JPH1171496A - Phenol resin composition - Google Patents
Phenol resin compositionInfo
- Publication number
- JPH1171496A JPH1171496A JP10005999A JP599998A JPH1171496A JP H1171496 A JPH1171496 A JP H1171496A JP 10005999 A JP10005999 A JP 10005999A JP 599998 A JP599998 A JP 599998A JP H1171496 A JPH1171496 A JP H1171496A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- resin composition
- parts
- ratio
- rubber component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、靭性に優れる成形
品や鳴き特性、振動吸収性に優れる摩擦材等を得るため
に好適に用いられるバインダーであって、靭性、振動吸
収性に優れ、且つ成形品等の製造過程における成形、焼
成を短時間で行うことを可能にするフェノール樹脂組成
物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a binder which is suitably used for obtaining a molded article having excellent toughness, a friction material having excellent squealing properties and vibration absorption, and the like, which is excellent in toughness and vibration absorption. The present invention relates to a phenol resin composition that enables molding and baking in a short time in the process of producing a molded article or the like.
【０００２】[0002]
【従来の技術】フェノール樹脂は、優れた機械的特性、
電気特性、耐熱性及び接着性などを有するバインダーで
ある反面、その成形品は靭性、振動吸収性において欠点
を持っている。このような諸性能を改善するため変性フ
ェノール樹脂の研究が盛んに行われており、油変性フェ
ノール樹脂、カシュー変性フェノール樹脂、エポキシ変
性フェノール樹脂、メラミン変性フェノール樹脂などが
検討され、一部実用に供されている。しかし、これらの
変性フェノール樹脂は、靭性、振動吸収性の面で未だ十
分でない。また、柔軟性、振動吸収性に比較的優れる各
種エラストマー変性フェノール樹脂が検討されている
が、これらのエラストマーを含有する樹脂は硬化が遅
く、成形、焼成にかかる時間が長いという問題があっ
た。2. Description of the Related Art Phenol resins have excellent mechanical properties,
Although it is a binder having electrical properties, heat resistance, adhesiveness, etc., the molded product has drawbacks in toughness and vibration absorption. In order to improve such performances, research on modified phenolic resins has been actively carried out. Has been provided. However, these modified phenolic resins are not yet sufficient in toughness and vibration absorption. Further, various elastomer-modified phenolic resins which are relatively excellent in flexibility and vibration absorption have been studied. However, resins containing these elastomers have a problem that curing is slow and molding and firing take a long time.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、フェノール
樹脂のこのような問題点を解決するために種々検討した
結果完成したもので、その目的とするところは靱性、振
動吸収性に優れ、且つ成形品等の製造過程における成
形、焼成を短時間で行うことを可能にするフェノール樹
脂組成物を提供することにある。DISCLOSURE OF THE INVENTION The present invention has been completed as a result of various studies to solve such problems of the phenol resin. The object of the present invention is to provide excellent toughness and vibration absorption, and It is an object of the present invention to provide a phenol resin composition that enables molding and firing in a short period of time in the process of manufacturing a molded article or the like.
【０００４】[0004]
【課題を解決するための手段】本発明は、フェノール樹
脂を合成する際、樹脂中のメチレン結合においてオルソ
結合対パラ結合の比（ｏ／ｐ比）を制御し、更にゴム成
分を含有させることにより靱性、振動吸収性に優れ、且
つ成形品等の製造過程における成形、焼成を短時間で行
うことを可能にするフェノール樹脂を鋭意検討した結
果、完成するに至ったものである。SUMMARY OF THE INVENTION According to the present invention, when synthesizing a phenol resin, the ratio of ortho to para bonds (o / p ratio) in the methylene bond in the resin is controlled, and a rubber component is further contained. As a result of intensive studies on a phenol resin which is excellent in toughness and vibration absorption and enables molding and sintering in a manufacturing process of a molded article or the like in a short time, it has been completed.
【０００５】以下、本発明について具体的に説明する。
本発明のフェノール樹脂組成物を製造するために使用す
るフェノール類は、フェノール、クレゾール、キシレノ
ール、エチルフェノール、プロピルフェノール、カテコ
ール、レゾルシン、ハイドロキノン、ビスフェノールＡ
等であり、これらを単独または２種類以上組合わせて使
用してもよい。アルデヒド類はホルムアルデヒド、パラ
ホルムアルデヒド、ベンズアルデヒド等であり、これら
を単独または２種類以上組合わせて使用してもよい。フ
ェノール類とアルデヒド類とを反応する際の触媒として
は、酢酸亜鉛等の金属塩類、蓚酸、塩酸、硫酸、ジエチ
ル硫酸、パラトルエンスルホン酸等の酸類を単独または
２種類以上併用して使用できる。Hereinafter, the present invention will be described specifically.
