JPH1186672A - Circuit board provided with push-on type switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board provided with a switch and having a structure which is manufacturable at low cost. SOLUTION: A circuit pattern, including a pair of fixed contact patterns 2a, 2b, is formed on the surface of an insulating board 1. An insulating resin layer 5 having a double-layer structure is formed on the insulating board 1. A sheet-like insulating cover member 8, provided with a movable part 8a on which a movable contact 11 to short-circuit between a pair of the contact patterns 2a, 2b when the member is brought into contact with a pair of the contact patterns 2a, 2b, is installed on the insulating resin layer 5 via a pressure sensitive adhesive sheet 7. The insulating resin layer 5 with the double-layer structure works as a spacer 6' for keeping a prescribed distance between the movable contact 11 and a pair of the fixed contact patterns 2a, 2b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of pressing a movable portion of an insulating cover member to short-circuit a pair of fixed contact patterns on an insulating substrate with a movable contact attached to the movable portion. The present invention relates to a circuit board with a push-on switch having a push-on switch having a structure.

[0002]

2. Description of the Related Art In a conventional circuit board with a push-on type switch, as shown in FIGS.
On the surface of the insulating substrate 1, a circuit pattern 3 including a pair of fixed contact patterns 2a and 2b facing each other at a predetermined interval in the surface direction is formed.
An insulating resin layer 5 as an overcoat layer is provided except for a contact pattern forming region 4 where a and 2b are formed. As shown in FIG. 6, a sheet-like spacer 6 is integrated on the surface of such an insulating substrate 1 via an adhesive sheet 7 in which an adhesive is previously applied to both sides of the sheet. An insulating cover member 8 is provided via an adhesive layer 9 formed by applying an adhesive to the back surface of the spacer 6 as shown in FIG.
Are bonded as shown in FIG. A hole 10 is provided in the spacer 6 corresponding to the contact pattern forming region 4 of the insulating substrate 1. The insulating cover member 8 has a dome-shaped movable portion 8a so as to form an outwardly convex shape at the hole 10.
Is provided. The insulating cover member 8 includes a movable portion 8a.
Is formed of an insulating resin that can be restored to its original shape after being deformed with appropriate elasticity by a pressing operation. A pair of fixed contact patterns 2 is provided on the lower surface of the movable portion 8a.
a, 2b, these contact patterns 2a,
A movable contact 11 for short-circuiting between 2b is attached via an adhesive sheet 7. Dome-shaped movable part 8a and spacer 6
The movable portion 8a and the fixed contact patterns 2a,
A push stroke H of a predetermined dimension is formed between the push stroke H and the push stroke H.

On the surface of the insulating substrate 1, a required number of push-on switches 12 having such a structure are provided.

[0004]

However, in the conventional circuit board with a push-on type switch as described above, as shown in FIG.
Since the sheet-shaped spacer 6 is positioned in advance on the lower surface of the sheet so that the hole 10 thereof corresponds to the dome-shaped movable portion 8a and integrated using the adhesive sheet 7, the number of parts increases and the number of assembly steps is increased. However, there is a problem that the cost increases.

It is an object of the present invention to provide a circuit board with a push-on type switch which can be manufactured at low cost.

Another object of the present invention is to provide a circuit board with a push-on type switch having a structure that can be manufactured at low cost without causing deterioration in quality.

[0007]

According to the present invention, there is provided an insulating substrate having a circuit pattern including a pair of fixed contact patterns opposed to each other at a predetermined interval formed on a surface thereof. A sheet-shaped insulating cover member having a movable portion to which a movable contact for short-circuiting between a pair of contact patterns is attached and attached to a surface of the insulating substrate, and a movable contact and a pair of fixed contact patterns In order to secure a predetermined distance, a circuit board with a push-on switch provided with a push-on switch including a spacer disposed between an insulating substrate and an insulating cover member is to be improved. Is what you do. In general, the insulating cover member is made of a flexible synthetic resin sheet, and the movable portion thereof is released from the pressing force applied to the movable portion to bring the movable contact into contact with the pair of contact patterns. Then, it is configured to generate a restoring force for returning the movable contact to a position away from the pair of contact patterns and holding the movable contact.

