JPH118287A - Wafer-carrying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce particles generated at the time of positioning a wafer. SOLUTION: In a wafer-mounting arm 51, wafer-mounting parts 51a and 51a, on which the wafer W where a positioning cut part Wa is formed on a part of a circular outer periphery, is mounted are formed at tip parts. In the wafer-mounting parts 51a and 51a, an ascending/descending table through-part 51c through which an ascending/descending table 76 having a wafer-supporting face 76a on an upper face can pass through vertically is formed. When the wafer-mounting arm 51 is advanced to a state where the ascending/descending table 76 raises the wafer W slightly, a first abutting member 52a arranged in a position facing the positioning cut part Wa of the wafer W and a second abutting member 52b arranged at a position which faces the other outer peripheral part of the wafer W push to move the wafer W on the assenting/descending table and position it in a prescribed position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer for forming a semiconductor integrated circuit on a surface or a wafer having a semiconductor integrated circuit formed on a surface, which is externally carried into a vacuum sample chamber for inspection, length measurement, and the like. The present invention relates to a wafer transfer device that is used when a wafer is inspected, inspected, and unloaded a wafer whose length has been measured, and particularly to a wafer transfer device that can position the wafer when the wafer is loaded into the vacuum sample chamber. .

[0002]

2. Description of the Related Art Conventionally, as the wafer transfer device,
The technology shown in the following (J01) is known. (J01) Techniques shown in FIGS. 13 to 16 FIG. 13 is a plan view of a conventional example of a wafer transfer apparatus of the type described above. FIG. 14 is a view of FIG. 13 as viewed from the arrow XIV. 15A and 15B are explanatory views of a mechanism for positioning a wafer placed on a rotary table. FIG. 15A is an overall explanatory view, and FIG. 15B is an enlarged explanatory view of a main part. FIG.
FIG. 16 is a plan view of a rotation drive mechanism and a wafer positioning mechanism of the turntable shown in FIG. 15. In order to facilitate understanding of the following description, coordinate axes X, Y, and Z that are orthogonal to each other are defined in the drawings, and the arrow X direction is forward, the arrow Y direction is left, and the arrow Z direction is upward. And In this case, the direction opposite to the X direction (−X direction) is backward, the direction opposite to the Y direction (−Y direction) is rightward, and the direction opposite to the Z direction (−Z direction) is downward. In addition, the front-back direction or the X-axis direction including the X direction and the -X direction, the left-right direction or the Y-axis direction including the Y direction and the -Y direction, the vertical direction including the Z direction and the -Z direction, or Let's call it the Z-axis direction. Furthermore, in the figure, those with “•” in “「 ”mean the arrow pointing from the back of the paper to the front, and those with“ x ”in“ ○ ”from the table on the paper It shall mean an arrow pointing to the back.

[0003] In FIGS. 13 and 14, a vacuum sample chamber (vacuum work chamber) 01 used for operations such as wafer inspection and length measurement is provided with a sample exchange chamber (backup) through an internal gate valve 02. (Exhaust chamber) 03 is connected. The sample exchange chamber 03 is connected to the atmosphere via an external gate valve 04. On the sample exchange chamber 03, a cassette carrier 06 (see FIG. 14) for accommodating a plurality of wafers W is arranged. A vertical hollow prism 07 is disposed outside the external gate valve 04. Inside the prism 07, a screw shaft 08 that can rotate forward and reverse and a nut 09 that moves up and down by rotation of the screw shaft 08 are provided. Are located. The vertically moving nut 09 protrudes outside the prism 07 through a slit 07a formed on one side surface of the prism 07. A slider 011 arranged outside the prism 07 is fixed to the vertical nut 09. The slider 011 moves up and down integrally with the nut 09. A support plate 012 is fixed to the upper surface of the slider 011. On the upper surface of the support plate 012, an external moving arm 013 for mounting and transporting a wafer and an arm moving mechanism (not shown) for moving the external moving arm 13 forward and backward are supported. The arm advance / retreat mechanism is conventionally known.

The position of the wafer W stored in the cassette carrier 06 is indicated by W1 in FIGS. The wafer W at the accommodation position W1 is taken out of the cassette carrier 06 with its lower surface supported (lifted) by the external moving arm 013, and moves to the position W2 in FIG. Next, when the support plate 012 is lowered, the wafer W is lowered and moved to the position W3 (see FIG. 13). Next, when the external movement arm 013 is advanced toward the sample exchange chamber 03, the wafer W moves into the sample exchange chamber 03 from the external gate valve 04. A vertically movable lifting rod 014 and a wafer mounting arm 015 are arranged inside the sample exchange chamber 03. The wafer mounting arm 015 can move forward and backward with respect to the vacuum sample chamber (vacuum working chamber) 01 by a wafer mounting arm moving device (not shown). The wafer mounting arm moving device is conventionally known.

The wafer W carried into the sample exchange chamber 03 by the external moving arm 013 is lifted by the lifting rod 014 at the position W4. In this state, the external moving arm 013 retreats (retreats) to the outside. Next, when the lifting rod 014 is lowered, the wafer W is also lowered, and is mounted on the wafer mounting arm 015.
At this time, the position W5 of the wafer W is below the W4.

Next, the external gate valve 04 is closed, and the inside of the sample exchange chamber 03 is evacuated. After the sample exchange chamber 03 is evacuated, the internal gate valve 02 is opened, and the wafer mounting arm 015 is advanced to carry the wafer W into the vacuum sample chamber (vacuum work chamber) 01. At this time, the position of the wafer W (sample exchange position in the vacuum chamber) is indicated by W6. After transferring the wafer W to the sample support member (not shown) in the vacuum sample chamber 01 at this position W6, the wafer mounting arm 015 returns to the sample exchange chamber 03.

Next, the inside of the vacuum sample chamber 01 will be described with reference to FIGS. In FIG. 15A, a sample stage 021 for moving the wafer W to a position (working position) where observation, inspection, length measurement, and the like are performed by an electron microscope is arranged inside the vacuum sample chamber 01. The sample stage 021 includes a Y-axis moving table 023 supported movably in the Y-axis direction (left-right direction) on a support plate 022 fixed and supported by an outer wall member (not shown) forming the vacuum sample chamber 01, and The Y-axis moving table 023
An X-axis moving table 024 supported on the top so as to be movable in the X-axis direction (front-back direction) is provided. On the X-axis moving table 024, a circular rotary table 026 is rotatably supported via a bearing 027. The rotary table 026 has a gear 028 formed on the outer periphery thereof, and the gear 028 meshes with a worm gear 029 rotated by a table drive motor M3 (see FIG. 16). The rotary table 026 is configured to rotate with the rotation of the worm gear 029.

[0008] The rotary table 026 is provided with an upper and lower part for receiving the wafer W transferred into the vacuum sample chamber 01 by the wafer mounting arm 015 and moving the worked wafer W to the upper surface of the wafer mounting arm 015. The moving table 031 is supported so as to be able to move up and down.

An electrostatic plate 032 is provided on the rotary table 026 around the vertical movement table 031. The wafer W placed on the electrostatic plate 032 is sucked and held by the electrostatic plate 032. Outside the electrostatic plate 032, there are provided reference rollers 033, 033 and 034 (see FIG. 16) rotatable around a vertical axis for positioning the wafer W, and a moving roller 036. Moving roller 03 rotatable about the vertical axis
Reference numeral 6 denotes a vertical axis 038 in an arm accommodation groove 037 (see FIGS. 15 and 16) provided on the upper surface of the rotary table 026.
(See FIG. 16) Supported by a swing arm 039 that can swing around (ie, in the horizontal direction). FIG. 15A
As shown in the figure, a swing operated member 041 extending downward is provided at the tip of the swing arm 039. The swing operated member 041 is constantly urged toward the center of the rotary table 026 by a tension spring 042 disposed on the lower surface of the rotary table 026. The swing actuated member 04
1 is in contact with a ball 043a at the tip of a nut 043. The nut 043 is provided integrally with a guided bar 044, and the guided bar 044 is slidably engaged with a guide groove 046a formed in a bracket 046 supported by the rotary table 026.

A work positioning motor 047 is supported by the bracket 046. A bolt shaft (shaft formed with a screw) 048 rotated by the work positioning motor 047 is screwed with the nut 043. Therefore, when the work positioning motor 047 rotates, the bolt shaft 048 rotates, and the nut 043 and the guided bar 044 move along the guide groove 046a. At that time, the swing operated member 041 and the swing arm 039 is configured to swing around the vertical axis 038. The movable roller 036 is moved by the swing of the swing arm 039, and the wafer W at the position indicated by the two-dot chain line in FIG. 16 is moved to the solid line position for positioning. In addition, at both ends of the moving range of the nut 043 and the guided bar 044, there are provided limit switches 0 which are activated by contact with the guided bar 044.
51 and 052 are arranged, and the moving range of the nut 043 is restricted.

In FIG. 15, a wafer mounting arm 01
The wafer W transferred into the vacuum sample chamber 01 by 5 is
It is lifted by the vertical movement table 031. And
After the wafer mounting arm 015 retreats into the sample exchange chamber 02, the vertical movement table 031 is lowered, and the wafer W is supported by the electrostatic plate 032. This state is indicated by a two-dot chain line in FIG. Next, when the swing arm 039 is swung to move the movable roller 036 toward the center of the rotary table 026, the movable roller 036 is moved.
The wafer W pushed by is moved to the position shown by the solid line in FIG. 16, is positioned at a predetermined position on the rotary table 026, and is fixed. At this time, the wafer W is pressed toward the center position of the rotary table 026 by the moving roller 036, and is positioned in contact with the plurality of reference rollers 033, 033, and 034. The wafer W fixed on the rotating table 026 in this manner is moved to a desired position provided in the vacuum sample chamber 01 by the rotating table 026, the X-axis moving table 024, and the Y-axis moving table 023 for observation and inspection. , Length measurement, drawing, etc. are performed.

[0012]

However, the prior art (J01) has the following problems. (Problem of the above (J01)) The wafer W is placed on the rotary table 0
When the wafer W is moved from the position indicated by the two-dot chain line in FIG. 16 to the position indicated by the solid line in order to position the wafer W at a predetermined position on the electrostatic plate 032, the wafer W moves. In this case, since the frictional force of the contact surface between the wafer W and the electrostatic plate 032 is large, the wafer W
Particles (fine dust) tend to be generated due to friction between the substrate and the electrostatic plate 032. Therefore, rather than moving and positioning the wafer W on the electrostatic plate 032 while holding the wafer W on the electrostatic plate 032 by suction, the electrostatic plate 03 with the wafer W positioned is
The particles can be reduced by placing them on the substrate 2 and holding them by suction. Further, when the fixed wafer W positioned at the predetermined position on the rotary table 026 is deformed and warped as shown in FIG. 15B, it is difficult to press and position the wafer W.

In the prior art (J01), the plurality of reference rollers 033, 033 and 034 are fixed to the rotary table 026 according to the size of the wafer W. Therefore, it is necessary to use a rotary table 026 to which a plurality of reference rollers 033, 033, and 034 are fixed at positions corresponding to the size of the wafer W. For this reason, the rotary table 026 must be replaced according to the size of the wafer W. In order to replace the rotary table 026, the high vacuum in the vacuum sample chamber 01 must be released once. For this reason, there is a problem that it takes a long time to make the vacuum sample chamber a high vacuum again after replacing the rotary table 026, and the work efficiency is reduced. Further, since a plurality of replacement rotary tables must be prepared according to the size of the wafer W, the cost increases.

The present invention has been made in view of the above circumstances, and has the following content as an object. (O01) To reduce particles generated when positioning a wafer. (O02) To provide a low-cost wafer transfer device capable of positioning with respect to wafers of various sizes.

[0015]

Next, the present invention devised to solve the above-mentioned problems will be described. The elements of the present invention are used to facilitate correspondence with the elements of the embodiments described later. , The reference numerals of the elements of the embodiment are enclosed in parentheses. The reason why the present invention is described in correspondence with the reference numerals of the embodiments described below is to facilitate understanding of the present invention and not to limit the scope of the present invention to the embodiments.

(Invention) In order to solve the above-mentioned problems, a wafer transfer apparatus of the invention has the following requirements. (A01) A positioning cutout ( Wa; 101) is formed at the tip thereof on which a wafer (W) on which a wafer (W) is formed is formed. The wafer mounting portion (51a, 51a) has a wafer support surface on its upper surface. (76a)
6) The vertical table penetrating part (51c) that can penetrate vertically
(A02) The wafer mounting arm (51), on which the positioning cutout (Wa; 101) is supported by the wafer mounting arm (51), and a base end of the wafer mounting arm (51) is formed. The first contact member disposed at a position facing the positioning cutout (Wa; 101) of the wafer (W) mounted on the wafer mounting portion (51a, 51a) in a state of being disposed on the side. (52a; 102) and a positioning contact member having a second contact member (52b) disposed at a position facing another outer peripheral portion disposed on the base end side of the wafer mounting arm (51). (52a + 52
b), (A03) A wafer mounting arm moving device (31-49) for moving the wafer mounting arm (51) to the distal end side and the base end side. (A04) The positioning cutout (Wa; 101) of the wafer (W) is connected to the first contact member (5).
2a; 102) and the wafer (W) is placed on the wafer in a state where the other outer peripheral portion of the wafer (W) is located at a position facing the second contact member (52b). A wafer mounting device (13 to 30, C1, M2) mounted on the section (51a, 51a).

(Operation) Next, the operation of the present invention having the above-described features will be described. In the wafer transfer device of the present invention having the above-described features, a positioning cutout (Wa; 1) is provided at a part of the circular outer periphery at the tip of the wafer mounting arm (51).
The wafer mounting portion (51a, 51a) for mounting the wafer (W) on which the (01) is formed is formed. The wafer mounting arm (51) includes a first contact member (52a; 10).
2) and a positioning contact member (52a + 52b) having a second contact member (52b). The wafer (W) is placed on the wafer mounting portion (51a, 51a) in a state where the positioning cutout (Wa; 101) of the wafer (W) is arranged on the base end side of the wafer mounting arm (51). ) Is placed on the first contact member (52a;
102) is disposed at a position facing the positioning cutout (Wa; 101), and the second abutment member (52b) is provided at another position disposed on the base end side of the wafer mounting arm (51). It is arranged at a position facing the outer peripheral portion.

