JPH1174055A - Manufacture of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide miniaturization and thinning, by forming a film of triazine thiol compound on the electroless plating surface of the internal circumference of each perforated hole, inserting a terminal pin into each perforated hole, and injecting an insulative synthetic resin for molding terminal pin holders. SOLUTION: A cavity corresponding to the outer shape of an electronic component 1 is formed in an injection molding die. Holding holes for holding terminal pins are provided at the prescribed positions within the cavity, and the whole surface is copperized, and a cell 10 provided with coating on the copperized surface within perforated holes is inserted, and the perforated holes 10a are perforated, further the terminal pins 2 are held by the holding holes and inserted, then the die is closed. An insulating ABS resin is used as an injected insulating synthetic resin. A covalent bond is formed between the coating of triazine thiol copper salt formed on the copperized surface and a butadiene component within the ABS resin, then a firm agglutination is obtained. In addition, as the film is very thin, it is suitable to miniaturization.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component such as a shield connector.

[0002]

2. Description of the Related Art In recent years, the amount of signals transmitted through electronic components has increased, and the signal speed has become extremely high.
The risk of crosstalk between signals is increasing. Therefore, a shield plate is press-fitted into the wall of the cell and an electromagnetic wave flowing between the terminals is blocked by the seal between the terminals. However, the method of press-fitting the shield plate increases the manufacturing and assembly costs. Therefore, as a means of reducing cost and increasing the reliability of the shield, a terminal pin having a terminal pin insertion hole in the through hole is plated with an electroless plating for shielding over the entire surface of a synthetic resin cell having a plurality of through holes. There is a type in which an insertion body is formed of a synthetic resin and a terminal pin is inserted into a terminal pin insertion hole.

[0003]

When a terminal pin insert is formed of a synthetic resin in an electroless plated through-hole as in the latter conventional one, a sufficient bonding strength between the plating and the synthetic resin can be obtained. And become unstable. For this reason, it is necessary to provide a retaining mechanism such as a locking claw and a locking recess between the inner surface of the through hole and the outer peripheral surface of the terminal pin insertion body. But,
In recent years in which electronic components have been required to be further reduced in size and thickness, there has been a problem that it is impossible to provide a retaining mechanism that goes against the reduction in size and thickness. Further, if the joint between the inner surface of the through hole and the outer peripheral surface of the terminal pin insertion body is insufficient, a gap is generated therein, and moisture infiltrates to cause dew condensation, thereby further increasing the gap. There was a problem of spoiling.

It is an object of the present invention to provide a method of manufacturing an electronic component having high electrical reliability, while at the same time promoting the miniaturization and thinning, and at the same time, ensuring the action of retaining.

[0005]

In order to solve the above-mentioned problems, a method for manufacturing an electronic component according to the present invention comprises forming a cell having a plurality of through holes by injecting a synthetic resin, and forming the cell over the entire surface of the cell. Forming electroless plating for shielding, forming a coating of a triazine thiol compound on the electroless plating surface of the inner peripheral surface of each through hole, inserting a terminal pin into each of the through holes, and forming the triazine It is characterized in that an insulating synthetic resin capable of chemically bonding to a thiol compound is injected to form a terminal pin holder. The electroless plating surface on the inner peripheral surface of the through hole and the terminal pin holder are covalently bonded to a triazine thiol compound which is a film provided therebetween,
Since it is firmly bonded and does not come off, the coating of the triazine thiol compound can be extremely thin, which is suitable for miniaturization and thinning.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 4 shows an inter-terminal shield connector 1 as an example of an electronic component according to the present invention. The shield connector 1 is provided in a cell (housing) 10 formed of a synthetic resin in two rows. A plurality of aligned through holes 10a are provided, and electroless plating 11 is applied to the entire surface of the cell 10. In each plated through hole, a terminal pin holder 10 made of an insulating synthetic resin is secondarily formed, and at the time of the second forming, the terminal pin 2 is inserted and formed. Therefore, each terminal pin 2 penetrates through the cell 10 while being shielded by the electroless plating 11. The ground pin 3 is electrically connected to the electroless plating 11. Therefore, an example of a method for manufacturing such an inter-terminal shield connector 1 will be described in detail below for each process.