Phenols used for producing the phenolic resin composition of the present invention include phenol, cresol, xylenol, ethylphenol, propylphenol, catechol, resorcin, hydroquinone, bisphenol A
These may be used alone or in combination of two or more. Aldehydes are formaldehyde, paraformaldehyde, benzaldehyde and the like, and these may be used alone or in combination of two or more. As a catalyst for reacting phenols and aldehydes, metal salts such as zinc acetate and acids such as oxalic acid, hydrochloric acid, sulfuric acid, diethyl sulfate and paratoluenesulfonic acid can be used alone or in combination of two or more.
【０００６】樹脂中のメチレン結合においてオルソ結合
対パラ結合の比（ｏ／ｐ比）は０．７以上１．０未満で
あり、好ましくは０．７〜０．８５である。オルソ結合
対パラ結合の比（ｏ／ｐ比）が０．７未満では硬化が遅
く、成形性に優れた樹脂を得ることができない。また、
ｏ／ｐ比が１．０以上の樹脂は成形時、成形面の硬化が
速すぎるためガスの抜けが悪く、ふくれが生じやすいた
め成形が困難である。The ratio of ortho to para bonds (o / p ratio) in the methylene bond in the resin is 0.7 or more and less than 1.0, preferably 0.7 to 0.85. When the ratio of ortho bonds to para bonds (o / p ratio) is less than 0.7, curing is slow, and a resin having excellent moldability cannot be obtained. Also,
Resins having an o / p ratio of 1.0 or more are difficult to mold because molding hardens too quickly during molding, resulting in poor outgassing and easy blistering.
【０００７】フェノール樹脂の硬化剤としては、必要に
応じて、ヘキサメチレンテトラミンや各種の２官能以上
のエポキシ化合物、イソシアネート類及びホルムアルデ
ヒド樹脂等を用いることが出来るが、硬化性、耐熱性の
面からヘキサメチレンテトラミンが好ましい。ヘキサメ
チレンテトラミンの添加量はフェノール樹脂組成物１０
０重量部に対して３〜２０重量部であり、好ましくは７
〜１７重量部である。３重量部未満では樹脂の硬化が不
十分になり、また、２０重量部を超えるとヘキサメチレ
ンテトラミンの分解ガスが成形品にふくれ、亀裂などを
発生させる。As a curing agent for the phenolic resin, hexamethylenetetramine, various epoxy compounds having two or more functionalities, isocyanates and formaldehyde resin can be used, if necessary. Hexamethylenetetramine is preferred. The amount of hexamethylenetetramine added was phenol resin composition 10
It is 3 to 20 parts by weight relative to 0 parts by weight, preferably 7 to 20 parts by weight.
１７17 parts by weight. If the amount is less than 3 parts by weight, the curing of the resin becomes insufficient, and if it exceeds 20 parts by weight, the decomposition gas of hexamethylenetetramine bulges the molded product, causing cracks and the like.
【０００８】ゴム成分はニトリル−ブタジエンゴム、ア
クリル酸エステル含有エラストマーである。ニトリル−
ブタジエンゴムは固形状、液状、エマルジョンで、好ま
しくはニトリル量が２５〜３６％の中高ニトリルタイプ
のものである。これらを単独または２種類以上組合わせ
て使用してもよい。アクリル酸エステル含有エラストマ
ーとしてはアクリル酸エステル重合エラストマー、エチ
レン−（メタ）アクリル酸エステル共重合エラストマー
であり、これらを単独または２種類以上組合わせて使用
してもよい。また、ニトリル−ブタジエンゴムとアクリ
ル酸エステル含有エラストマーを併用することも可能で
ある。The rubber component is a nitrile-butadiene rubber or an acrylic ester-containing elastomer. Nitrile-
The butadiene rubber is a solid, liquid or emulsion, preferably a medium to high nitrile type having a nitrile content of 25 to 36%. These may be used alone or in combination of two or more. The acrylic ester-containing elastomer is an acrylic ester polymerized elastomer or an ethylene- (meth) acrylate copolymerized elastomer, and these may be used alone or in combination of two or more. It is also possible to use a nitrile-butadiene rubber and an acrylate-containing elastomer together.
【０００９】フェノール樹脂とゴム成分とを必須成分と
して含有する樹脂組成物の製造方法としては次の５通り
がある。２通り以上の製造方法を併用することもでき
る。 １．予め加温溶解したフェノール類にゴム成分を溶解し
た後、触媒、ホルマリン類を添加、反応させ樹脂を得る
方法。 ２．フェノール類、ホルマリン類、触媒により還流反応
後、ゴム成分を添加、脱水反応を行い樹脂を得る方法。 ３．フェノール類、ホルマリン類、触媒により還流反
応、脱水反応を行った後の高温時にゴム成分を添加、混
合する方法。 ４．固形フェノール樹脂とゴム成分を加圧ニーダー等の
混練機により混合する方法。 ５．固形フェノール樹脂とヘキサミンを粉砕混合する
際、ゴム成分を添加、混合する方法。There are the following five methods for producing a resin composition containing a phenolic resin and a rubber component as essential components. Two or more manufacturing methods can be used in combination. 1. A method in which a rubber component is dissolved in phenols that have been heated and dissolved in advance, and then a catalyst and formalins are added and reacted to obtain a resin. 2. A method of obtaining a resin by performing a reflux reaction with phenols, formalins, and a catalyst, then adding a rubber component, and performing a dehydration reaction. 3. A method in which a rubber component is added and mixed at a high temperature after performing a reflux reaction and a dehydration reaction with phenols, formalins, and a catalyst. 4. A method of mixing a solid phenolic resin and a rubber component with a kneader such as a pressure kneader. 5. A method of adding and mixing a rubber component when pulverizing and mixing solid phenolic resin and hexamine.
【００１０】本発明においては、オルソ結合対パラ結合
の比（ｏ／ｐ比）を０．７以上１．０未満に制御するこ
とにより、成形時の硬化速度が適度に速まり、ガス抜け
が良好になされるために、ゴム成分を含有するにもかか
わらず、ふくれ、亀裂などがない良質な成形品を短時間
で得ることができる。更に、フェノール樹脂との相溶性
の良いゴム成分を含有させることにより靱性、振動吸収
性に優れる成形品が得られる。In the present invention, by controlling the ratio of ortho bonds to para bonds (o / p ratio) to 0.7 or more and less than 1.0, the curing speed at the time of molding is appropriately increased, and outgassing is reduced. In order to perform the molding satisfactorily, a high-quality molded article free of blisters, cracks and the like can be obtained in a short time, despite containing a rubber component. Further, by adding a rubber component having good compatibility with the phenol resin, a molded article excellent in toughness and vibration absorption can be obtained.
【００１１】本発明のフェノール樹脂組成物の用途とし
ては、成形材料用素材、有機繊維粘結剤、ゴム配合剤、
研磨材用粘結剤、摩擦材用粘結剤、ゴム配合剤、無機繊
維粘結剤、電子電気部品被覆剤、摺動部材粘結剤、エポ
キシ樹脂原料及びエポキシ樹脂硬化剤などが挙げられる
が、摩擦材用粘結剤が特に好ましい用途である。The phenolic resin composition of the present invention may be used as a material for molding materials, an organic fiber binder, a rubber compounding agent,
Binders for abrasives, binders for friction materials, rubber compounding agents, inorganic fiber binders, coating agents for electronic and electrical parts, binders for sliding members, epoxy resin raw materials, epoxy resin curing agents, etc. A binder for a friction material is a particularly preferred use.
【００１２】[0012]
【実施例】以下、本発明を実施例により説明する。しか
し本発明はこれらの実施例によって限定されるものでは
ない。また、実施例及び比較例に記載されている「部」
及び「％」は、すべて「重量部」及び「重量％」を示
す。The present invention will be described below with reference to examples. However, the present invention is not limited by these examples. Further, “parts” described in Examples and Comparative Examples
And "%" all indicate "parts by weight" and "% by weight".
【００１３】（実施例１）撹拌装置、還流冷却器及び温
度計を備えた反応装置にフェノール１０００部、ゴム成
分として日本ゼオン(株)製アクリル酸エステル重合エラ
ストマー「NipolAR31」を１１０部を入れ、内温を１０
０℃まで加熱し、エラストマーが完全に溶解した後、内
温を６０℃以下に下げ、３７％ホルマリン６３０部及び
酢酸亜鉛５部を仕込後、徐々に昇温し温度が１００℃に
達してから１２０分間還流反応を行った。内温が１１０
℃に達するまで常圧脱水を行い、次いで真空脱水を行
い、系内の温度が１６０℃まで昇温したところで、内容
物を反応器より取出して常温で固形のフェノール樹脂組
成物１１８０部を得た。(Example 1) A reactor equipped with a stirrer, a reflux condenser and a thermometer was charged with 1000 parts of phenol and 110 parts of an acrylic ester polymer elastomer "NipolAR31" manufactured by Zeon Corporation as a rubber component. Internal temperature 10
After heating to 0 ° C and the elastomer was completely dissolved, the internal temperature was lowered to 60 ° C or less, 630 parts of 37% formalin and 5 parts of zinc acetate were charged, and then the temperature was gradually raised until the temperature reached 100 ° C. The reflux reaction was performed for 120 minutes. Internal temperature is 110
Dehydration under normal pressure was performed until the temperature reached ° C, and then vacuum dehydration was performed. When the temperature in the system was raised to 160 ° C, the contents were taken out of the reactor to obtain 1180 parts of a phenol resin composition which was solid at normal temperature. .
【００１４】（実施例２）ゴム成分を昭和電工・デュポ
ン製エチレン−アクリル酸エステル共重合エラストマー
「ベイマックＧ」とした以外は実施例１と同様に反応さ
せ常温で固形のフェノール樹脂組成物１１８０部を得
た。(Example 2) 1180 parts of a phenol resin composition solid at room temperature by reacting in the same manner as in Example 1 except that the rubber component was an ethylene-acrylate copolymer elastomer "Baymac G" manufactured by Showa Denko Dupont. I got
【００１５】（実施例３）ゴム成分を日本ゼオン(株)製
中高ニトリル固形ＮＢＲ「Nipol 1042」とした以外は実
施例１と同様に反応させ常温で固形のフェノール樹脂組
成物１１８０部を得た。Example 3 A reaction was carried out in the same manner as in Example 1 except that the rubber component was changed to medium-high nitrile solid NBR "Nipol 1042" manufactured by Zeon Corporation to obtain 1180 parts of a phenol resin composition which was solid at room temperature. .
【００１６】（実施例４）ゴム成分を日本合成ゴム(株)
製中高ニトリル液状ＮＢＲ「N280」とした以外は実施例
１と同様に反応させ常温で固形のフェノール樹脂組成物
１１８０部を得た。(Example 4) Nippon Synthetic Rubber Co., Ltd.
The reaction was carried out in the same manner as in Example 1 except that the medium-to-manufactured high nitrile liquid NBR "N280" was used, to obtain 1180 parts of a phenol resin composition which was solid at room temperature.
【００１７】（比較例１）実施例１と同様の反応装置に
フェノール１０００部、３７％ホルマリン６３０部及び
酢酸亜鉛５部を仕込後、徐々に昇温し温度が１００℃に
達してから１２０分間還流反応を行った。内温が１１０
℃に達するまで常圧脱水を行い、次いで真空脱水を行
い、系内の温度が１６０℃まで昇温したところで、内容
物を反応器より取出して常温で固形のフェノール樹脂組
成物１０７０部を得た。(Comparative Example 1) 1000 parts of phenol, 630 parts of 37% formalin and 5 parts of zinc acetate were charged into the same reactor as in Example 1, then the temperature was gradually raised and 120 minutes after the temperature reached 100 ° C. A reflux reaction was performed. Internal temperature is 110
Dehydration under normal pressure was performed until the temperature reached ° C, and then vacuum dehydration was performed. When the temperature in the system was raised to 160 ° C, the contents were taken out of the reactor to obtain 1070 parts of a phenol resin composition which was solid at normal temperature. .
【００１８】（比較例２）実施例１と同様の反応装置に
フェノール１０００部、蓚酸１０部を仕込後、徐々に昇
温し温度が１００℃に達してから３７％ホルマリン６３
０部を６０分間かけ分割添加し、次いで１２０分間還流
反応を行った。内温が１１０℃に達するまで常圧脱水を
行い、次いで真空脱水を行い、系内の温度が１６０℃ま
で昇温したところで、内容物を反応器より取出して常温
で固形のフェノール樹脂組成物１０７０部を得た。Comparative Example 2 The same reactor as in Example 1 was charged with 1000 parts of phenol and 10 parts of oxalic acid, and the temperature was gradually increased until the temperature reached 100 ° C., and then 37% formalin 63 was added.
