JPH1177521A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately detect a distance between an upper side polishing plate and a lower side polishing plate, and thereby certainly perform specified standard size polishing. SOLUTION: A contact type distance measuring means 4 is set in a state that its probe 4a passes through the through hole 3 of an upper side polishing plate 2 from the above side to the down side while it is being fixed to a stational supporting member 13, concurrently, let a rod 12 whose upper end surface is turned out a reference table 5, be penetrated through a through hole 11 formed in a driving shaft 6, and, its lower end side is disposed to a stational supporting member 14 so as to be fixed thereto.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus, and more particularly, to a polishing apparatus capable of simultaneously polishing upper and lower surfaces of a material to be polished such as metal, ceramic, and semiconductor material.

[0002]

BACKGROUND OF THE INVENTION Metals,
As a polishing apparatus capable of simultaneously polishing both upper and lower surfaces of a material to be polished such as a ceramic or a semiconductor material, for example, a polishing apparatus as shown in FIG. 5 is known.

This polishing apparatus is driven in rotation by driving means (not shown), and can be raised or lowered by an air cylinder 51. An upper polishing plate 52 and a through hole 53 of the upper polishing plate 52 are provided. (A probe 54a constitutes a part of a contact-type distance measuring means (electric micrometer) 54), and a lower polishing plate 57 which is rotationally driven by a driving means (not shown). A workpiece holding jig 59 for holding the workpiece to be polished between the upper polishing plate 52 and the lower polishing plate 57 and a through-hole 60 of the lower polishing plate 57 are provided. A drive shaft 56 for rotating the abrasive holding jig 59 is provided, and an upper end surface of the drive shaft 56 is a reference table 55 to which the probe 54a contacts. In addition, the drive shaft 56 has the bearing 5
6a, the lower polishing plate 57 is rotatably held by bearings 57a. The polishing material holding jig 59 is configured to be driven to rotate by engaging a pin 56b of a rotating drive shaft 56 with a gear-shaped uneven portion (not shown) formed on the outer peripheral portion. Have been. In this polishing apparatus, the upper polishing plate 52
The upper polishing plate 52 and the lower polishing plate 57 are rotated with a polishing material holding jig 59 for holding the polishing material 58 therebetween, and the polishing material holding by the drive shaft 56. By rotating the jig 59, both the upper and lower surfaces of the workpiece 58 are polished simultaneously. Then, the distance between the upper polishing plate 52 and the lower polishing plate 57 (that is, the thickness of the material to be polished 58) is determined from the amount of expansion and contraction of the probe 54a abutting on the reference table 55 on the upper surface of the drive shaft 56.
Is detected and compared with a set value, and when the polishing amount reaches a predetermined polishing amount, polishing (processing) is stopped, so that the material to be polished is polished to a predetermined size.

However, in the above-mentioned conventional polishing apparatus,
Since the reference table 55 is formed integrally with the drive shaft 56, the inclination of the reference table 55, the displacement of the rotation axis of the drive shaft 56, the displacement of the contact position between the tip of the probe 54a and the reference table 55, the drive shaft The upper polishing plate 52 and the lower polishing plate 57
May not be able to accurately detect the distance between them, causing a measurement error of the polishing amount.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and it is possible to accurately detect the distance between an upper polishing plate and a lower polishing plate, and to polish a workpiece to a predetermined size without fail. It is an object of the present invention to provide a polishing apparatus capable of performing polishing.

[0006]

In order to achieve the above object, a polishing apparatus according to the present invention (claim 1) has a polishing object positioned between a pair of polishing plates of an upper polishing plate and a lower polishing plate, By rotating the upper polishing plate and the lower polishing plate in contact with the upper and lower surfaces of the material to be polished, a polishing apparatus for simultaneously polishing the upper and lower surfaces of the material to be polished has a through-hole along a rotation axis. An upper polishing plate and a lower polishing plate formed with a material to be polished, which is located between the upper polishing plate and the lower polishing plate and holds the material to be polished by the upper polishing plate and the lower polishing plate. A holding jig and a drive inserted into the through-hole of the lower polishing plate and having a through-hole formed along the rotation axis to rotate the polished-material holding jig for holding the polished material. Penetrates the shaft and the through hole of the drive shaft The upper end surface is a reference table, the lower end side is configured to detect the rod to be fixed to the fixed support member, the distance to be measured by the amount of expansion and contraction of the probe, fixed to the fixed support member, And a contact-type distance measuring means arranged so that the probe penetrates the through hole of the upper polishing plate from the upper surface side to the lower surface side and abuts on the reference table, and The size of the material to be polished is determined by detecting the distance between the upper polishing plate and the lower polishing plate, and the material to be polished can be polished by a predetermined amount.