Wafer mounting device (13 to 30, C1, M
2) is a cutting part (Wa; 10) for positioning the wafer (W).
1) is disposed at a position facing the first contact member (52a; 102), and another outer peripheral portion of the wafer (W) is disposed at a position facing the second contact member (52b). The wafer (W) is placed on the wafer mounting portion (51a,
51a). The wafer mounting arm (51)
Is moved to the base end side, and the wafer mounting device (13
The wafer (W) is placed on the wafer placement section (52a, 52a) by using the wafer placement arm moving device (31-49) in this state. It is moved to a position where the lifting table (76) is arranged. That is, the wafer mounting arm (5)
1) is moved from the proximal end side to the distal end side. The lifting table (76) is provided with the wafer mounting portions (51a, 51a).
The elevating table penetrating portion (51c) formed in (a) is moved upward to slightly lift the wafer (W) placed on the wafer placing portion (51a, 51a) by the wafer support surface (76a).

In this state, the wafer mounting arm (5)
When the wafer (W) on the elevating table (76) is further moved by a predetermined distance toward the front end side, the wafer (W) on the elevating table (76) is brought into contact with the first contact member (52a; ) And the second contact member (52b). At this time, the first contact member (52a;
102) and the second abutting member (52b), respectively, a positioning cutout (Wa; 101) for positioning the wafer (W) on the wafer support surface (76a) of the elevating table (76).
Then, the wafer (W) is pushed to the front end side in a state where the wafer (W) is in contact with the outer peripheral portion. At this time, the wafer (W) on the wafer support surface (76a) moves by a predetermined distance toward the front end on the wafer mounting arm (51), and moves to a predetermined position on the wafer support surface (76a). It is supported in a predetermined posture. Thereafter, after moving the wafer mounting arm (51) to the base end side and lowering the elevating table (76), the wafer (W) on the wafer support surface (76a) is moved to the elevating table (76). ) Can be mounted at a predetermined position on another wafer mounting table (for example, an electrostatic suction table) arranged on the outer periphery of (1).

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) Embodiment 1 of the wafer transfer apparatus of the present invention is characterized in that the wafer transfer apparatus of the present invention has the following requirements. (A05) Base end (3
4) a first rotating arm (36) for transferring a wafer, which is driven to rotate around a rotation center axis (A1), and a tip end of the first rotating arm (36) can be rotated by a first connecting shaft (37). And a second rotating arm for transferring a wafer having a distal end rotatably connected to a proximal end of the wafer mounting arm (51) by a second connecting shaft (43). (42) and the first rotating arm (3
6) a rotation driving device (M1) for rotating a wafer for driving the rotation about the rotation center axis (A1), and a rotation of the first rotation arm (36) at a rotation angle θ about the rotation center axis (A1). The second rotation arm (42) is rotated around the first connection axis (37) by a rotation angle of −2θ in conjunction with the rotation of the wafer mounting arm (51) around the second connection axis (43). The wafer mounting arm moving device (31) having a rotation interlocking mechanism for rotating by a rotation angle θ.
49), (A06) the rotation center axis (A1) and the first
The rotation center axis (A1) and the first connection axis, wherein the distance between the connection axes (37) and the distance between the first connection axis (37) and the second connection axis (43) are set to the same value. (37)
And the second connection shaft (43), (A07) the direction of the straight line when the rotation center axis (A1), the first connection shaft (37) and the second connection shaft (43) are aligned. The wafer mounting arm (51) extending in the same direction as the above.

(Operation of the First Embodiment) In the first embodiment of the wafer transfer device according to the present invention, the rotary drive device (M1) for transferring a wafer of the wafer mounting arm moving device (31-49) is provided with a wafer. The first rotating arm (3
The base end (34) of 6) is rotationally driven around the rotation center axis (A1). The rotation interlocking mechanism includes the first rotation arm (3
6) rotating the second rotary arm (42) about the first connection axis (37) by a rotation angle -2θ in conjunction with the rotation of the rotation angle θ about the rotation center axis (A1) of The wafer mounting arm (51) is rotated by the rotation angle θ around the second connection shaft (43). At this time, the distance between the rotation center axis (A1) and the first connection shaft (37) and the distance between the first connection shaft (37) and the second connection shaft (4) are determined.
3) Since the distance between them is set to the same value, the direction in which the wafer mounting arm (51) extends, that is, the direction of the line connecting the distal end portion and the proximal end portion of the wafer mounting arm (51) changes. do not do. Further, the rotation center axis (A
1) Since the direction of the straight line when the first connection shaft (37) and the second connection shaft (43) are arranged in a straight line and the direction in which the wafer mounting arm (51) extends are the same, The wafer mounting arm (51) moves along the extending direction.

According to the first embodiment, the stroke of the wafer mounting arm (51) depends on the distance between the rotation center axis (A1) and the first connection shaft (37) and the first connection shaft (37). 37) and twice the sum of the distance between the second connecting shaft (43). Then, when the wafer mounting arm (51) has advanced most (moved to the distal end side), the distance between the wafer mounting portion (51a, 51a) at the distal end and the rotation center axis (A1) is as described above. Rotation center axis (A1)
And the distance between the first connection shaft (37), the distance between the first connection shaft (37) and the second connection shaft (43), and the length of the wafer mounting arm (51). The position of the wafer (W) on the wafer support surface (76a) of the elevating table (76) depends on the position of the wafer mounting arm (51).
Is moved to the most distal end side when the first contact member (52a;
102) and the position of the second contact member (52b). However, in the first embodiment, when the rotation center axis (A1) is rotated by 180 ° from the state where the wafer mounting arm (51) is moved to the position closest to the base end, the wafer mounting arm (51) is rotated. The arm (51) moves to the most distal position, and when the rotation center axis (A1) is further rotated, the wafer mounting arm (51) moves to the base end side.

That is, the wafer mounting arm (5)
When the rotation center axis (A1) is rotated through a position having a rotation angle of 180 ° from the state where 1) is moved to the position closest to the base end, the wafer is supported by the wafer mounting arm (51). The first abutment member (52a; 102) and the second abutment member (52b) move forward to the most distal position and then retreat. Therefore, in the first embodiment, the rotation center axis (A1) and the first connection axis (37)
The distance between the first connecting shaft (37) and the second connecting shaft (43) is appropriately set, and the first contact member (52a; 52a) supported by the wafer mounting arm (51). 10
2) The position of the second contact member (52b) is appropriately set, and the rotation center axis (A1) is set at a rotation angle of 180 °.
° so that the position of the wafer (W) on the wafer support surface (76a) of the elevating table (76) can be easily set to a predetermined position (without performing special position control). ) Can be arranged.

(Embodiment 2) Embodiment 2 of the wafer transfer apparatus of the present invention is characterized in that the wafer transfer apparatus of the present invention or Embodiment 1 has the following requirements. (A08) The rotation center axis (A1), the first connection axis (37), and the second connection axis (43) are on one straight line, and the wafer mounting portion (51) is on the rotation center axis (A1).
a, 51a) approach the rotation angle θ of the first arm =
When the arm is in a contracted state of 0 ° and the state in which the state is rotated from the state to a rotation angle θ of the first rotation arm (180) of 180 ° is an arm extension state, the rotation angle of the first rotation arm (36) is determined. At the position of (θ + α) °, the lifting table (76) is raised to lift the wafer support surface (76).
a) A wafer (W) is placed on the top, and in this state, the first
The wafer mounting arm moving device (31 to 31) is configured to rotate the rotating arm by passing through a rotation angle of θ = 180 °.
49) an arm movement control device (M1) for controlling

(Operation of the Second Embodiment) In the second embodiment of the wafer transfer device of the present invention, the arm movement control device (M
1) The rotation center axis (A1), the first connection axis (37) and the second connection axis (43) are on one straight line, and the wafer mounting portions (51a, 51a) are on the rotation center axis (A1). Is the arm contracted state in which the rotation angle of the first arm is θ = 0 °, and the state in which the first arm is rotated to the rotation angle θ of 180 ° is the arm extended state. Then, at a position where the rotation angle of the first rotating arm (36) is (θ + α) °, the elevating table (76) is raised to place the wafer (W) on the wafer support surface (76a). In the state, the first rotating arm is set to θ =
The wafer placement arm moving devices (31 to 49) are controlled so as to rotate through a rotation angle of 180 °. By such control, the lifting table (76)
The position of the wafer (W) on the wafer support surface (76a) can be easily arranged at a predetermined position (without performing special position control).