Embodiment 1 (a) First, as shown in FIG. 1, a cell (housing) 10 as a primary molded product is injection-molded with a synthetic resin. A plating type ABS resin is used as a base material, and projections at positions and numbers corresponding to the through holes 10a aligned in two rows are projected in a cavity of an injection mold (not shown).
Further, projections corresponding to the small holes 10b through which the ground pins are passed and the mounting holes 10c are projected. An example of the injection molding conditions is an injection material: ABS resin pre-dried at 80 ° C. for about 3 hours Cylinder temperature 250 ° C. Mold temperature 80 ° C. Injection pressure 1,100 Kg / cm ² Cooling time 30 seconds.

(B) Next, as shown in FIG.
Electroless plating 11 for shielding is applied to the entire surface of the substrate. Prior to plating, the entire surface of the cell is degreased and etched. Etching is performed with 400 g / l of chromic acid and 4 g of sulfuric acid.
Using an etching solution mixed with 00 g / l, this etching solution is kept at 65 ° C. and immersed in this for about 10 minutes.
By this etching, the surface of the cell 10 and the through hole 10 are formed.
a, the inner peripheral surfaces of the small holes 10b and the mounting holes 10c are roughened. Thereafter, the chromium component is neutralized to remove the chromium component, and is subjected to catalyzing and accelerating.

Then, electroless copper plating is performed on the entire surface of the etched cell 10. At the time of plating, a DPC-700 electroless copper plating solution from Okuno Pharmaceutical Co., Ltd. was used. This plating solution is 100 ml / l for solution A and 1 for solution B.
00 ml / l and solution C were mixed at a rate of 2 ml / l. The plating solution is kept at 25 ° C., the cell 10 is immersed for 10 hours, and a copper plating 11 having a thickness of 20 μm is deposited on the entire surface to form plating for shielding. The copper plating 11 has a through hole 10a, a small hole 10b, and a mounting hole 10b.
c is also deposited on the inner peripheral surface of copper plating 11a, 11b, 1
1c is performed.

(C) Next, as shown in FIG. 3, the surface of the copper plating 11a of each through hole of this cell is treated with an aqueous solution of triazine thiols, and the surface of the copper plating is coated with a triazine thiol copper salt coating 12a. To form The copper plating 11a on which the coating 12 is formed and the terminal pin holder 2 to be formed next
The adhesive strength to the ABS resin, which is the material No. 0, depends on the processing conditions, the molding conditions, and the content of the butadiene component in the ABS resin when treating with an aqueous solution of a triazine thiol. Optimum processing conditions are solution concentration 0.8-1 × 10 ^-3 m
ol / l, treatment time is 10 to 60 s, high adhesive strength is obtained at 80 ° C. or higher, and maximum adhesive strength is exhibited when the content of the butadiene component in the ABS resin is 18 to 20%.

(D) Next, secondary molding shown in FIG. 4 is performed.
A cavity that matches the external shape of the electronic component 1 is formed in an injection mold (not shown). In this cavity, holding holes for holding the terminal pins 2 are provided at predetermined positions.
Also, projections corresponding to the small holes 10b and the mounting holes 10c are formed. In this cavity, copper plating 11, 1
1a, 11b, 11c, and copper plating 1 in the through hole.
The cell 10 provided with the coating 12 on the 1a surface is inserted, the terminal pins 2 are held in the holding holes through the through holes 10a, and the insertion is performed to close the mold. An insulating ABS resin is used as the insulating synthetic resin to be injected. One example of the injection molding conditions is as described above. By this secondary molding, the terminal pin holders 20 through which the terminal pins 2 pass through the through holes 10a are formed. Since the mold temperature at the time of the secondary molding is set to 80 ° C. as described above, the condition for obtaining high adhesive strength is satisfied as described above. Therefore, a covalent bond is formed between the triazine thiol copper salt coating 12 formed on the copper plating 11a and the butadiene component in the ABS resin, and a strong bond is obtained.