0 parts were added in portions over 60 minutes, followed by a reflux reaction for 120 minutes. Normal pressure dehydration is performed until the internal temperature reaches 110 ° C., then vacuum dehydration is performed, and when the temperature in the system rises to 160 ° C., the contents are taken out of the reactor and the solid phenol resin composition 1070 is removed at normal temperature. Got a part.
【００１９】（比較例３）実施例１と同様の反応装置に
フェノール１０００部、ゴム成分として日本ゼオン(株)
製アクリル酸エステル重合エラストマー「Nipol AR31」
を１１０部を入れ、内温を１００℃まで加熱し、エラス
トマーが完全に溶解した後、内温を６０℃以下に下げ、
蓚酸１０部を仕込後、徐々に昇温し温度が１００℃に達
してから３７％ホルマリン６３０部６０分かけ分割添加
し、次いで１２０分間還流反応を行った。内温が１１０
℃に達するまで常圧脱水を行い、次いで真空脱水を行
い、系内の温度が１６０℃まで昇温したところで、内容
物を反応器より取出して常温で固形のフェノール樹脂組
成物１１８０部を得た。(Comparative Example 3) In the same reactor as in Example 1, 1000 parts of phenol and Nippon Zeon Co., Ltd. as a rubber component were used.
Acrylic ester polymerized elastomer "Nipol AR31"
, And the internal temperature is heated to 100 ° C., and after the elastomer is completely dissolved, the internal temperature is reduced to 60 ° C. or less,
After 10 parts of oxalic acid was charged, the temperature was gradually raised and the temperature reached 100 ° C., and 630 parts of 37% formalin were added in portions over 60 minutes, followed by a reflux reaction for 120 minutes. Internal temperature is 110
Dehydration under normal pressure was performed until the temperature reached ° C, and then vacuum dehydration was performed. When the temperature in the system was raised to 160 ° C, the contents were taken out of the reactor to obtain 1180 parts of a phenol resin composition which was solid at normal temperature. .
【００２０】（比較例４）酢酸亜鉛の仕込量を１０部と
した以外は実施例１と同様に反応させ常温で固形のフェ
ノール樹脂組成物１１８０部を得た。Comparative Example 4 The reaction was carried out in the same manner as in Example 1 except that the charged amount of zinc acetate was changed to 10 parts to obtain 1180 parts of a phenol resin composition which was solid at room temperature.
【００２１】実施例１〜４及び比較例１〜４で得られた
常温で固形のフェノール樹脂組成物１０００部を各々別
々にヘキサメチレンテトラミン１４０部加え、粉砕し、
粉末のフェノール樹脂組成物１１２９部を得た。実施例
１〜４及び比較例１〜４で得られた８種のフェノール樹
脂組成物を各々別々に以下に示す配合割合で混合した。 （配合割合） 配合物 配合量（重量％） ガラス繊維 ２０ 炭酸カルシウム ７０ 樹脂 １０Each of 1000 parts of the phenol resin composition solid at room temperature obtained in Examples 1 to 4 and Comparative Examples 1 to 4 was separately added with 140 parts of hexamethylenetetramine, and pulverized.
1129 parts of a powdery phenol resin composition were obtained. The eight types of phenol resin compositions obtained in Examples 1 to 4 and Comparative Examples 1 to 4 were separately mixed at the following mixing ratios. (Blending ratio) Blending amount Blending amount (% by weight) Glass fiber 20 Calcium carbonate 70 Resin 10
【００２２】この配合物を温度１６０℃、圧力２００ｋ
ｇ／ｃｍ2 で１０分間成形した後１８０℃で３時間焼成
してテストピ−スを作成した。比較例４の樹脂配合物を
用いたテストピースは、成形時にガスぶくれが生じたた
め、成形物の特性の測定は行わなかった。得られた７種
のフェノール樹脂配合物のテストピースのロックウェル
硬度、動的粘弾性の tan δ の値による柔軟性評価結
果、ｏ／ｐ比測定結果、及び樹脂の硬化特性であるゲル
化時間を表１に示す。ｏ／ｐ比の測定は赤外吸収スペク
トルを用い、７３０〜７７０cm-1に現れるオルソ結合の
吸光度、８００〜８４０cm-1に現れるパラ結合の吸光度
の比率により行った。This composition was heated at a temperature of 160.degree.