[0026]

Next, with reference to the drawings, an example (embodiment) of an embodiment of the wafer transfer apparatus of the present invention will be described, but the present invention is not limited to the following embodiment. (Embodiment 1) FIG. 1 is an overall explanatory view of Embodiment 1, and FIG. 1A is a perspective view of a wafer transfer device provided in an apparatus for inspecting and measuring a length of a wafer using an electron microscope. 1
FIG. 2B is a perspective view of the cassette carrier 4 of FIG. 1A viewed from another angle. FIG. 2 is a plan view of FIG. FIG. 3 is a plan view of the inside of the sample exchange chamber, and is a cross-sectional view taken along line III-III of FIG. FIG. 4 is a plan view of the sample exchange chamber, and FIG.
It is a V line sectional view. FIG. 5 is a longitudinal sectional view of the sample exchange chamber,
FIG. 5 is a sectional view taken along line VV of FIG. 3. FIG. 6 is a sectional view taken along the line VI-VI of FIG. FIG. 7 is an operation explanatory view of the wafer mounting arm moving device shown in FIG. 5, and FIG. 7A is a view showing a state where the wafer mounting arm is in a contracted state;
FIG. 7B is a diagram showing a state where the wafer mounting arm has moved forward. 8A and 8B are explanatory views of the operation of the wafer mounting arm moving device shown in FIG. 5. FIG. 8A is a view showing a state where the wafer mounting arm is in an extended state. FIG. It is a figure showing the state where it retreated. FIG. 9 is an explanatory diagram of a first contact member and a second contact member of the wafer transfer device according to the first embodiment of the present invention. FIG. 9A is a plan view,
FIG. 9B is a sectional view taken along line IXB-IXB of FIG. 9A. FIG. 10 is an explanatory view of a table in the vacuum sample chamber shown in FIG. 1, FIG. 10A is an overall explanatory view, and FIG.
3 is a sectional view taken along line XB-XB of FIG. FIG.
It is a top view of the rotation drive mechanism of the rotary table shown in FIG.

In FIG. 1, a vacuum sample chamber (vacuum work chamber) 1 in which observation, inspection, length measurement or drawing of a sample such as a silicon wafer is performed in a vacuum by an electron beam apparatus U such as an electron microscope and an electron beam drawing apparatus. Left side (Y side)
A sample exchange chamber (preliminary evacuation chamber) 2 is provided adjacent to. An internal gate valve 3 (see FIGS. 2 to 6) is provided between the vacuum sample chamber 1 and the sample exchange chamber 2. The internal sample valve 3 is configured so that the vacuum sample chamber 1 and the sample exchange chamber 2 are communicated or airtightly shut off. The vacuum sample chamber 1 and the sample exchange chamber 2 are each evacuated by a vacuum pump (not shown). On the upper surface of the sample exchange chamber 2, a plurality of wafers W
A cassette carrier 4 for accommodating the same is disposed, and an external gate valve 5 (see FIG. 2) is provided on each side surface. In FIG. 3, the sample exchange chamber 2 is provided with an opening 2a corresponding to the external gate valve 5.
Are configured to slide open and close by sliding in the Y-axis direction.

In FIG. 1, a vertical hollow prism 6 is disposed behind (−X direction) the external gate valve 5 of each of the sample exchange chambers 2. The lower end of the prism 6 is supported by a turntable 7 and is configured to be rotatable about a vertical axis. Inside the prism 6, a screw shaft (not shown) that can be rotated forward and backward and a nut (not shown) that moves up and down by rotation of the screw shaft are arranged. The vertical nut protrudes outside the prism 6 through a slit 6 a formed on one side surface of the prism 6, and the protruding portion is connected to the elevator 8. Therefore, the elevator 8 is configured to be vertically movable together with the vertically movable nut. The elevator 8 of the first embodiment has a length such that the tip of the elevator 8 contacts the vacuum sample chamber 1 when the elevator 8 rotates at a position equal to or lower than the height of the vacuum sample chamber 1. It is configured to be able to ascend to a position higher than the height.

In FIG. 2, on the upper surface of the elevator 8,
An arm moving device 9 and an external moving arm 10 that moves forward and backward by the arm moving device 9 are supported. The arm advance / retreat device 9 has a guide 9a supported on the upper surface of the elevator 8 and a slider 9b that moves forward and backward along the guide 9a. The external moving arm 10 is supported by the slider 9b. The external moving arm 10 is a member that mounts and transports the wafer W at its distal end, and is provided with a forked sample mounting portion 10a at its distal end. The external moving arm 10 and the arm advance / retreat device 9 for moving the external moving arm 10 forward / backward are well known in the related art, and various conventionally known structures can be employed.

Next, the structure inside the sample exchange chamber 2 will be described with reference to FIGS. 3 to 6, the outer wall of the sample exchange chamber 2 has a lower frame 11 and an upper surface closing plate 12 (see FIGS. 5 and 6) for closing the upper end of the lower frame 11. On the lower surface of the lower frame 11, an air cylinder C1 for raising and lowering the table, a motor M1 for moving the arm forward and backward as a rotary drive device for transferring the wafer and an arm movement control device, an air cylinder C2 for positioning the work (see FIG. Orientation flat position sensor S for detecting orientation flat (cutting part for positioning) Wa, cylinder for moving orientation flat position sensor C3
(See FIGS. 3 and 4) are supported. 3 and 6, the orientation flat position sensor S is a disc-shaped wafer W.
Is a sensor for detecting the position of a linear portion (orientation flat) Wa as a positioning cutout portion formed on a part of the circular outer peripheral portion of the lower frame 11. It has a vertical shaft portion S1 rotatably supported. A horizontally extending sample detecting portion S2 is provided at the upper end of the vertical shaft portion S1, and a horizontally extending cylinder contact portion S3 is provided at the lower end of the vertical shaft portion S1. In addition,
A detailed description related to the orientation flat position sensor S will be described later. In FIG. 5, a piston 13 which moves up and down by air is disposed inside the table elevating air cylinder C1. A bearing 14 is supported at the center of the piston 13. The lifting cylindrical member 16 rotatably supported by the bearing 14 is rotatable with respect to the piston 13 and moves integrally with the piston 13 in the axial direction. The vertically moving cylindrical member 16 penetrates the lower frame 11, and the upper part thereof is disposed in the sample exchange chamber 2.