(E) After the secondary molding, the earth pin 3
Is inserted through the small hole 10b, since the copper plating 11b is formed on the inner peripheral surface of the small hole, the ground pin 3 has the copper plating 11 on the entire surface of the cell, the copper plating 11a on the inner peripheral surface of the through hole.
Are connected to each other, and the terminal pins 2 are held in the cell 10 in a shielded state. Thus, the manufacture of the terminal-to-terminal shield connector 1 as an example of the electronic component is completed.

Embodiment 2 In the above-mentioned embodiment 1, the ABS resin is used for the primary molding and the secondary molding. In this embodiment 2, an SPS resin, for example, a product of Idemitsu Petrochemical Co., Ltd. is used instead of the ABS resin. A certain SPS “Zarek” is used. In the primary molding, cells are molded by injection molding using SPS “Zarek” grade SP140 for plating as a base material. An example of the injection molding conditions is the material to be injected SPS resin “Zarek” grade SP140 Cylinder temperature 280 ° C. Mold temperature 80 ° C. Injection pressure 1000 kg / cm ² Cooling time 30 seconds.

Before applying copper plating to the entire surface of the cell, the cell is degreased and etched. The etching solution, the etching temperature, and other etching conditions are the same as those of the first embodiment. Thereafter, neutralization is performed to completely remove chromium ions. Since "Zarek" does not have a polar group that attracts a catalyst ion, it is immersed in an aqueous solution of a surfactant at room temperature to impart polarity here. After that, it is catalyzed and accelerated. The step of plating the entire surface of the cell with copper is the same as in the first embodiment. After forming the copper plating, it is forcibly dried. In the case of "Zarek", this forced drying can significantly improve the plating adhesion.

Next, a coating of a triazine thiol compound is formed on the copper plating surface on the inner peripheral surface of the through hole as in the first embodiment. In this case, the triazine thiol copper salt coating formed on the copper plating and the SEB in the SPS resin were used.
A chemical bond is formed between the (styrene, ethylene, butylene) -based elastomer component and the same strong adhesion as in the first embodiment can be obtained.

Next, a step of inserting the primary molded product, further inserting terminal pins, and secondary molding the terminal pin holder is the same as in the first embodiment.
The synthetic resin used may be either an ABS resin or an SPS resin as long as it is insulating. The injection molding conditions are as described above, and the mold temperature is set to 80 ° C. Strong bonding is obtained. The same applies to the installation of the earth pin. Each terminal pin is held in a cell in a shielded state, and the manufacture of the terminal-to-terminal shield connector is completed.

The present invention is not limited to the manufacture of the inter-terminal shield connector, but can be applied to the manufacture of a shielded photoelectric conversion module and other electronic components.

[0018]

The present invention is embodied in the form described above and has the following effects.

Since the triazine thiol compound film is formed on the electroless plating surface on the inner peripheral surface of the through hole, the electroless plating surface and the terminal pin holder are covalently bonded to the triazine thiol compound. However, since the terminal pin holder is firmly bonded and the terminal pin holder does not come off, and the coating of the triazine thiol compound is extremely thin, it is very effective for miniaturization and thinning. Since the surface of the electroless plating and the terminal pin holder are firmly connected to each other, there is no gap between them, and an electronic component having high electrical reliability can be provided.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a primary molded product of a connector.

FIG. 2 is a partially cutaway perspective view showing a state in which electroless plating for shielding is applied to a primary molded article of FIG. 1;

FIG. 3 is an enlarged sectional view showing a state where a coating is formed on the inner peripheral surface of the through hole of FIG. 2;

FIG. 4 is a partially cutaway perspective view of a completed connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component (shield connector between terminals) 10 Cell 10a Through hole 11, 11a Electroless plating 12 Coating 2 Terminal pin 20 Terminal pin holder

Claims (1)

[Claims] 1. A cell having a plurality of through holes is formed by injecting a synthetic resin, and electroless plating for shielding is formed on the entire surface of the cell, and the electroless plating on the inner peripheral surface of each of the through holes is performed. A triazine thiol compound film is formed on the surface, and a terminal pin is inserted into each of the through holes, and an insulating synthetic resin capable of chemically bonding to the triazine thiol compound is injected to form a terminal pin holder. A method for manufacturing an electronic component, comprising: