resistance value can be extremely reduced. It is desirable that the circumference of the upper end of the contact portion 1a of the contact member 1 has a horizontal inclination in order to increase the contact area with the contacted portion 4.
【００１９】接触部材１の接触部１ａ、１ｂ、中間部１
ｃの長さや径は、穴３、被接触箇所４、端子６の大き
さ、ピッチ等に応じて適宜とすることができる。例え
ば、図４のように上端の接触部１ａの径を穴３の径より
大きくしたり、下端の接触部１ｂの径を小さくしたりす
ることができる。The contact portions 1a and 1b of the contact member 1 and the intermediate portion 1
The length and diameter of c can be appropriately determined according to the size, pitch, and the like of the hole 3, the contact portion 4, and the terminal 6. For example, as shown in FIG. 4, the diameter of the contact portion 1a at the upper end can be made larger than the diameter of the hole 3, or the diameter of the contact portion 1b at the lower end can be made smaller.
【００２０】図５に示したものは、上端から下端まで径
が同一の接触部材１、図６に示したものは、上端と下端
の径を小さく絞った接触部材１で、いずれもＬＧＡ（ラ
ンドグリッドアレイ）やＴＡＢのような、被接触箇所４
が比較的平坦なものを検査対象とする場合に適してい
る。FIG. 5 shows a contact member 1 having the same diameter from the upper end to the lower end, and FIG. 6 shows a contact member 1 having a smaller diameter at the upper end and the lower end. Contacted area 4 such as grid array) or TAB
Is suitable when a relatively flat object is to be inspected.
【００２１】接触部材１は、中間部１ｃがソケット又は
基板２の穴３に固定されるようにしてもよい。中間部１
ｃを穴３に固定する方法としては、例えば、中間部１ｃ
の全体又は一部の径を穴３の径よりもやや大きくし、穴
３に圧入するとよい。The contact member 1 may be configured such that the intermediate portion 1c is fixed to the hole 3 of the socket or the substrate 2. Middle part 1
As a method of fixing c to the hole 3, for example, the intermediate portion 1c
May be slightly larger than the diameter of the hole 3 and press-fit into the hole 3.
【００２２】また、図７に示すように、接触部材１の中
間部１ｃを、穴３の径と同程度又はやや大きい外径のパ
イプ７の中に圧入し、このパイプ７を穴３に圧入固定す
るようにしてもよい。パイプ７と接触部材１とは、ハン
ダ付けを施したり、図８のようにパイプ７の上下端７
ａ、７ｂをかしめることにより固定しておくことが望ま
しい。As shown in FIG. 7, the intermediate portion 1c of the contact member 1 is press-fitted into a pipe 7 having an outer diameter approximately equal to or slightly larger than the diameter of the hole 3, and the pipe 7 is press-fitted into the hole 3. It may be fixed. The pipe 7 and the contact member 1 may be soldered or connected to the upper and lower ends 7 of the pipe 7 as shown in FIG.
It is desirable to fix by caulking a and 7b.
【００２３】さらに、図９のようにパイプ７に穴３の径
よりやや大きい外径の拡径部７ｃを設け、穴３の内周に
しっかりと係合させるようにしてもよい。なお、図７〜
図９においては、パイプ７を断面で示している。Further, as shown in FIG. 9, the pipe 7 may be provided with an enlarged diameter portion 7c having an outer diameter slightly larger than the diameter of the hole 3 so as to be securely engaged with the inner periphery of the hole 3. In addition, FIG.
In FIG. 9, the pipe 7 is shown in cross section.
【００２４】パイプ７は、黄銅、リン青銅、洋白の他、
適宜の導電性のある材料からなるものとすればよい。こ
のように、導電性のパイプ７を使用して接触部材１をソ
ケット又は基板２の穴３に装着部すれば、接触部材１の
電気抵抗値をより一層低低くすることができる。The pipe 7 is made of brass, phosphor bronze, nickel silver,
What is necessary is just to consist of a suitable electroconductive material. As described above, if the contact member 1 is attached to the socket 3 or the hole 3 of the board 2 using the conductive pipe 7, the electric resistance value of the contact member 1 can be further reduced.