An elevating rod 17 is arranged inside the elevating cylindrical member 16 so as to be movable in the direction of its axis 17a and to rotate integrally with the elevating cylindrical member 16 around the axis 17a. A wafer mounting table 18 is provided at an upper end of the lifting rod 17, and a piston 19 is provided at a lower end of the lifting rod 17. The wafer mounting table 18 is provided at a sample exchange position W in the sample exchange chamber 2.
In 1, the sample mounting portion 1 at the tip of the external moving arm 10
It is a member for moving the wafer W between 0a, 10a and a sample mounting portion at the tip of a wafer mounting arm described later. The piston 19 can be moved up and down by a stroke of 2 to 3 mm by an air cylinder 21.
Is used to lift the wafer W carried in from the upper surface of the external moving arm 10 and separate it. The lower end of the elevating cylindrical member 16 is rotatably supported by the elevating table 22. A vertical rod 23 is provided on the lifting table 22. The vertical rod 23 is vertically movably supported by a slide bearing 24 provided at a lower end on the outside of the table lifting air cylinder C1.

A switch trigger 23a protrudes from the upper end of the vertical rod 23. An upper limit position detection limit switch 26 and a lower limit position detection limit switch 27 are arranged corresponding to the switch trigger 23a. When the piston 13 moves up and down inside the table lifting air cylinder C1 by air, the lifting cylindrical member 16, the lifting table 22 and the vertical rod 23 move up and down integrally. The upper limit position and the lower limit position are configured to be detected by the upper limit position detecting limit switch 26 and the lower limit position detecting limit switch 27 that the switch trigger 23a contacts. The lifting table 22 supports a sample rotation motor M2. A timing pulley 28 is fixed to the rotation output shaft of the sample rotation motor M2. Further, corresponding to the timing pulley 28,
A timing pulley 29 is attached to the lower end of the vertical cylindrical member 16.
Is provided. The timing pulleys 28 and 2
A timing belt 30 is hung between nine. Therefore, when the sample rotation motor M2 is rotationally driven,
The elevating cylindrical member 16 and the elevating rod 17 rotate, and the wafer mounting table 18 at the upper end of the elevating rod 17 also rotates. That is, when the wafer W is placed on the wafer mounting table 18, the wafer W is rotated by the rotation of the sample rotating motor M2. The symbols 13 to 30, C1,
The wafer mounting device (13-3)
0, C1, M2). The wafer mounting device (13 to 30, C1, M2) includes a sample mounting portion 10a, 10a at the tip of the external moving arm 10 and a wafer mounting arm (described later) at a sample exchange position W1 in the sample exchange chamber 2. It has a function as an exchange-chamber-side sample moving unit that moves the wafer W between itself and the sample mounting portion at the tip.

A fixed pulley member 31 is fixed to the lower frame 11 in the sample exchange chamber 2. Fixed pulley member 31
Has a through hole for accommodating the elevating cylindrical member 16. That is, the vertical cylindrical member 16 is supported by the through hole of the fixed pulley member 31 so as to be vertically movable and rotatable. At the upper end of the fixed pulley member 31, a fixed pulley 32 is formed. A lower pulley member 33 is rotatably supported by the fixed pulley member 31 below the fixed pulley 32. The lower pulley member 33 includes a large-diameter first pulley 34 provided at a lower end thereof, a second pulley support arm 36 as a first rotating arm extending horizontally above the first pulley 34, The pulley support arm 36 has a small diameter second pulley 38 fixed to the upper end of a column 37 as a first connection shaft at the distal end.

An upper pulley member 39 is rotatably supported by the column 37. The upper pulley member 39 has a small-diameter third pulley 41 provided at a lower end thereof, a fourth pulley support arm 42 as a second rotating arm extending horizontally above the third pulley 41, and a fourth pulley support A large-diameter fourth pulley 44 rotatably provided on a column 43 as a second connection shaft at the distal end of the arm 42 is provided. A pulley 46 is fixed to the output shaft of the arm moving motor M1. A belt 47 is hung between the pulley 46 and the first pulley 34. Also, fixed pulley 32
Belts 48 and 49 are also hung between the second pulley 41 and the third pulley 41, and between the second pulley 38 and the fourth pulley 44, respectively.

The pulleys 46, 34, 32, and 44 are large-diameter pulleys and have the same diameter, and the pulleys 41 and 38 are small-diameter pulleys and have the same diameter. The diameter of the large-diameter pulley is twice as large as that of the small-diameter pulley. 7 and 8,
The center axes of the pulleys 32 and 34 are A1,
If the center axis of No. 1 is A2, the center axis of the pulley 44 is A3, the distance between the rotation center axes A1 and A2 is L1, and the distance between the rotation center axes A2 and A3 is L2, L1 = L2 = L. I have. A wafer mounting arm 51 is integrally connected to the fourth pulley 44. The fork of the wafer mounting arm 51 is provided with bifurcated wafer mounting portions 51a, 51a.

In FIG. 9, the wafer mounting arm 5
At one end, a plurality of spherical members 51b are arranged,
An elevating table penetrating portion 51c is formed between the wafer mounting portions 51a. A contact member support plate 52 is provided at the base end side of the wafer mounting portions 51a, 51a.
Is provided. A first contact member 52a is fixed on the upper surface of the contact member support plate 52. Further, a second contact member 52b is arranged on the contact member support plate 52 so as to penetrate the contact member support plate 52. The second contact member 52b is rotatable around an axis by a bearing 53. The first contact member 52a and the second contact member 52b are formed of a material having a small coefficient of friction with respect to the wafer W. In the first embodiment, the material of the first contact member 52a is Teflon, The material of the second contact member 52b is silicon carbide.

The first contact member 52a and the second contact member 52b are connected to the positioning contact member (52a + 52) of the present invention.
b) is configured. 9 and 10, a guided roller 54 is rotatably supported on the lower surface of the tip of the wafer mounting arm 51. The guided roller 54 is a member that is guided by a guide groove on a rotary table, which will be described later, disposed in the vacuum sample chamber 1, and is provided for positioning the tip of the wafer mounting arm 51. A wafer mounting arm moving device (3) that moves the wafer mounting arm 51 by the elements indicated by the reference numerals 31 to 49.
1 to 49). Further, the wafer transfer device H of the present invention is constituted by the wafer mounting arm moving devices (31 to 49) and the elements denoted by reference numerals 51 to 54.

The wafer mounting arm moving device (31 to 49) shown in FIGS.
1 is used to move from the contracted state shown in FIG. 7A to the extended state shown in FIG. 7B. That is, in the state of FIG. 5 in which the wafer mounting arm 51 is in the contracted state, the arm moving motor M1 (see FIG. 5) is rotationally driven to rotate the first pulley 34 clockwise by the angle θ shown in FIG. 7A. When driven to rotate, the second pulley support arm 36 also rotates clockwise by the angle θ. At this time, the rotation center axis A2 of the second pulley 38 and the third pulley 41 moves to the position shown in FIG. 7B. At this time, the belt 48 hung on the fixed pulley 32
Is rotated by an angle θ with respect to the fixed pulley 32, the third pulley 41 is rotated counterclockwise by an angle 2θ and moves to the position of FIG. 7B. The angle 2θ of the third pulley 41
The fourth pulley 44 rotates clockwise by θ ° in response to the rotation of.