In the polishing apparatus according to the present invention (claim 1), as described above, the contact type distance measuring means is configured so that the probe penetrates the through hole of the upper polishing plate from the upper surface side to the lower surface side. And, while being fixedly disposed on the fixed support member, a rod having an upper end surface serving as a reference table is passed through a through hole formed in the drive shaft, and the lower end side is fixed to the fixed support member. Because it is arranged, as in the above-described conventional polishing apparatus using a part of the rotating drive shaft as a reference table, the reference table is inclined, or the contact position between the probe and the reference table is shifted, Alternatively, it is possible to prevent the bearing holding the drive shaft from swaying, thereby causing an error in the distance measurement between the upper polishing plate and the lower polishing plate, and accurately and precisely polishing the workpiece to a fixed size. So that it is. The polishing apparatus of the present invention can be widely applied to various polishing apparatuses. In the present invention, the polishing device is a broad concept including various devices such as a so-called lap device and a polishing device.

In the polishing apparatus according to the present invention (claim 2), a material to be polished is positioned between a pair of upper and lower polishing plates, and the upper polishing plate and the lower polishing plate are attached to the polishing plate. In a polishing apparatus for simultaneously polishing the upper and lower surfaces of an object to be polished by rotating while being in contact with the upper and lower surfaces of the abrasive, an upper polishing plate and a lower polishing plate having through holes formed along the rotation axis. And a polishing material holding jig which is located between the upper polishing plate and the lower polishing plate and holds the polishing material so as to be polished by the upper polishing plate and the lower polishing plate; A drive shaft that is inserted and disposed in the hole and has a through hole formed along the rotation axis and that rotates a polishing material holding jig that holds the polishing material, and penetrates the through hole of the upper polishing plate. And the lower end face becomes the reference table. A rod whose upper end is fixed to a fixed support member, is configured to detect a measurement target distance based on the amount of expansion and contraction of the probe, and is fixed to the fixed support member, and the probe has a through hole of the drive shaft. And a contact-type distance measuring means disposed so as to be in contact with the reference table so as to be exposed on the upper end surface side thereof, and between the upper polishing plate and the lower polishing plate based on the amount of expansion and contraction of the probe. It is characterized in that the dimensions of the material to be polished are determined by detecting the distance, and the material to be polished can be polished by a predetermined amount.

In the polishing apparatus of the present invention (claim 2), as described above, the contact type distance measuring means is configured such that the probe thereof is exposed through the through hole of the drive shaft to the upper end face side. Therefore, a part of the rod is fixed to the fixed support member and disposed, and a rod having a lower end surface serving as a reference table is disposed so as to pass through a through hole of the upper polishing plate. As in the case of the polishing apparatus described in 1, the distance between the upper polishing plate and the lower polishing plate due to the inclination of the reference table, the displacement of the contact position between the probe and the reference table, the deflection of the bearing holding the drive shaft, and the like. The measurement error can be prevented, and the material to be polished can be precisely polished to a fixed size.

The polishing apparatus according to the present invention (claim 3) is characterized in that the contact type distance measuring means is an electric micrometer. As a contact distance measuring means,
By using an electric micrometer, it is possible to easily and reliably detect the distance between the upper polishing plate and the lower polishing plate, accurately measure the polishing amount of the material to be polished, and accurately perform fixed-size polishing. Will be able to do it.

Further, in the polishing apparatus of the present invention (claim 4), a material to be polished is positioned between a pair of upper and lower polishing plates, and the upper polishing plate and the lower polishing plate are attached to the polishing plate. In a polishing apparatus for simultaneously polishing the upper and lower surfaces of an object to be polished by rotating while being in contact with the upper and lower surfaces of the abrasive, an upper polishing plate and a lower polishing plate having through holes formed along the rotation axis. And a polishing material holding jig which is located between the upper polishing plate and the lower polishing plate and holds the polishing material so as to be polished by the upper polishing plate and the lower polishing plate; A drive shaft that is inserted into the hole and has a through hole formed along the rotation axis, and that rotates a polishing material holding jig that holds the polishing material, and penetrates the through hole of the drive shaft. And the top surface reflects light rays A rod having a reflecting surface, a lower end fixed to a fixed support member, a light projecting section for generating light rays, and a light receiving section for receiving reflected light rays, fixed to the fixed support member, and As the light beam projected from the part reaches the reflection surface without being blocked by the upper polishing plate, the light beam reflected by the reflection surface reaches the light receiving unit without being blocked by the upper polishing plate, at least. A non-contact (optical) distance measuring means disposed in such a manner that a part thereof is located in a through hole of the upper polishing plate; The size of the material to be polished is determined by detecting the distance between the lower polishing plates, so that the material to be polished can be polished by a predetermined amount.

In the polishing apparatus of the present invention (claim 4), as described above, the non-contact (optical) distance measuring means can be used without the light beam projected from the light projecting portion being blocked by the upper polishing plate. As the light reaches the reflection surface, the light reflected by the reflection surface reaches the light receiving portion without being blocked by the upper polishing plate, so that at least a part thereof is positioned in the through hole of the upper polishing plate. Along with being fixedly disposed on the fixed support member, a rod having an upper end surface serving as a reflecting surface for reflecting light rays from the light projecting portion is made to pass through a through hole formed in the drive shaft, and the lower end side thereof is Since it is fixedly mounted on the fixed support member, the upper surface is polished due to the inclination of the reflection surface, the misalignment of the positions of the light emitting and receiving parts and the reference table, and the deflection of the bearing that holds the drive shaft. Plate and lower polishing plate Distance to prevent the occurrence of a measurement error of, it becomes possible to accurately sizing polishing the material.

In the polishing apparatus according to the present invention (claim 5), an object to be polished is positioned between a pair of upper and lower polishing plates, and the upper polishing plate and the lower polishing plate are attached to each other. In a polishing apparatus for simultaneously polishing the upper and lower surfaces of an object to be polished by rotating while being in contact with the upper and lower surfaces of the abrasive, an upper polishing plate and a lower polishing plate having through holes formed along the rotation axis. And a polishing material holding jig which is located between the upper polishing plate and the lower polishing plate and holds the polishing material so as to be polished by the upper polishing plate and the lower polishing plate; A drive shaft that is inserted and disposed in the hole and has a through hole formed along the rotation axis and that rotates a polishing material holding jig that holds the polishing material, and penetrates the through hole of the upper polishing plate. The lower end face reflects light rays. And a rod whose upper end side is fixed to a fixed support member, including a light emitting unit that generates light rays and a light receiving unit that receives the light rays reflected on the reflection surface, and is fixed to the fixed support member, and At least the light projecting portion and the light receiving portion are formed in the upper openings of the through holes of the drive shaft so that the light beam projected from the light projecting portion reaches the reflecting surface and the light beam reflected by the reflecting surface reaches the light receiving portion. Non-contact (optical) distance measuring means disposed in such a manner as to be exposed from the light source, wherein the non-contact distance measuring means detects a distance between the upper polishing plate and the lower polishing plate. The dimensions of the material to be polished are determined by the above formula, and the material to be polished can be polished by a predetermined amount.

As described above, the polishing apparatus of the present invention (claim 5) uses the non-contact (optical) distance measuring means so that the light projected from the light projecting portion reaches the reflecting surface and the reflecting surface At least a part of the light emitting portion and the light receiving portion are fixed to the fixed support member in such a manner that at least the light projecting portion and the light receiving portion are exposed from the upper opening of the through hole of the drive shaft so that the light beam reflected by the light reaches the light receiving portion. At the same time, a rod whose lower end surface is a reflecting surface for reflecting light rays from the light emitting portion of the non-contact type distance measuring means is passed through the through hole of the upper polishing plate, and the upper end side is fixed to the fixed support member. The upper polishing plate and the lower polishing surface caused by the inclination of the reflecting surface, the misalignment of the light emitting unit and light receiving unit from the reference table, the deflection of the bearing that holds the drive shaft, etc. Measurement error of the distance between the plates Raw and to prevent, it is possible to accurately sizing polishing the material.

In the polishing apparatus according to the fourth and fifth aspects, since the non-contact type (optical) distance measuring means is used, the probe is accessed when the contact type distance measuring apparatus is used. When it ’s difficult,
It is possible to accurately measure the distance between the upper polishing plate and the lower polishing plate, and it is possible to improve the degree of freedom of the device configuration.

Further, the polishing apparatus according to the present invention (claim 6) is characterized in that the non-contact distance measuring means is an optical distance measuring means using a laser beam. Various types of optical distance measuring means using a laser beam are commercially available, and a high-precision optical distance measuring means can be easily obtained. Therefore, by using an optical distance measuring means using a laser beam as the non-contact distance measuring means, it becomes possible to efficiently obtain a high-precision polishing apparatus, thereby making the present invention more effective. become.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and the features thereof will be described in more detail.