In the present invention, the spacer is formed by an insulating resin layer formed on the surface of an insulating substrate using an insulating resin paste. As described above, when the spacer is formed by thickening the insulating resin layer formed on the surface of the insulating substrate using the insulating resin paste, the spacer is formed in the step of forming the insulating resin layer on the surface of the insulating substrate. Can be formed together. For this reason, it is not necessary to previously manufacture a component called a spacer having holes corresponding to the contact pattern forming regions as a separate component, as in the related art, and a step of attaching the spacer to the insulating cover member side with an adhesive sheet is not required. This is unnecessary, and the manufacturing cost can be reduced.

The number of switch structures formed on the insulating substrate may be one or more. Even when a plurality of switch structures are formed on one insulating substrate, the spacers may be formed by using an insulating resin paste and an insulating resin layer formed on the surface of the insulating substrate, as described above. . In this case, the spacer is applied with an insulating resin paste on a main surface area facing the insulating cover member except for a contact pattern forming area where at least a pair of fixed contact patterns is formed on the surface of the insulating substrate, The insulating resin paste can be formed using an insulating resin layer formed by curing the paste.

When a spacer is formed by an insulating resin layer formed using an insulating resin paste on an insulating substrate,
The insulating resin layer may be formed by one layer (one application and drying). However, the insulating resin layer having a predetermined thickness is
In order to form a layer, it is important to select a material for the insulating resin paste and adjust the viscosity. Therefore, when the insulating resin layer forming the spacer has a two-layer structure including the lower insulating layer and the upper insulating layer, the insulating resin layer having a predetermined thickness can be formed relatively easily. When an insulating resin layer is formed by a screen printing method using an insulating resin paste, an emulsion previously applied to a screen in order to apply a thick insulating resin paste (a paste non-passing region where an insulating resin paste is not applied to an insulating substrate is formed) Thicker). However, the inner and outer edges of the coating pattern of the insulating resin paste are affected by the thickness of the emulsion itself to secure a film thickness close to the emulsion thickness, but the area surrounded by the inner and outer edges of the coating pattern A phenomenon occurs in which the insulating resin paste is partially scraped off by the squeegee, and the thickness becomes thinner than the inner and outer edges of the application pattern. That is, the inner edge of the insulating resin layer surrounding the contact pattern forming region and the outer edge of the insulating resin layer located on the outer peripheral side of the insulating substrate are raised,
There is a property that the thickness of a portion located between the inner edge and the outer edge is reduced. Therefore, when the insulating resin layer is formed as a single layer, ridges are formed at portions corresponding to the inner edge and the outer edge thereof, and when the insulating cover member is disposed thereon, the ridges are formed. There is a possibility that the touch of the finger of the operator touching the surface of the insulating cover member may give an uncomfortable feeling.

Therefore, when the insulating resin layer is formed in a two-layer structure of an upper insulating layer and a lower insulating layer, it is preferable to form the upper insulating layer so as not to overlap the inner edge and the outer edge of the lower insulating layer. preferable. As described above, the thickness of the lower insulating layer surrounded by the inner edge and the outer edge is smaller than the thickness of the inner edge and the outer edge. If the upper insulating layer is formed so as to overlap the region surrounded by the inner edge and the outer edge of the lower insulating layer, and the region is substantially filled with the upper insulating layer, the unevenness formed on the surface of the insulating resin layer Can be reduced. As a result, the operator's fingertip hardly gives an uncomfortable feeling, and the commercial value is increased. In particular, when a plurality of switch structures are provided on an insulating substrate, the area touched by the operator's fingertip becomes large, so that this effect becomes more remarkable.

[0012]

1 and 2 show a first example (basic structure) of an embodiment of a circuit board with a push-on switch according to the present invention. FIG. 1 shows this push-on switch. FIG. 2 is a partial cross-sectional view of the circuit board with a switch, and FIG. 2 is a partial plan view of the circuit board with a push-on switch without an insulating cover member. Parts corresponding to those in FIGS. 4 and 5 described above are denoted by the same reference numerals.

