JPH1170994A - Storage bag for electronic device and parts - Google Patents
Storage bag for electronic device and partsInfo
- Publication number
- JPH1170994A JPH1170994A JP9233870A JP23387097A JPH1170994A JP H1170994 A JPH1170994 A JP H1170994A JP 9233870 A JP9233870 A JP 9233870A JP 23387097 A JP23387097 A JP 23387097A JP H1170994 A JPH1170994 A JP H1170994A
- Authority
- JP
- Japan
- Prior art keywords
- bag
- nonwoven fabric
- paper
- thermoplastic resin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Buffer Packaging (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Bag Frames (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子機器・電子部
品(以下、電子機器類とする)の収納用袋に関し、さら
に詳しくは、静電気帯電による塵芥付着、IC破壊等を
特に嫌う電子機器、類例えばノート型パソコン本体、C
D(コンパクトディスク)プレイヤー、オーディオ機器
等及びそれらの半完成品、構成部品等の収納用袋に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bag for storing electronic devices and electronic components (hereinafter referred to as "electronic devices"). For example, notebook personal computer body, C
The present invention relates to a D (compact disk) player, audio equipment, and the like, and a storage bag for semi-finished products and components thereof.
【0002】[0002]
【従来の技術】パソコン、ワープロ等の電子機器類は、
工場から出荷されて使用者の手に届くまでに外的環境か
ら製品を安全に保護するため、ダンボール箱等にパッケ
ージされて保管輸送される。通常は、上記電子機器類は
低密度ポリエチレン(LDPE)フィルムをヒートシー
ルした袋(LDPE袋)等に収納され、その周囲を緩衝
材、例えば樹脂発泡体で囲み、更に充分な内容積を有す
るダンボール製の外箱に梱包される。2. Description of the Related Art Electronic devices such as personal computers and word processors are:
In order to safely protect the product from the external environment before it is shipped from the factory and reaches the user, it is stored and transported in a cardboard box or the like. Usually, the above electronic devices are housed in a bag (LDPE bag) in which a low-density polyethylene (LDPE) film is heat-sealed, and the periphery thereof is surrounded by a cushioning material, for example, a resin foam, and furthermore, a corrugated cardboard having a sufficient internal volume It is packed in an outer box made of steel.
【0003】しかしLDPE袋は、汚れや擦り傷等から
被包装物である電子機器類を保護することはできるもの
の、包装資材と被包装物との摩擦による静電気帯電、隣
接する前記包装資材同士の摩擦等による静電気帯電によ
るトラブル発生を防止するには問題があった。その様な
問題に対処するために、LDPE袋等の表面に帯電防止
剤を塗布したものが使用されていたが、該袋と被包装物
が密接する部分では、帯電防止剤が被包装物に付着する
問題があった。又、樹脂に帯電防止剤を練り混む方法で
は多量に配合しないと帯電防止効果が発現し難いことも
あった。[0003] However, although the LDPE bag can protect the electronic equipment as the package from dirt and abrasion, etc., the electrostatic charge due to the friction between the packaging material and the package, the friction between the adjacent packaging materials. However, there is a problem in preventing troubles caused by electrostatic charging due to the above-mentioned factors. To cope with such a problem, an antistatic agent applied to the surface of an LDPE bag or the like has been used. However, in a portion where the bag and the object to be packaged are in close contact, the antistatic agent is applied to the object to be packaged. There was a problem of sticking. In addition, in a method in which an antistatic agent is kneaded and mixed with a resin, an antistatic effect may not be easily exhibited unless a large amount is added.
【0004】その他、熱可塑樹脂の多層フィルムの表面
にアルミニウムを蒸着した袋や熱可塑性樹脂に導電性物
質(ケッチェンブラック等)を練り混んだ袋も使用され
ているが、高価なため原則使い捨てである本用途には適
しないうえ、複数の樹脂、及び金属を使用しているため
廃棄処分が困難である。In addition, a bag in which aluminum is deposited on the surface of a multilayer film of a thermoplastic resin or a bag in which a conductive material (Ketjen black or the like) is kneaded with a thermoplastic resin are also used. In addition, it is not suitable for this use, and it is difficult to dispose of it because a plurality of resins and metals are used.