In this case, the fourth pulley 44 has a total rotation angle of 0 °, moves parallel to the right (−Y direction) by a distance D, and moves the wafer mounting arm 51 rightward by a distance D (− (Y direction) (see FIG. 7B). As described above, since the distance L1 between the rotation center axes A1 and A2 and the distance L2 between the rotation center axes A2 and A3 are set to L1 = L2 = L, the movement distance D is represented by the following equation. You. D = 2L (1−cos θ) Further, the arm advance / retreat motor M1 (see FIG. 5) is rotationally driven to rotate the first pulley 34 at an angle θ (θ = 180 °).
When driven only clockwise, the fourth pulley 44
Moves in parallel by a distance D (D = 4L) and enters an extended state. In this case, the wafer mounting arm 51 also has the distance D.
(D = 4L) to the right (−Y direction) (FIG. 8A)
reference). Further, the first pulley 34 is set at an angle θ (θ> 1).
80 °) When driven to rotate clockwise, the fourth pulley 4
4 retreats leftward (Y direction) from the extended state shown in FIG. 8A by L3 shown in FIG. 8B.

3 to 5, the wafer mounted on the external moving arm 10 (see FIGS. 1 and 5) in a state where the external gate valve 5 is opened (in a state where it is slid to the left in FIG. 3). W is carried into the sample exchange chamber 2 from outside through the opening 2a. The wafer W is supported on the wafer mounting table 18 by raising the wafer mounting table 18. As can be seen from FIG. 5, the wafer mounting table 18 can move up and down through the forked wafer mounting sections 51 a at the tip of the wafer mounting arm 51, and can move up and down. It can be moved up and down through a similar bifurcated portion at the tip (elevation table penetration). The wafer W is placed on the wafer mounting table 18.
Is mounted, the external moving arm 10 moves from the sample exchange chamber 2 to the outside through the opening 2a. And
The opening 2 a is closed by the external gate valve 5.

Guides 56 for centering a sample are arranged on both left and right sides of the wafer W mounted on the wafer mounting table 18 (see FIG. 3). Each centering guide 56 is slidable in the left-right direction (Y-axis direction) by a guide rail 57 fixed to the inner surface of the lower frame 11 below the opening 2a. The centering guide 56 has a slide portion 56a slidably supported by the guide rail 57, a support portion 56b for supporting the wafer W, and an engagement portion 56c formed at an end of the slide portion 56a. doing. In FIG. 6, a pair of centering guides 56,
The engaging portions 56c, 56c of the 56 are arranged close to each other and opposed to each other, and are constituted by inclined surfaces that spread downward. The pair of right and left centering guides 56, 56
Are subjected to forces in directions approaching each other by tension springs 60 supported by shafts 59 fixed to the lower frame 11.

A guide driving shaft 61 is disposed below the engaging portions 56c. The guide drive shaft 61 has an upper end 61a that is tapered, and the upper end 61a is disposed between the pair of engagement portions 56c. Then, the guide driving shaft 61
Rises, the upper end 61a is brought into contact with the pair of engagement portions 56.
The supporting members 56b, 56b are opened outward by pushing the supporting members c, 56c outward. Then, with the pair of support portions 56b, 56b opened, the wafer W is lifted and raised by the wafer mounting table 18, and the guide driving shaft 61 is lowered at the raised position, whereby the support portions 56b, 56b are moved. The centering can be performed by bringing the wafer W close to each other and adjusting the position by sandwiching the wafer W from both sides. After centering, the support portions 56b, 56b are kept open.

The sample detecting portion S2 of the orientation flat position sensor S shown in FIGS. 3 and 6 is always pulled toward the wafer W by a spring 62, but the stopper 63 controls the tip position of the sample detecting portion S2. Have been. The position of the orientation flat position sensor S in this state is indicated by P1 (see FIG. 3). The cylinder contact portion S3 at the lower end of the orientation flat position sensor S is configured to be movable to a position P2 in FIG. 3 by a cylinder C3 for moving the orientation flat position sensor. The tip end of the sample detection section S2 has a bifurcated shape that is vertically separated, and a light-emitting element and a light-receiving element (not shown) that are vertically separated from each other are disposed at that portion. With the orientation flat position sensor S arranged at the position indicated by P1, the wafer mounting table 1
When the wafer 8 is rotated, the outer peripheral portion of the wafer W is disposed so as to pass between the light emitting element and the light receiving element (not shown). When the position of the orientation flat Wa of the wafer W moves to a position corresponding to the tip of the sample detection unit S2, the light from the light emitting element reaches the light receiving element, and the orientation flat Wa of the wafer W (see FIG. 3) is detected. be able to.

When the orientation flat Wa of the wafer W is detected by the orientation flat position sensor S, the wafer placement table 18 is rotated by a predetermined angle so that the wafer W on the wafer placement table 18 can be moved to a desired position. (Rotational position). In a state where the wafer W is mounted on the wafer mounting table 18 and the wafer mounting arm 51 is in a contracted state shown in FIG. 7A, when the wafer mounting table 18 is lowered, the wafer W It is mounted on the wafer mounting portions 51a of the wafer mounting arm 51.
At this time, the lower surface of the wafer W is supported by the plurality of spherical members 51b. The vacuum sample chamber 1 and the sample exchange chamber 2
The internal partition valve 3 is opened, the wafer mounting arm 51 in the sample exchange chamber 2 is advanced rightward (−Y direction), and the wafer W mounted on the wafer mounting portions 51a, 51a is evacuated. The sample can be transferred to the sample stage 66 (see FIG. 10) in the sample chamber 1.

Next, referring to FIGS.
The sample stage 66 will be described. The sample stage 66 arranged in the vacuum sample chamber 1 is a device for moving the wafer W to a position (working position) where observation, inspection, length measurement, and the like are performed with an electron microscope. The sample stage 66 is supported on a support plate 67 so as to be movable in the Y-axis direction (left-right direction), and is movable on the Y-axis movement table 68 in the X-axis direction (front-rear direction). An X-axis moving table 69 is supported. Although the moving devices of the Y-axis moving table 68 and the X-axis moving table 69 are not shown, various conventionally known moving devices can be adopted. On the X-axis moving table 69, a circular rotary table 71 is rotatably supported via a bearing 72. A guide groove 7 for guiding a guided roller 54 on the lower surface of the tip of the wafer mounting arm 51 is provided on the upper surface of the rotary table 71.
1a is formed. By providing the guide groove 71a for guiding the guided roller 54, it is possible to prevent the positioning accuracy from deteriorating even if play occurs due to aging. The rotary table 71 has a gear 73 formed on its outer periphery. The gear 73 is a worm gear 74 that is rotated by a table drive motor M3 (see FIG. 11).
And are engaged. The turntable 71 is configured to rotate with the rotation of the worm gear 74.

In FIG. 10, a turntable 71 has
The wafer W transferred into the vacuum sample chamber 1 by the wafer mounting arm 51 is received, and the worked wafer W is transferred to the wafer mounting portion 51a of the wafer mounting arm 51.
An elevating table 76 serving as a vacuum chamber-side sample moving means for moving the sample to 51a is vertically movably supported. The elevating table 76 has a wafer mounting plate 76a as a circular wafer support surface provided at the upper end and a rod 76b extending downward. A spring receiving plate 77 is fixed to the lower end of the rod 76b. A compression spring 78 is arranged between the spring receiving plate 77 and the lower surface of the rotary table 71. The lifting table 76 is constantly urged downward by the compression spring 78. On the lower surface of the elevating table 76, a fan-shaped lever 81 is provided with a horizontal shaft 7.
It is supported rotatably around 9. The table support surface 81 a of the lever 81 is in contact with the lower end of the lifting table 76. The ball 82a at the tip of the nut 82 is in contact with the pressed surface 81b of the lever 81. A guided bar 83 is provided integrally with the nut 82, and the guided bar 83 is formed by a guide groove 84 formed in the rotary table 71.
Is engaged.

A vertically moving table drive motor 86 is supported on the lower surface of the rotary table 71. A bolt shaft (shaft with a screw) 87 rotated by the vertically movable table drive motor 86 is screwed with the nut 82. doing. Therefore, when the vertically moving table drive motor 86 rotates, the bolt shaft 87 rotates, and the nut 82 and the guided bar 83 move along the guide groove 84, and at this time, the lever 81 moves around the horizontal shaft 79. It is configured to rotate. The table support surface 81a of the lever 81 moves up and down by the rotation of the lever 81, and the elevating table 76 moves up and down in conjunction therewith. At both ends of the moving range of the nut 82 and the guided bar 83, limit switches 88 and 89 that are activated by contact with the guided bar 83 are arranged, and the moving range of the nut 82 is restricted. I have.

As shown in FIG. 10, an electrostatic plate 91 is provided on the rotary table 71 around the elevating table 76. The electrostatic plate 91 attracts and holds the wafer W mounted on the upper surface by static electricity.

(Operation of the First Embodiment) Next, the operation of the first embodiment having the above-described configuration will be described. 1 and 2, the external gate valve 5 is opened, the wafer W is taken out from the cassette carrier 4 on the upper surface of the sample exchange chamber 2 by the external moving arm 10, and the sample exchange position W1 in the sample exchange chamber 2 is taken out. (See FIG. 2). The wafer W is received by the wafer mounting table 18 at the sample exchange position W1 in the exchange chamber. At the sample exchange position W1 in the sample exchange chamber 2, the wafer W
At the same time as the orientation flat Wa of the wafer W
Is detected. After detecting the orientation flat Wa, the orientation flat Wa rotates the wafer mounting table 18 to a position corresponding to the first contact member 52a (see FIG. 9), and then lowers the wafer mounting table 18. The wafer W is placed on the wafer placement portions 51a, 51a at the tip of the wafer placement arm 51 in a state where the orientation flat Wa is opposed to the first contact member 52a and the orientation flat Wa is positioned.

In FIG. 2, with the internal gate valve 3 opened, the wafer mounting arm 51 is moved to the right (−Y direction).
When the wafer W is moved forward, the wafer W moves to the sample exchange position W1 in the exchange chamber.
To the sample exchange position W2 in the vacuum sample chamber 1. At this time, the first contact member 52a and the second contact member 52b are arranged to face the orientation flat Wa and the outer peripheral portion of the wafer W, respectively. At the sample exchange position W2 in the vacuum chamber, the wafer mounting arm 51 is advanced to the position shown in FIG. 8B. In this state, the lifting table 76 shown in FIG.
Is lifted, and the wafer W is mounted on the wafer mounting plate 76a. In this state, the wafer W is placed at a position shifted to a base end side from a predetermined position (a position indicated by a two-dot chain line in FIG. 11). Thereafter, the wafer mounting arm 51 is moved to the extended state shown in FIG. 8A. At this time,
The wafer W mounted on the wafer mounting plate 76a is moved forward and rightward (-Y direction) by the first contact member 52a and the second contact member 52b from the left side (Y direction side) and positioned. (The position shown by the solid line in FIG. 11).

Thereafter, the wafer mounting arm 51 is moved backward into the sample exchange chamber 2 to close the internal gate valve 3. When the internal gate valve 3 is in a closed state, the vacuum sample chamber 1 and the sample exchange chamber 2 are airtightly shut off. next,
The elevating table 76 is lowered to place the wafer W on the electrostatic plate 91 (see FIG. 10). Since the wafer W mounted on the electrostatic plate 91 is positioned on the wafer mounting plate 76a of the elevating table 76 as described above, the wafer W is fixed at a predetermined position of the electrostatic plate 91 by suction. Therefore, it is not necessary to move the wafer W on the electrostatic plate 91 to perform positioning. In this state, the X-axis moving table 69 and the Y-axis moving table 68 are moved to move the wafer W to the working position (observation, inspection, length measurement,
Move to the position (W3 where the work such as drawing is performed) W3. Then, work (for example, length measurement) on the wafer W is performed. Further, since the first contact member 52a and the second contact member 52b are made of a material having a low friction coefficient, the wafer W is in low friction with the first contact member 52a and the second contact member 52b. And the positioning error is reduced. Further, since the second contact member 52b can be rotated with low friction by the bearing 53, the orientation flat Wa can easily follow the first contact member 53a, and a positioning error due to friction is reduced.

(Embodiment 2) Next, Embodiment 2 of the wafer transfer apparatus of the present invention will be described with reference to FIG. FIG.
Is a plan view of a wafer transfer device according to a second embodiment of the present invention,
FIG. 12A is a plan view, and FIG. 12B is XIIB of FIG. 12A.
FIG. 10 is a cross-sectional view taken along line -XIIB, corresponding to FIG. 9. In the description of the second embodiment, the first embodiment
The same reference numerals are given to constituent elements corresponding to the above-mentioned constituent elements, and detailed description thereof will be omitted. The second embodiment differs from the first embodiment in the following points, but has the same configuration as the first embodiment in other points.

In the second embodiment, the notch 101 is formed on the wafer W as a positioning cutout. A pin-shaped first contact member 102 is disposed at the tip of the wafer mounting arm 51 so as to correspond to the notch 101. Like the second contact member 52b, the first contact member 102 is made of a material (silicon carbide in the second embodiment) having a small coefficient of friction with respect to the wafer W, and is rotated around an axis by a bearing (not shown). It is free. As in the second embodiment,
Even when the positioning cutout of the wafer W is not a linear orientation flat, accurate positioning can be performed. The first contact member 102 and the second contact member 52b
The first contact member 102 and the second contact member 5 can be rotated by a bearing 53 with low friction.
2b easily follows the notch 101, and a positioning error due to friction is reduced.

(Modifications) Although the embodiments of the present invention have been described in detail, the present invention is not limited to the above-described embodiments, but falls within the scope of the present invention described in the appended claims. Thus, various changes can be made. Modified embodiments of the present invention will be exemplified below. (H01) The present invention is also applicable to an apparatus using a vacuum suction plate instead of the electrostatic suction plate. (H02) In the first embodiment, the wafer mounting arm 5
Guide groove 71a for guiding one guided roller 54
Can be provided on another member arranged close to the turntable 71 instead of on the turntable 71. (H03) In the first embodiment, the wafer mounting arm 5
A guide roller 54 is provided on the lower surface of the rotary table 71.
Instead of providing the guide groove 71 a on the upper side, a guided groove may be provided on the lower surface of the wafer mounting arm 51, and a guide roller may be provided on the rotary table 71.

(H04) Guided roller 5 of the first embodiment
4 and the guide groove 71a can be omitted. (H05) In each of the above embodiments, it is possible to install two sample exchange chambers configured similarly to the sample exchange chamber 2 shown in FIG. In this case, the wafer W is loaded from one sample exchange chamber into the vacuum sample chamber, and the wafer W is unloaded from the other sample exchange chamber. (H06) In the first embodiment, when the wafer W is mounted on the wafer mounting table 18, the sample rotating motor M 2 is used to rotate the cylindrical member 16 for lifting, the lifting rod 17, and the wafer on the upper end of the lifting rod 17. After rotating the mounting table 18 to rotate the wafer W to a desired rotation position, the wafer W having a predetermined rotation posture is mounted on the wafer mounting portions 51a, 51a at the tip of the wafer mounting arm 51. I have. In this case, the wafer mounting portions 51a, 51a
The upper wafer W is opposed to the first contact member 52a and the second contact member 52b at a distance, and the wafer mounting arm 51 is moved in this state. However, means for pressing the wafer W on the wafer mounting portions 51a, 51a against the first contact member 52a and the second abutting member 52b is provided, and the wafer W on the wafer mounting portions 51a, 51a is The wafer mounting arm 51 can be moved while being pressed (contacted) against the first contact member 52a and the second contact member 52b.

[0056]

The sample exchange apparatus of the present invention has the following advantages. (E01) Since the area in contact with the wafer when the position of the wafer is moved to position the wafer can be reduced, the amount of generated particles can be reduced. (E02) Since a movable member for positioning the wafer in the vacuum sample chamber can be omitted, the amount of particles generated at the time of frictional contact of the movable member can be reduced. (E03) When changing the size of the wafer, it is only necessary to replace the contact member support plate outside the vacuum sample chamber, so there is no need to release the high vacuum inside the vacuum sample chamber, and the replacement work can be performed efficiently. Can be. (E04) When the size of the wafer is changed, the contact member support plate outside the vacuum sample chamber may be replaced, so that the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an overall explanatory view of Embodiment 1, and FIG. 1A is a perspective view of a wafer transfer device provided in an apparatus for inspecting a wafer, measuring a length, and the like using an electron microscope apparatus.
FIG. 2 is a perspective view of the cassette carrier 4 of FIG. 1A viewed from another angle.

FIG. 2 is a plan view of FIG. 1;

FIG. 3 is a plan view of the inside of a sample exchange chamber, and FIG.
FIG. 3 is a sectional view taken along line III.

FIG. 4 is a plan view of a sample exchange chamber, and FIG.
It is a IV line sectional view.

FIG. 5 is a longitudinal sectional view of a sample exchange chamber, and FIG.
FIG. 5 is a sectional view taken along line VV of FIG.

FIG. 6 is a sectional view taken along line VI-VI of FIG. 3;

7 is an explanatory view of an operation of the wafer mounting arm moving device shown in FIG. 5; FIG. 7A is a diagram showing a state where the wafer mounting arm is in a contracted state; FIG. It is a figure showing the state where an arm advanced.

8 is a view for explaining the operation of the wafer mounting arm moving device shown in FIG. 5; FIG. 8A is a view showing a state in which the wafer mounting arm is in an extended state; FIG. It is a figure showing the state where it retreated from the extension state.

FIG. 9 is an explanatory view of a first contact member and a second contact member of the wafer transfer device according to the first embodiment of the present invention.
9A is a plan view, and FIG. 9B is a cross-sectional view taken along the line IXB-IXB of FIG. 9A.

FIG. 10 is an explanatory view of a table in the vacuum sample chamber shown in FIG. 1, FIG. 10A is an overall explanatory view, and FIG.
FIG. 10B is a sectional view taken along line XB-XB of FIG. 10A.

FIG. 11 is a plan view of a rotary drive mechanism of the rotary table shown in FIG. 10;

12 is a plan view of a wafer transfer device according to a second embodiment of the present invention, FIG. 12A is a plan view, FIG. 12B is a cross-sectional view taken along the line XIIB-XIIB of FIG. 12A, and FIG.
FIG.

FIG. 13 is a plan view of a conventional example of a wafer transfer apparatus of the type described above.

FIG. 14 is a view of FIG. 13 as viewed from an arrow XIV.

15 is an explanatory diagram of a mechanism for positioning a wafer placed on a rotary table. FIG. 15A is an overall explanatory diagram, and FIG. 15B is an enlarged explanatory diagram of a main part.

FIG. 16 is a plan view of a rotary drive mechanism of the rotary table and a wafer positioning mechanism shown in FIG. 15;

[Explanation of symbols]

H: Wafer transfer device, M1 (rotational driving device; arm movement control device), (Wa; 101): Cut-out portion for positioning, W: Wafer. 16: rotating shaft, (31 to 49): wafer mounting arm moving device, (34, 41): base end,
36: first rotating arm, 37: first connecting shaft, 42: second
Rotating arm, 43: second connecting shaft, 51: wafer mounting arm, (51a, 51a): wafer mounting portion, 51c: lifting table penetrating portion, (52a; 102): first contact member, 52b: first 2 abutment member, (52a + 52b): positioning abutment member, 76: elevating table, 76a: wafer support surface.

Claims (3)

[Claims] 1. A wafer transfer device characterized by the following requirements: (A01) A wafer mounting portion for mounting a wafer having a positioning cutout formed on a part of a circular outer periphery has a tip portion. A wafer mounting arm formed with a lifting table penetrating portion through which an elevating table having a wafer support surface on the upper surface can vertically penetrate; and (A02) supporting the wafer mounting arm. In a state in which the positioning cutout is disposed on the base end side of the wafer mounting arm, a second cutout disposed at a position facing the positioning cutout of a wafer mounted on the wafer mounting portion. (A0) a positioning abutting member having one abutting member and a second abutting member disposed at a position facing another outer peripheral portion disposed on the base end side of the wafer mounting arm;
3) A wafer mounting arm moving device for moving the wafer mounting arm to the distal end side and the base end side. (A04) A cutting portion for positioning the wafer is disposed at a position facing the first contact member, and the other outer peripheral portion of the wafer is placed in the second position.
A wafer mounting device for mounting the wafer on the wafer mounting portion in a state where the wafer is arranged at a position facing the contact member. 2. A wafer transfer apparatus according to claim 1, wherein the first and second rotation arms for rotating the base end are rotated around a rotation axis; A wafer having a base end rotatably connected to a front end of the first rotating arm by a first connection shaft and a front end rotatably connected to a base end of the wafer mounting arm by a second connection shaft. A second rotary arm for transport, a rotary drive for transporting the wafer for rotating the first rotary arm about the rotation axis, and interlocking with the rotation of the first rotary arm at a rotation angle θ about the rotary axis. And rotating the second rotation arm about the first connection axis by a rotation angle of −2θ, and moving the wafer mounting arm to the second rotation axis.
(A06) a distance between the rotation axis and the first connection axis, and a distance between the first connection axis and the second connection axis; (A07) the rotation shaft, the first connection shaft, and the second connection shaft each having a distance set to be equal.
The wafer mounting arm extending in the same direction as the direction of the straight line when the rotation shaft, the first connection shaft, and the second connection shaft are aligned. 3. The wafer transfer device according to claim 1, wherein the rotation shaft, the first connection shaft, and the second connection shaft are on one straight line and have the following requirements. The state in which the wafer mounting part is approaching the rotation axis is a first state.
When the arm is in a contracted state in which the arm has a rotation angle θ of 0 °, and when the arm is rotated from that state to a rotation angle θ of 180 ° in the first rotation arm, the arm is in the extended state,
At a position where the rotation angle of the rotating arm is (θ + α) °, the lifting table is raised to place a wafer on the wafer supporting surface, and in this state, the first rotating arm is rotated by θ = 180 °.
An arm movement control device for controlling the wafer mounting arm movement device so that the wafer placement arm movement device is rotated so as to pass through the rotation angle.