In this circuit board with a push-on type switch, the spacer 6 'is made of, for example, a conventionally used insulating resin paste for forming an overcoat (for example, a thermosetting resin paste such as an epoxy resin, or an ultraviolet curable resin paste). It is formed by a two-layer insulating resin layer 5 formed on the surface of the insulating substrate 1 using a resin paste or the like. That is, the insulating resin layer 5 has a structure in which the overcoat has two layers, and has a two-layer structure including the lower insulating layer 5A and the upper insulating layer 5B laminated thereon. In particular, the upper insulating layer 5B is formed in the contact pattern forming region 4
5Aa of the lower insulating layer 5A surrounding the periphery of the substrate and the outer edge 5 of the lower insulating layer 5A located on the outer peripheral side of the insulating substrate 1.
It is formed so as not to overlap with Ab. Both the lower insulating layer 5A and the upper insulating layer 5B are formed by known screen printing. Specifically, a mask having a paste non-passing region formed thereon is placed on the insulating substrate 1 so that the insulating resin paste does not adhere to the contact pattern forming region 4, and the insulating resin paste is applied on the mask. Formed. The size of the paste non-passing region corresponding to the contact pattern forming region 4 of the mask forming the upper insulating layer 5B is the size of the paste non-passing region corresponding to the contact pattern forming region 4 of the mask forming the lower insulating layer 5A. It is formed larger than the size.

When the lower insulating layer 5B is formed by screen printing, as described above, a raised portion is formed at the inner edge portion 5Aa and the outer edge portion 5Ab. The thickness is smaller than the thickness of the ridge. Therefore, the thickness of the upper insulating layer 5B is such that the region surrounded by the inner edge 5Aa and the outer edge 5Ab of the lower insulating layer 5B can be substantially filled.
If the upper insulating layer 5B is formed so as to overlap on a region surrounded by the inner edge portion 5Aa and the outer edge portion 5Ab of the lower insulating layer 5A, and the region is substantially filled with the upper insulating layer 5B, the surface of the insulating resin layer 5 can be formed. The unevenness difference formed on the substrate becomes smaller. Since the upper insulating layer 5B is thinner than the lower insulating layer and the inner edge portion 5Aa and the outer edge portion 5Ab of the lower insulating layer 5A form a frame portion, as in the case where the lower insulating layer 5A is formed, Its inner and outer edges do not rise significantly.

On the upper insulating layer 5B existing on the surface of the insulating substrate 1, a sheet-like insulating cover member 8 is provided.
Are adhered through an adhesive sheet 7. As described above, the adhesive sheet 7 has a structure in which an adhesive is applied to both surfaces of a synthetic resin sheet. The insulative cover member 8 is provided with a dome-shaped movable portion 8 a so as to have a convex shape outward at the contact pattern forming region 4. The insulating cover member 8 is formed of an insulating resin such that the movable portion 8a can be restored to its original shape after being deformed with appropriate elasticity by a pressing operation, similarly to the above-described conventional example. On the lower surface of the movable portion 8a, a movable contact 11 that short-circuits the pair of contact patterns 2a and 2b when it comes into contact with the pair of fixed contact patterns 2a and 2b is provided on the adhesive sheet 7.
Mounted through. Due to the presence of the dome-shaped movable portion 8a and the spacer 6 ', the movable contact 11 provided with the movable portion 8a between the movable portion 8a and the fixed contact patterns 2a, 2b is brought into contact with a pair of contact patterns. Therefore, when the pressing force applied to the movable portion 8a is released, a restoring force for returning the movable contact 11 provided on the movable portion 8a to a position away from the pair of contact patterns and holding the movable contact 11 is generated,
In addition, an interval (push stroke) H is formed such that a click feeling can be generated at the fingertip of the operator during the restoration.

As shown in this example, when the insulating resin layer 5 is formed into a two-layer structure by applying two layers of an insulating resin paste for forming an overcoat covering a main portion of the surface of the insulating substrate 1 excluding the contact points, and The insulating resin layer 5 having a sufficient thickness for forming the spacers 6 'can be easily and inexpensively formed by using an inexpensive and easily available insulating resin paste used in the present invention. When the spacer 6 ′ is formed by thickening the insulating resin layer 5 formed on the surface of the insulating substrate 1 using the insulating resin paste, a step of forming the insulating resin layer 5 on the surface of the insulating substrate 1 Can form the spacer 6 'together. Therefore, as before,
There is no need to manufacture in advance a component called a spacer 6 provided with a hole 10 corresponding to the contact pattern forming region 4, and a step of attaching the spacer 6 to the insulating cover member 8 side with an adhesive sheet is not required, thereby manufacturing. Cost can be reduced.