[First Embodiment] FIG. 1 is a sectional view showing the structure of a main part of a polishing apparatus according to an embodiment of the present invention. The polishing apparatus is rotatably driven by driving means (not shown), and is inserted through an upper polishing plate 2 and a through hole 3 of the upper polishing plate 2 which can be raised or lowered by an air cylinder 1. Probe 4
a (which constitutes a part of the electric micrometer 4 which is a contact-type distance measuring means), a lower polishing plate 7 which is rotationally driven by a driving means (not shown), and a material to be polished such as a ceramic work. A polishing object holding jig 9 that is held between the upper polishing plate 2 and the lower polishing plate 7, and a drive that is inserted and disposed in the through hole 10 of the lower polishing plate 7 and rotates the polishing material holding jig 9. The drive shaft 6 is rotated by rotating the drive shaft 6, the shaft 6, a rod 12 disposed so as to penetrate a through hole 11 formed in the drive shaft 6, and having a reference table 5 whose upper end surface is in contact with the tip of the probe 4 a. A bearing 6a for rotatably holding the lower polishing plate 7 and a bearing 7a for rotatably holding the lower polishing plate 7, and a polishing target material for holding a polishing target 8 between the upper polishing plate 2 and the lower polishing plate 7. Position the holding jig 9 By rotating the upper polishing plate 2 and the lower polishing plate 7 and rotating the workpiece holding jig 9 by the drive shaft 6, the upper and lower surfaces of the workpiece 8 can be simultaneously polished. Have been. Note that the workpiece holding jig 9 is configured to be driven to rotate by engaging a pin 6b of a rotating drive shaft 6 with a gear-shaped uneven portion (not shown) formed on an outer peripheral portion. Have been. Further, a plurality of the polished materials 8 can be held together between the upper polishing plate 2 and the lower polished plate 7 by a single polished material holding jig 9. It is also possible to hold the holding jigs 9 one by one.

In the polishing apparatus of this embodiment,
The upper part of the electric micrometer 4 which is a contact distance measuring means is fixed to a fixed support member 13 which does not rotate, and the lower end side of the rod 12 is fixed to a fixed support member 14 which does not rotate.

Next, the operation when the workpiece 8 is polished using this polishing apparatus will be described. First, the material to be polished 8 is placed on the lower polishing plate 7, and the upper polishing plate 2 is lowered to abut on the upper surface of the material to be polished 8. At this time, the tip of the probe 4a contacts the reference table 5 on the upper end surface of the rod 12. Then, the upper and lower polishing plates 2 and the lower polishing plate 7 are rotated in opposite directions at a predetermined speed, and the polishing target holding jig 9 is rotated to polish both upper and lower surfaces of the polishing target material 8. There is no particular limitation on the rotational speed and the rotational direction of the upper polishing plate 2, the lower polishing plate 7, and the workpiece holding jig 9, as long as the workpiece 8 can be polished. The condition can be set arbitrarily.

In this polishing step, the probe 4a which is in contact with the reference table 5 is contracted by the distance the upper polishing plate 2 is lowered, and the upper polishing plate 2 and the lower polishing plate 2 are reduced based on the contraction amount of the probe 4a. The distance between the plates 7 (that is, the thickness of the workpiece 8) is detected. Then, the detection result is compared with the set value, and when the predetermined polishing amount is reached, the rotations of the upper polishing plate 2 and the lower polishing plate 7 are stopped, and the polishing process ends. As a result, the material to be polished 8 is reliably polished until it reaches a predetermined size.

In the polishing apparatus of this embodiment, as described above, the contact type distance measuring means 4 is configured so that the probe 4a penetrates the through hole 3 of the upper polishing plate 2 from the upper surface side to the lower surface side. In addition, the upper portion is fixedly disposed on a non-rotating fixed support member 13, and a rod 12 having an upper end surface serving as a reference table 5 passes through a through hole 11 formed in the drive shaft 6, and a lower end thereof is provided. Since the base is fixedly mounted on the fixed support member 14 which does not rotate, it is caused by the inclination of the reference table, the displacement of the contact position between the probe and the reference table, or the deflection of the bearing holding the drive shaft. As a result, it is possible to prevent the occurrence of an error in the distance measurement between the upper polishing plate and the lower polishing plate, and to precisely polish the workpiece to a fixed size.