After molding at g / cm 2 for 10 minutes, it was baked at 180 ° C. for 3 hours to prepare a test piece. In the test piece using the resin composition of Comparative Example 4, gas characteristics occurred at the time of molding, so that the characteristics of the molded product were not measured. Rockwell hardness of a test piece of the obtained seven types of phenolic resin blends, flexibility evaluation results based on tan δ values of dynamic viscoelasticity, o / p ratio measurement results, and gelation time, which is a curing property of the resin Are shown in Table 1. Measurement of o / p ratio using an infrared absorption spectrum, the absorbance of ortho bond appearing in 730～770Cm -1, it was carried out by the ratio of the absorbance of para bonds appearing in 800~840cm -1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】表１より明らかなように、比較例１で得ら
れたフェノール樹脂組成物についてはｏ／ｐ比が高いた
め、ゲル化時間が短く硬化が速いが、硬度が高い、tan
δの値が低いことから柔軟性に欠けることが分かる。比
較例２で得られたフェノール樹脂組成物についてはｏ／
ｐ比が低く、ゴム成分も含有しないため、硬化性、柔軟
性が不十分である。比較例３で得られたフェノール樹脂
組成物についてはゴム成分は含有するものの、ｏ／ｐ比
が低いため、硬化性が不十分である。これらに対して、
実施例１〜４で得られたフェノール樹脂組成物について
は硬度が低く、tan δの値が高いことから柔軟性に優れ
ることが分かる。また、ｏ／ｐ比が高いため、ゲル化時
間が短く、硬化が速いことが分かる。As is clear from Table 1, the phenolic resin composition obtained in Comparative Example 1 has a high o / p ratio, so that the gelation time is short and the curing is fast, but the hardness is high.
Since the value of δ is low, it is understood that the film lacks flexibility. For the phenolic resin composition obtained in Comparative Example 2, o /
Since the p ratio is low and the rubber component is not contained, the curability and flexibility are insufficient. The phenolic resin composition obtained in Comparative Example 3 contains a rubber component, but has a low o / p ratio, and thus has insufficient curability. For these,
The phenolic resin compositions obtained in Examples 1 to 4 have low hardness and high tan δ, indicating that they have excellent flexibility. Further, it can be seen that since the o / p ratio is high, the gelation time is short and the curing is fast.
【００２５】[0025]
【発明の効果】本発明のフェノール樹脂組成物は、柔軟
性に優れており、硬化性に優れている。従って、振動吸
収性に優れる摩擦材等を得るためのバインダーとして好
適である。The phenolic resin composition of the present invention has excellent flexibility and curability. Therefore, it is suitable as a binder for obtaining a friction material having excellent vibration absorption.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｌ 21:00） ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI C08L 21:00)
Claims (3)
物で、樹脂中のメチレン結合においてオルソ結合対パラ
結合の比（ｏ／ｐ比）が０．７以上１．０未満であるフ
ェノール樹脂とゴム成分とを必須成分として含有するす
ることを特徴とするフェノール樹脂組成物。1. A polycondensate of a phenol and an aldehyde, wherein the ratio of the ortho bond to the para bond (o / p ratio) in the methylene bond in the resin is 0.7 or more and less than 1.0. A phenol resin composition comprising a rubber component as an essential component.
アクリル酸エステル含有エラストマーである請求項１記
載のフェノール樹脂組成物。2. A rubber component comprising a nitrile-butadiene rubber,
The phenol resin composition according to claim 1, which is an acrylic ester-containing elastomer.
る請求項１記載のフェノール樹脂組成物。3. The phenolic resin composition according to claim 1, wherein the content of the rubber component is 3 to 30% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10005999A JPH1171496A (en) | 1997-06-26 | 1998-01-14 | Phenol resin composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-170146 | 1997-06-26 | ||
| JP17014697 | 1997-06-26 | ||
| JP10005999A JPH1171496A (en) | 1997-06-26 | 1998-01-14 | Phenol resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1171496A true JPH1171496A (en) | 1999-03-16 |
Family
ID=26340055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10005999A Pending JPH1171496A (en) | 1997-06-26 | 1998-01-14 | Phenol resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1171496A (en) |
-
1998
- 1998-01-14 JP JP10005999A patent/JPH1171496A/en active Pending
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