FIG. 3 is a plan view showing a second embodiment of the circuit board with push-on switches according to the present invention, in which an insulating cover member is omitted. 1 and 2 are denoted by the same reference numerals.

In this circuit board with push-on switches, a pair of fixed contact patterns 2a, 2b opposed to each other at a predetermined interval in the direction of the surface of the insulating board 1 are provided on the insulating board 1.
Are formed on the surface. On the surface of the insulating substrate 1, a spacer 6 'is formed by a two-layer insulating resin layer 5 using the same insulating resin paste as in the previous example. The spacer 6 ′ is formed in a contact pattern forming region 4 in which at least four pairs of fixed contact patterns 2 a and 2 b are formed on the surface of the insulating substrate 1.
Except for the above, it is formed of an insulating resin layer 5 formed by curing an insulating resin paste applied on a main surface region facing an insulating cover member described later. Insulating resin layer 5
Although not shown in this figure, since it is formed in the same manner as shown in FIG. 1, it will be described with reference to FIG. That is, the insulating resin layer 5 has a two-layer structure including the lower insulating layer 5A and the upper insulating layer 5B laminated thereon. The lower insulating layer 5A includes an inner edge 5Aa around the contact pattern forming region 4 and an outer edge 5Ab of the outer edge of the insulating substrate 1.
Are thinner than the thickness of the inner edge portion 5Aa and the outer edge portion 5Ab. Upper insulating layer 5
B is an inner edge 5Aa and an outer edge 5Ab of the lower insulating layer 5B.
Are formed so as to overlap on a region surrounded by. The thickness of the upper insulating layer 5B is such that the region surrounded by the inner edge 5Aa and the outer edge 5Ab of the lower insulating layer 5B can be substantially filled. Adjacent contact pattern forming area 4
The air passage 13 communicates with each other, and when the movable portion 8a of one push-on switch 12 is pushed to reduce the volume in the one movable portion 8a, the air in the one movable portion 8a is released. It is moved to the other movable portion 8a side.

On the upper insulating layer 5B existing on the surface of the insulating substrate 1, a movable portion 8a having a movable contact 11 having a structure similar to that shown in FIG. The insulating cover member 8 provided in this way is joined via the adhesive sheet 7.

With such a structure, a circuit board with a push-on switch having a plurality of push-on switches 12 on the insulating substrate 1 can be manufactured at low cost. In particular, the insulating resin layer 5 is formed so that the upper insulating layer 5B does not overlap the inner edge portion 5Aa and the outer edge portion 5Ab of the lower insulating layer 5A (that is, the upper insulating layer 5B) as in the above example.
Is formed on a region surrounded by the inner edge portion 5Aa and the outer edge portion 5Ab of the lower insulating layer 5A), and the region is substantially filled with the upper insulating layer 5B. The unevenness difference is reduced, and the fingertip of the operator touching the surface of the insulating cover member 8 having a large area hardly gives an uncomfortable feeling.

In the above two examples, the insulating resin layer 5 has a two-layer structure, but the insulating resin layer 5 may be formed as a single layer. In this case, the thickness of the spacer 6 used in the conventional circuit board with a push-on switch is also required.
It is necessary to secure this one layer of the insulating resin layer 5. In order to make this possible, the viscosity of the insulating resin paste forming the insulating resin layer 5 may be increased, or the material of the insulating resin paste may be appropriately selected.

[0022]

According to the present invention, the spacer is formed by thickening the insulating resin layer formed on the surface of the insulating substrate using the insulating resin paste. Spacers can be formed together. Therefore, unlike the related art, it is not necessary to separately manufacture a component called a spacer having holes corresponding to the contact pattern forming regions, and a step of attaching the spacer to the insulating cover member side with an adhesive sheet is not required. Manufacturing costs can be reduced.