[Embodiment 2] FIG. 2 is a sectional view showing the structure of a main part of a polishing apparatus according to another embodiment of the present invention. The polishing apparatus is rotated by a driving means (not shown), and can be raised or lowered by an air cylinder 1. An upper polishing plate 2 and a through hole 3 formed in the upper polishing plate 2. And a rod 12 fixed to a fixed support member 13 whose lower end surface serves as a reference table 5 and whose upper end does not rotate.
And a lower polishing plate 7 which is driven to rotate by driving means (not shown), and a polishing material holding jig 9 for holding a polishing material such as a ceramic work between the upper polishing plate 2 and the lower polishing plate 7. And a drive shaft 6 inserted into the through hole 10 of the lower polishing plate 7 to rotate the workpiece holding jig 9, and attached to an upper portion of the rod 4 b inserted into the through hole 11 of the drive shaft 6. Probe 4a (which constitutes a part of the contact distance measuring means (electric micrometer) 4), a bearing 6a for rotatably holding the drive shaft 6, and a rotatably holding lower polishing plate 7. A bearing 7a for holding a workpiece (for example, a ceramic work) 8 is provided between the upper polishing plate 2 and the lower polishing plate 7, and the upper polishing plate 2 Lower polishing plate 7 By rotating the object to be polished holding jig 9 causes the rotation, and is configured to be able to polish the upper and lower surfaces of the polished material 8 at the same time.

That is, the polishing apparatus according to the second embodiment and the polishing apparatus according to the first embodiment have a relationship in which the positions of the probe 4a and the reference table 5 are reversed, and the configuration of other parts is essentially essential. There is no significant difference. The polishing apparatus of this embodiment also operates in the same manner as in the first embodiment except that the positional relationship between the probe 4a and the reference table 5 is reversed. In polishing the workpiece using this polishing apparatus, first, the workpiece 8 is placed on the lower polishing plate 7,
The upper polishing plate 2 is lowered and brought into contact with the upper surface of the workpiece 8. At this time, the tip of the probe 4 a, which is a part of the contact-type distance measuring means (electric micrometer) 4 inserted into the through hole 11 of the drive shaft 6, has the rod 12 inserted into the through hole 3 of the upper polishing plate 2. Reference table 5 at the lower end face
Abut.

Then, in the same manner as in the first embodiment, the upper polishing plate 2 and the lower polishing plate 7 are rotated in opposite directions at a predetermined speed, and the upper and lower surfaces of the workpiece 8 are polished. The distance between the upper polishing plate 2 and the lower polishing plate 7 is detected from the contraction amount 4a. Then, the detection result is compared with a set value, and when the polishing amount reaches a predetermined value, the polishing (processing) is stopped to polish the workpiece 8 to a predetermined size.

In the polishing apparatus of the second embodiment as well, the upper polishing plate and the lower polishing plate are caused by the inclination of the reference table, the displacement of the contact position between the probe and the reference table, or the deflection of the bearing holding the drive shaft. An error can be prevented from occurring in the distance measurement between the plates, and the workpiece can be precisely polished to a fixed size.

[Embodiment 3] FIG. 3 is a sectional view showing the structure of a main part of a polishing apparatus according to still another embodiment of the present invention. In this polishing apparatus, as shown in FIG. 3, a light projecting portion 24a of an optical distance measuring means (non-contact distance measuring means using a laser beam) 24 The upper end surface reflects the laser beam from the light projecting portion 24a so as to penetrate the through hole 11 formed in the drive shaft 6, and causes the light receiving portion 24b to receive the laser beam. The rod 12 functioning as the surface 25 is provided, and the other parts have the same configuration as the polishing apparatus of the first embodiment. In addition, in order to avoid redundant description, the description of the corresponding parts of the first embodiment is referred to for the configuration of the other parts, and the description thereof is omitted here. Further, in FIG. 3, portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.

The operation of the polishing apparatus according to the third embodiment is the same as that of the polishing apparatus except that the distance between the upper polishing plate 2 and the lower polishing plate 7 is measured by a non-contact distance measuring means 24 using a laser beam. This is the same as the case of the polishing apparatus of the first embodiment. Also, in the polishing apparatus of the third embodiment, the gap between the upper polishing plate and the lower polishing plate due to the inclination of the reflecting surface, the displacement of the reflecting surface at which the laser beam hits, or the deflection of the bearing holding the drive shaft, etc. The same effect as in the first and second embodiments described above can be obtained, in which an error is prevented from occurring in the distance measurement, and the workpiece can be accurately polished to a fixed size.