【００２５】また、接触部材１を図１０に示したような
ピン８に取り付けてもよい。ピン８はソケット又は基板
２の穴３内に嵌合状態で固定される固定部８ａと、上端
の接触部材取付部８ｂと、下方に延びる針状部８ｃから
なる。接触部材取付部８ｂは、接触部材１の下端部の内
周面に嵌合する。ピン８は導電性に優れた金属でできて
おり、固定部８ａ、接触部材取付部８ｂ及び針状部８ｃ
は、一体で形成されているものでも、それぞれ別体から
なるものとしてもよい。図１１は、このピン８を用いて
接触部材１を取り付けた様子を示す断面図である。The contact member 1 may be mounted on a pin 8 as shown in FIG. The pin 8 includes a fixing portion 8a fixed in the hole 3 of the socket or the substrate 2 in a fitted state, a contact member mounting portion 8b at an upper end, and a needle-like portion 8c extending downward. The contact member mounting portion 8b is fitted on the inner peripheral surface of the lower end of the contact member 1. The pin 8 is made of a metal having excellent conductivity, and includes a fixing portion 8a, a contact member attaching portion 8b, and a needle-like portion 8c.
May be formed integrally or may be formed separately. FIG. 11 is a cross-sectional view showing a state where the contact member 1 is attached using the pin 8.
【００２６】以上、図２〜図１１に示したこの発明の接
触部材１は、いずれも接触部１ａがコイルばねのように
弾力性を有している上に、検査対象の被接触箇所４に、
先端の一点だけでなく、先端の周で線的に接触するた
め、接触面積が大きい。さらに、被接触箇所４との接触
時において、線材の輪が密着して筒状になる。従って、
被接触箇所４を損傷するおそれが少なく、また、電気接
触抵抗値が小さいため、埃や汚れに強く、容易に確実な
電気的接触を得ることが可能である。As described above, in the contact member 1 of the present invention shown in FIGS. 2 to 11, the contact portion 1a has elasticity like a coil spring, and the contact portion 1a ,
The contact area is large not only at one point of the tip but also at the periphery of the tip. Further, at the time of contact with the contacted portion 4, the loop of the wire rod is brought into close contact to form a tube. Therefore,
Since there is little risk of damaging the contacted portion 4 and the electric contact resistance value is small, it is resistant to dust and dirt, and it is possible to easily and reliably obtain an electric contact.
【００２７】しかも、非常にシンプルな構成となってい
るため、従来の接触部材のように複雑な組立作業の必要
がなく、容易かつ安価に製造することができる。さら
に、外径０．０８ｍｍ程度の微細なものとすることが可
能で、端子のピッチが０．１ｍｍの半導体デバイスに対
応することもできる。Moreover, since the structure is very simple, there is no need for a complicated assembling work as in the case of the conventional contact member, and it is possible to manufacture easily and inexpensively. Further, it can be made as fine as about 0.08 mm in outer diameter, and can correspond to a semiconductor device having a terminal pitch of 0.1 mm.
【００２８】なお、接触部材１の中間部１ｃは、その外
側又は内側をハンダ等でメッキすることにより、図１２
に示すように、筒状の形状を常時維持するようにしても
よい。The intermediate portion 1c of the contact member 1 is plated on the outside or the inside with solder or the like, as shown in FIG.
As shown in (1), a cylindrical shape may be always maintained.
【００２９】また、図１３に示すように、接触部材１の
中間部１ｃの内側に黄銅やベリリューム銅等からなる導
電性の内挿ピン９を圧入することにより、導電性を高め
ることとすれば、被接触箇所４との接触時において、線
材の輪が密着するようにしなくてもよい。内挿ピン９の
径は、接触部材１の伸縮の妨げにならないように、軽度
の圧入状態となる大きさとすることが望ましい。Further, as shown in FIG. 13, if the conductivity is increased by press-fitting a conductive insertion pin 9 made of brass, beryllium copper or the like into the inside of the intermediate portion 1c of the contact member 1. At the time of contact with the contact point 4, the loop of the wire does not have to be in close contact. The diameter of the insertion pin 9 is desirably set to a size that allows a light press-fit state so as not to hinder the expansion and contraction of the contact member 1.
【００３０】なお、この発明の接触部材１は、大きさや
材質は特に限定されず、上記以外の各種のテスト用ソケ
ットにも装着できる。例えば、耐熱性のある材料で作製
すれば、バーンイン試験用のソケットに装着するように
したものとすることもできる。The size and material of the contact member 1 of the present invention are not particularly limited, and can be mounted on various test sockets other than those described above. For example, if it is made of a heat-resistant material, it can be mounted on a burn-in test socket.
【００３１】また、テスト用のソケットや基板以外に
も、プリント配線基板に実装される半導体デバイス用の
ソケットや各種の基板に使用することもできる。In addition to the test sockets and boards, the present invention can be used for sockets for semiconductor devices mounted on a printed wiring board and various boards.
【００３２】[0032]
【発明の効果】この発明の接触部材１は、上述のように
構成されており、螺旋状の接触部１ａが、被接触箇所４
に弾力的にかつ線的に接触するため、被接触箇所４を損
傷するおそれが少なく、確実な接触状態が得られ、さら
に、線材の輪が密着して筒状になり、又は内側に導電性
の内挿ピン９が圧入されているので、電気抵抗値が小さ
い。The contact member 1 of the present invention is configured as described above, and the helical contact portion 1a has
The contact point 4 is elastically and linearly contacted, so that there is little danger of damaging the contacted portion 4 and a reliable contact state is obtained. , The electrical resistance value is small.
【００３３】従って、この発明の接触部材１を使用する
ことにより、容易に確実な電気的接触を得ることができ
る。Therefore, by using the contact member 1 of the present invention, reliable electric contact can be easily obtained.
【図１】ソケットの上面図。FIG. 1 is a top view of a socket.
【図２】この発明の実施形態の接触部材の被接触箇所と
の接触状態を示す説明図。FIG. 2 is an explanatory diagram showing a contact state of a contact member with a contacted portion according to the embodiment of the present invention.
【図３】この発明の実施形態の接触部材の被接触箇所と
の接触状態を示す部分断面図。FIG. 3 is a partial cross-sectional view showing a contact state of a contact member with a contacted portion according to the embodiment of the present invention.
【図４】この発明の他の実施形態の接触部材の正面図。FIG. 4 is a front view of a contact member according to another embodiment of the present invention.
【図５】この発明の他の実施形態の接触部材の正面図。FIG. 5 is a front view of a contact member according to another embodiment of the present invention.
【図６】この発明の他の実施形態の接触部材の正面図。FIG. 6 is a front view of a contact member according to another embodiment of the present invention.
【図７】この発明の他の実施形態の接触部材の一部切欠
正面図。FIG. 7 is a partially cutaway front view of a contact member according to another embodiment of the present invention.
【図８】この発明の他の実施形態の接触部材の一部切欠
正面図。FIG. 8 is a partially cutaway front view of a contact member according to another embodiment of the present invention.
【図９】この発明の他の実施形態の接触部材の一部切欠
正面図。FIG. 9 is a partially cutaway front view of a contact member according to another embodiment of the present invention.
【図１０】この発明の他の実施形態の接触部材を取り付
けるためのピンの正面図。FIG. 10 is a front view of a pin for attaching a contact member according to another embodiment of the present invention.
【図１１】この発明の他の実施形態の接触部材の被接触
箇所との接触状態を示す断面図。FIG. 11 is a cross-sectional view illustrating a contact state of a contact member with a contacted portion according to another embodiment of the present invention.
【図１２】この発明の他の実施形態の接触部材の正面
図。FIG. 12 is a front view of a contact member according to another embodiment of the present invention.
【図１３】この発明の他の実施形態の接触部材の正面
図。FIG. 13 is a front view of a contact member according to another embodiment of the present invention.
１ 接触部材 １ａ 接触部 ４ 接触部 ９ 内挿ピン DESCRIPTION OF SYMBOLS 1 Contact member 1a Contact part 4 Contact part 9 Insertion pin
Claims (4)
被接触箇所（４）との接触時において、線材の輪が密着
して筒状になるようにしたことを特徴とする接触部材。1. A conductive wire is spirally wound,
A contact member characterized in that a loop of a wire rod is brought into close contact with the contact point (4) to form a cylindrical shape when in contact with the contact point (4).
線材の輪が密着した状態のまま曲がることにより、接触
圧が減じるようにした請求項１記載の接触部材。2. The method according to claim 1, further comprising:
The contact member according to claim 1, wherein the contact pressure is reduced by bending the wire rod in a state of being in close contact with the wire rod.
側に導電性の内挿ピン（９）を圧入してなることを特徴
とする接触部材。3. A contact member wherein a conductive wire is spirally wound and a conductive insertion pin (9) is press-fitted inside the spirally wound conductive wire.
（１ａ）を先端方向に拡径した形状とした請求項１、２
又は３記載の接触部材。4. A contact portion (1a) at a tip end in contact with a contact point (4) is formed to have a shape whose diameter is increased in a tip end direction.
Or the contact member according to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10163392A JPH1187004A (en) | 1997-07-15 | 1998-06-11 | Contact member |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-189556 | 1997-07-15 | ||
| JP18955697 | 1997-07-15 | ||
| JP10163392A JPH1187004A (en) | 1997-07-15 | 1998-06-11 | Contact member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1187004A true JPH1187004A (en) | 1999-03-30 |
Family
ID=26488841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10163392A Pending JPH1187004A (en) | 1997-07-15 | 1998-06-11 | Contact member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1187004A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270321A (en) * | 2001-03-07 | 2002-09-20 | Advanex Inc | Socket for semiconductor package |
| WO2003007435A1 (en) * | 2001-07-13 | 2003-01-23 | Nhk Spring Co., Ltd. | Contactor |
| JP2017168268A (en) * | 2016-03-15 | 2017-09-21 | オムロン株式会社 | Trigger switch and electrically-driven tool using the same |
| JP2021044609A (en) * | 2019-09-06 | 2021-03-18 | カシオ計算機株式会社 | Electronic device |
-
1998
- 1998-06-11 JP JP10163392A patent/JPH1187004A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270321A (en) * | 2001-03-07 | 2002-09-20 | Advanex Inc | Socket for semiconductor package |
| WO2003007435A1 (en) * | 2001-07-13 | 2003-01-23 | Nhk Spring Co., Ltd. | Contactor |
| US7404717B2 (en) | 2001-07-13 | 2008-07-29 | Nhk Spring Co., Ltd. | Contactor |
| JP2017168268A (en) * | 2016-03-15 | 2017-09-21 | オムロン株式会社 | Trigger switch and electrically-driven tool using the same |
| WO2017159004A1 (en) * | 2016-03-15 | 2017-09-21 | オムロン株式会社 | Trigger switch and electrical tool using same |
| KR20180038523A (en) * | 2016-03-15 | 2018-04-16 | 오므론 가부시키가이샤 | Trigger switch and transformer using it |
| CN107949896A (en) * | 2016-03-15 | 2018-04-20 | 欧姆龙株式会社 | Trigger switch and the electric tool using the trigger switch |
| CN107949896B (en) * | 2016-03-15 | 2019-08-06 | 欧姆龙株式会社 | Trigger switch and the electric tool for using the trigger switch |
| JP2021044609A (en) * | 2019-09-06 | 2021-03-18 | カシオ計算機株式会社 | Electronic device |
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