In particular, when the insulating resin layer is formed with a two-layer structure of a lower insulating layer and an upper insulating layer, the upper insulating layer is overlapped on a region surrounded by the inner edge and the outer edge of the lower insulating layer. Formed, and the region is substantially filled with the upper insulating layer,
The unevenness difference formed on the surface of the insulating resin layer can be reduced, and almost no uncomfortable feeling is given to the fingertip of the operator, and the commercial value can be increased.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a first example of an embodiment of a circuit board with a push-on switch according to the present invention.

FIG. 2 is a plan view of the circuit board with a push-on switch shown in FIG. 1 in a state where an insulating cover member is omitted.

FIG. 3 is a plan view showing a second example of the embodiment of the circuit board with push-on switches according to the present invention, omitting an insulating cover member.

FIG. 4 is a longitudinal sectional view showing a conventional circuit board with a push-on switch.

5 is a plan view of the circuit board with a push-on switch shown in FIG. 4 in a state where an insulating cover member is omitted.

FIG. 6 is a longitudinal sectional view showing an example of a manufacturing process of a conventional circuit board with a push-on switch.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating board 2a, 2b A pair of fixed contact pattern 3 Circuit pattern 4 Contact pattern formation area 5 Insulating resin layer 6, 6 'spacer 7 Adhesive sheet 8 Insulating cover member 8a Movable part 9 Adhesive sheet 10 Hole 11 Movable contact 12 Push ON-type switch 13 Air passage

Claims (4)

[Claims] 1. An insulating substrate having a circuit pattern including a pair of fixed contact patterns facing each other at a predetermined interval formed on a surface thereof, and short-circuiting between the pair of contact patterns when contacting the pair of contact patterns. A sheet-shaped insulating cover member having a movable portion to which a movable contact is attached and attached to the surface of the insulating substrate; and a predetermined distance between the movable contact and the pair of fixed contact patterns. In order to ensure, a circuit board with a push-on switch including a push-on switch comprising a spacer disposed between the insulating substrate and the insulating cover member, wherein the spacer is With a push-on switch, characterized by being formed by an insulating resin layer formed on the surface of the insulating substrate using an insulating resin paste Circuit board. 2. An insulating substrate having a circuit pattern including a plurality of paired fixed contact patterns opposed to each other at a predetermined interval formed on the surface thereof, and a short circuit between the pair of contact patterns when the circuit pattern contacts the pair of contact patterns. An insulating cover member made of a flexible synthetic resin sheet attached to the surface of the insulating substrate and having a plurality of movable parts to which movable contacts are attached; and the movable contact and the pair of fixed contacts. A spacer arranged between the insulating substrate and the insulating cover member to secure a predetermined distance between the pattern and the insulating cover member; When the pressing force applied to the movable portion to release the contact to the pair of contact patterns is released, the movable contact returns to a position away from the pair of contact patterns. A push-on switch-equipped circuit board comprising a push-on switch configured to generate a restoring force to be held, wherein the spacer has at least a plurality of the surfaces of the insulating substrate. Except for a contact pattern forming region where a pair of fixed contact patterns are formed, the insulating resin paste is formed by curing an insulating resin layer applied on a main surface region facing the insulating cover member. A circuit board with a push-on switch. 3. The insulating resin layer has a two-layer structure including a lower insulating layer and an upper insulating layer, and the upper insulating layer does not overlap an inner edge and an outer edge of the lower insulating layer. The circuit board with a push-on type switch according to claim 1, wherein the circuit board is formed with a switch. 4. The insulating resin layer has a two-layer structure including a lower insulating layer and an upper insulating layer, and the lower insulating layer has a thickness of a portion surrounded by an inner edge and an outer edge thereof. Is thinner than the thickness of the inner edge portion and the outer edge portion, and the upper insulating layer is formed so as to overlap a region surrounded by the inner edge portion and the outer edge portion of the lower insulating layer, The circuit with a push-on switch according to claim 1 or 2, wherein a thickness of the layer has a thickness capable of substantially filling a region surrounded by the inner edge portion and the outer edge portion of the lower insulating layer. substrate.