[Embodiment 4] FIG. 4 is a sectional view showing the structure of a main part of a polishing apparatus according to still another embodiment of the present invention. As shown in FIG. 4, this polishing apparatus includes a light projecting portion 24a of an optical distance measuring means (non-contact distance measuring means using a laser beam) 24 in a through hole 11 of a lower polishing plate 7.
And the rod 4b holding the light receiving portion 24b is disposed so as to penetrate therethrough. The light projecting portion 24a and the light receiving portion 24b are exposed above the upper opening of the through hole 11, and
The lower end surface reflects the laser beam from the light projecting portion 24a so as to pass through the through hole 3 of the upper polishing plate 2, and the light receiving portion 24
The rod 12 functioning as a reflection surface 25 for receiving light at the point b is provided.
Has the same configuration as that of the polishing apparatus. In addition, in order to avoid redundant description, the description of the corresponding parts of the first embodiment is referred to for the configuration of the other parts, and the description thereof is omitted here. Further, in FIG. 4, portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.

The operation of the polishing apparatus according to the fourth embodiment is the same as that of the polishing apparatus except that the distance between the upper polishing plate 2 and the lower polishing plate 7 is measured by a non-contact distance measuring means 24 using a laser beam. This is the same as the case of the polishing apparatus of the first embodiment.

In the polishing apparatus of the fourth embodiment,
This prevents errors in the measurement of the distance between the upper and lower polishing plates due to the inclination of the reflecting surface, displacement of the position where the laser beam hits the reflecting surface, or deflection of the bearing holding the drive shaft. Embodiment 1 described above, in which the workpiece can be accurately polished to a fixed size.
The same effects as in the cases 2 and 3 can be obtained.

In the first and second embodiments, an electric micrometer is used as the contact distance measuring means. In the third and fourth embodiments, a laser beam is used as the non-contact distance measuring means (optical distance measuring means). Although the case where the optical distance measuring means is used has been described, other types of measuring means can be used as the contact distance measuring means and the non-contact distance measuring means.

In the above-described embodiment, the case where the ceramic workpiece is polished has been described as an example. However, the polishing apparatus of the present invention is also applicable to the case where a polished material other than ceramic such as metal or semiconductor material is polished. Is possible.
In addition, the polishing apparatus of the present invention is not limited to the above embodiment in other respects, and the specific shapes of the upper polishing plate and the lower polishing plate, and the material to be polished are formed by the upper polishing plate and the lower polishing plate. Various applications and modifications can be made to the specific structure of the workpiece holding jig for holding between the polishing plates within the scope of the invention.

[0034]

As described above, in the polishing apparatus of the present invention (claim 1), the contact type distance measuring means is configured such that the probe penetrates the through hole of the upper polishing plate from the upper surface side to the lower surface side. And fixedly disposed on the fixed support member, and a rod having an upper end surface serving as a reference table is passed through a through hole formed in the drive shaft, and the lower end side is fixed to the fixed support member. Since the reference table is inclined, the contact position between the probe and the reference table is shifted, as in a conventional polishing apparatus in which a part of the rotating drive shaft is used as the reference table, Alternatively, it is possible to prevent the bearing that holds the drive shaft from swaying, thereby causing an error in the distance measurement between the upper polishing plate and the lower polishing plate, and accurately polishing the workpiece to a fixed size. Kill.

In the polishing apparatus according to the present invention (claim 2), the contact type distance measuring means is provided in such a manner that the probe penetrates the through hole of the drive shaft and is exposed on the upper end side. The rod according to claim 1, wherein a part of the rod is fixed to the fixed support member and the rod having a lower end surface serving as a reference table is disposed so as to pass through a through hole of the upper polishing plate. As in the case of the polishing device, the measurement error of the distance between the upper polishing plate and the lower polishing plate due to the inclination of the reference table, the displacement of the contact position between the probe and the reference table, the runout of the bearing holding the drive shaft, etc. Can be prevented, and the material to be polished can be precisely polished to a fixed size.

When an electric micrometer is used as the contact type distance measuring means as in the polishing apparatus of the present invention (claim 3), the distance between the upper polishing plate and the lower polishing plate can be easily and reliably detected. This makes it possible to accurately measure the amount of polishing of the material to be polished and accurately perform fixed-size polishing.

Further, in the polishing apparatus of the present invention (claim 4), as described above, the non-contact type (optical) distance measuring means allows the light beam projected from the light projecting portion to be blocked by the upper polishing plate. In such a manner, at least a part thereof is positioned in a through hole of the upper polishing plate so that the light reflected by the reflection surface reaches the light receiving portion without being blocked by the upper polishing plate. And a rod whose upper end surface is a reflecting surface for reflecting light rays from the light projecting portion is passed through a through hole formed in the drive shaft, and the lower end thereof is fixed to the fixed support member. Because the side is fixed to the fixed support member and arranged, the inclination of the reflection surface,
Polishing is performed by preventing the measurement error of the distance between the upper polishing plate and the lower polishing plate caused by the misalignment of the light emitting part and light receiving part from the reference table, the deflection of the bearing holding the drive shaft, etc. The material can be precisely sized and polished.

In particular, the polishing apparatus of the present invention (claim 4) uses a non-contact type (optical) distance measuring means, so that it is difficult to access when using a contact type distance measuring apparatus. In such a case, the distance between the upper polishing plate and the lower polishing plate can be measured efficiently, and the degree of freedom of the device configuration can be improved.

In the polishing apparatus of the present invention (claim 5), as described above, the non-contact type (optical type) distance measuring means is provided so that the light projected from the light projecting portion reaches the reflecting surface, At least a part thereof is fixed to a fixed support member such that at least the light projecting portion and the light receiving portion are exposed from the upper opening of the through hole of the drive shaft so that the light beam reflected by the reflecting surface reaches the light receiving portion. And a rod whose lower end surface is a reflecting surface for reflecting a light beam from the light emitting portion of the non-contact type distance measuring means penetrates the through hole of the upper polishing plate, and the upper end side is a fixed support member. The upper polishing plate and the lower surface caused by the inclination of the reflecting surface, the position of the light emitting unit and light receiving unit and the position of the reference table, the deflection of the bearing that holds the drive shaft, etc. Of the distance between the side polishing plates To prevent the occurrence of the difference, it is possible to accurately sizing polishing the material.

In the polishing apparatus according to the fourth and fifth aspects of the present invention, since a non-contact type (optical) distance measuring means is used, the probe is used when a contact type distance measuring apparatus is used. Even in the case where it is difficult to access, it is possible to accurately measure the distance between the upper polishing plate and the lower polishing plate, and the degree of freedom of the device configuration can be improved.

Further, by using an optical distance measuring means using a laser beam as the non-contact type distance measuring means as in the polishing apparatus of the present invention (claim 6), a highly accurate polishing apparatus can be efficiently provided. Thus, the present invention can be made more effective.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a main part of a polishing apparatus according to another embodiment of the present invention.

FIG. 3 is a sectional view showing a main part of a polishing apparatus according to still another embodiment of the present invention.

FIG. 4 is a sectional view showing a main part of a polishing apparatus according to still another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a main part of a conventional polishing apparatus.

[Explanation of symbols]

Reference Signs List 1 air cylinder 2 upper polishing plate 3 through hole of upper polishing plate 4 contact distance measuring means (electric micrometer) 4a probe 4b rod 5 reference table 6 drive shaft 7 lower polishing plate 6a, 7a bearing 6b pin 8 REFERENCE SIGNS LIST 9 jig to be polished holding jig 10 through hole in lower polishing plate 11 through hole in drive shaft 12 rod 13 fixed support member 14 fixed support member 24 non-contact type distance measuring means (optical distance measuring means) 24a light emitting unit 24b Light receiving part 25 Reflecting surface

Claims (6)

[Claims] An object to be polished is positioned between a pair of upper and lower polishing plates, and the upper and lower polishing plates are rotated in contact with the upper and lower surfaces of the material to be polished. By doing so, in a polishing apparatus for simultaneously polishing the upper and lower surfaces of the material to be polished, an upper polishing plate and a lower polishing plate having a through hole formed along a rotation axis, and between the upper polishing plate and the lower polishing plate. A polishing material holding jig positioned so as to be capable of polishing the material to be polished by the upper polishing plate and the lower polishing plate; and a jig inserted and disposed in a through hole of the lower polishing plate; A drive shaft for forming a through-hole is formed along the drive shaft for rotating a workpiece holding jig for holding the workpiece, and the drive shaft is disposed so as to pass through the through-hole of the drive shaft. , The lower end is fixed to the fixed support member The probe is fixed to a fixed support member, and the probe penetrates through the through hole of the upper polishing plate from the upper surface side to the lower surface side. And a contact-type distance measuring means disposed so as to be in contact with the reference table, and a material to be polished by detecting a distance between the upper polishing plate and the lower polishing plate from an amount of expansion and contraction of the probe. A polishing apparatus for determining a dimension of the polishing member so as to polish a material to be polished by a predetermined amount. 2. A material to be polished is positioned between a pair of polishing plates, an upper polishing plate and a lower polishing plate, and the upper and lower polishing plates are rotated while being in contact with both upper and lower surfaces of the material to be polished. By doing so, in a polishing apparatus for simultaneously polishing the upper and lower surfaces of the material to be polished, an upper polishing plate and a lower polishing plate having a through hole formed along a rotation axis, and between the upper polishing plate and the lower polishing plate. A polishing material holding jig positioned so as to be capable of polishing the material to be polished by the upper polishing plate and the lower polishing plate; and a jig inserted and disposed in a through hole of the lower polishing plate; A drive shaft for rotating a workpiece holding jig for holding the workpiece, a drive shaft having a through hole formed therethrough, and a lower end face being provided so as to pass through the through hole of the upper polishing plate; With the upper end fixed to the fixed support member. And the probe is configured to detect the distance to be measured based on the amount of expansion and contraction of the probe, is fixed to a fixed support member, and the probe penetrates a through hole of the drive shaft,
A contact-type distance measuring unit that is exposed on the upper end surface side and is disposed so as to be in contact with the reference table, and detects a distance between the upper polishing plate and the lower polishing plate from an amount of expansion and contraction of the probe. A polishing apparatus for determining the dimensions of the material to be polished to thereby polish the material to be polished by a predetermined amount. 3. The polishing apparatus according to claim 1, wherein said contact distance measuring means is an electric micrometer. 4. A material to be polished is positioned between a pair of upper and lower polishing plates, and the upper and lower polishing plates are rotated while being in contact with both upper and lower surfaces of the material to be polished. By doing so, in a polishing apparatus for simultaneously polishing the upper and lower surfaces of the material to be polished, an upper polishing plate and a lower polishing plate having a through hole formed along a rotation axis, and between the upper polishing plate and the lower polishing plate. A polishing material holding jig positioned so as to be capable of polishing the material to be polished by the upper polishing plate and the lower polishing plate; and a jig inserted and disposed in a through hole of the lower polishing plate; A drive shaft for rotating a polishing material holding jig for holding the polishing material, the drive shaft being disposed along the driving shaft; and a drive shaft disposed to pass through the through hole of the drive shaft, and an upper end surface reflecting light rays. Reflecting surface, the lower end of which serves as a fixed support member. A fixed rod, a light-emitting unit for generating light rays, and a light-receiving unit for receiving the reflected light rays, the light-emitting unit being fixed to a fixed support member, and the light rays emitted from the light-emitting unit are arranged on the upper side. At least a portion is in the through hole of the upper polishing plate so that the light reflected by the reflection surface reaches the light receiving portion without being blocked by the upper polishing plate, while reaching the reflection surface without being blocked by the polishing plate. And a non-contact (optical) distance measuring means disposed in such a manner as to be located at a position such that the distance between the upper polishing plate and the lower polishing plate is detected by the non-contact distance measuring means. A polishing apparatus characterized in that the dimensions of the material to be polished are obtained by means of the method, and the material to be polished can be polished by a predetermined amount. 5. A material to be polished is positioned between a pair of polishing plates, an upper polishing plate and a lower polishing plate, and the upper and lower polishing plates are rotated while being in contact with both upper and lower surfaces of the material to be polished. By doing so, in a polishing apparatus for simultaneously polishing the upper and lower surfaces of the material to be polished, an upper polishing plate and a lower polishing plate having a through hole formed along a rotation axis, and between the upper polishing plate and the lower polishing plate. A polishing material holding jig positioned so as to be capable of polishing the material to be polished by the upper polishing plate and the lower polishing plate; and a jig inserted and disposed in a through hole of the lower polishing plate; A drive shaft for forming a through-hole is formed along the drive shaft for rotating a polished material holding jig for holding the polished material. The reflective surface becomes a reflective surface, and the upper end is fixed to the fixed support member. Rod, a light projecting unit for generating a light beam, and a light receiving unit for receiving the light beam reflected by the reflecting surface, the light beam fixed to a fixed support member, and projected from the light projecting unit. Are arranged in such a manner that at least the light projecting portion and the light receiving portion are exposed from the upper opening of the through hole of the drive shaft so that the light reflected by the reflecting surface reaches the light receiving portion while reaching the reflecting surface. A non-contact type (optical) distance measuring means, wherein the non-contact type distance measuring means detects the distance between the upper polishing plate and the lower polishing plate to determine the size of the material to be polished, A polishing apparatus characterized in that a predetermined amount of a material to be polished can be polished. 6. The polishing apparatus according to claim 4, wherein said non-contact type distance measuring means is an optical distance measuring means using a laser beam.