【0005】[0005]
【発明が解決しようとする課題】本発明の目的は、包装
資材(内面)と被包装物との摩擦、隣接する収納袋同士
の摩擦、及び包装資材(外面)と緩衝材の摩擦等による
静電気帯電を抑えること、及び不織布の緩衝効果によ
り、汚れや擦り傷等から被包装物である電子機器類を保
護することができて、使用後の廃棄処分が簡易である電
子機器類用収納袋を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of producing a static electricity due to friction between a packaging material (inner surface) and an object to be packaged, friction between adjacent storage bags, and friction between a packaging material (outer surface) and a cushioning material. Provided is a storage bag for electronic devices, which can protect the electronic devices to be packaged from dirt and abrasion, etc. by suppressing the electrification and the buffer effect of the nonwoven fabric, and can be easily disposed of after use. Is to do.
【0006】[0006]
【課題を解決するための手段】本発明者らは、鋭意研究
を重ねた結果、特定の構成を持つ電子機器類収納用袋を
用いることで、上記目的を達成することを見いだした。
本発明はかかる知見に基づいてなされたものである。即
ち、本発明は、(1)紙及び帯電防止加工された熱可塑
性樹脂製不織布を貼り合わせた積層シートを、紙を外面
に、熱可塑性樹脂製不織布を内面にして袋状にヒートシ
ールした電子機器・電子部品用収納袋。 (2)不織布表面の表面固有抵抗値が1.0×1011Ω
以下の前記(1)の電子機器・電子部品収納用袋を提供
するものである。Means for Solving the Problems As a result of intensive studies, the present inventors have found that the above-mentioned object can be achieved by using a bag for storing electronic devices having a specific configuration.
The present invention has been made based on such findings. That is, the present invention relates to (1) an electronic device in which a laminated sheet obtained by laminating a paper and a non-woven fabric made of an antistatic thermoplastic resin is heat-sealed in a bag shape with the paper as the outer surface and the thermoplastic resin non-woven fabric as the inner surface. Storage bag for equipment and electronic components. (2) The surface resistivity of the surface of the nonwoven fabric is 1.0 × 10 11 Ω
The present invention provides the following electronic device / electronic component storage bag of (1).
【0007】[0007]
【発明の実施の形態】以下、本発明の実施の形態を具体
的に説明する。 1.積層シート 本発明にかかる電子機器類収納用袋を構成している積層
シートは、紙及び帯電防止加工された熱可塑性樹脂製不
織布を貼り合わせたシートである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below. 1. Laminated Sheet The laminated sheet constituting the electronic device storage bag according to the present invention is a sheet in which paper and a nonwoven fabric made of an antistatic thermoplastic resin are applied.
【0008】積層シートの厚みや紙層と熱可塑性樹脂製
不織布層の厚み比は特に限定はないが、本発明の電子機
器類収納用袋に求められる要求特性に応じて適宜調整す
れば良い。例えば、静電気防止性及び汚れ、擦り傷防止
性の他に緩衝性がより求められる場合は、熱可塑性樹脂
製不織布層の厚みを増せば良いし、焼却処分する際に焼
却炉を傷めないことを考慮する場合は、紙層の厚みを増
せば良い。 (1)帯電防止加工された熱可塑性不織布層 本発明にかかる電子機器類収納用袋を構成している不織
布はヒートシール可能な熱可塑性樹脂を使用した不織布
であるならば特に制限はなく、公知の方法で製造された
各種不織布が用いられる。The thickness of the laminated sheet and the thickness ratio between the paper layer and the thermoplastic resin nonwoven fabric layer are not particularly limited, but may be suitably adjusted according to the required characteristics required for the electronic equipment storage bag of the present invention. For example, if more cushioning properties are required in addition to antistatic properties, dirt and scratch resistance, consider increasing the thickness of the thermoplastic resin non-woven fabric layer and consider not damaging the incinerator during incineration. In this case, the thickness of the paper layer may be increased. (1) Antistatically processed thermoplastic nonwoven fabric layer The nonwoven fabric forming the electronic device storage bag according to the present invention is not particularly limited as long as it is a nonwoven fabric using a heat-sealable thermoplastic resin. Various nonwoven fabrics manufactured by the method described above are used.
【0009】例えば、該不織布を構成する繊維として
は、ポリプロピレン,ポリエチレン(LDPE,LLD
PE,HDPE),ポリエチレンテレフタレート,ナイ
ロン及びそれらの複合繊維、例えば繊維鞘部がポリエチ
レン、繊維芯部がポリプロピレンやナイロンからなる複
合繊維、若しくはポリエチレンとポリエチレンテレフタ
レートがサイドバイサイド型に複合した繊維が好ましく
用いられる。中でもポリプロピレンがより好ましく用い
られる。For example, as fibers constituting the nonwoven fabric, polypropylene, polyethylene (LDPE, LLD)
PE, HDPE), polyethylene terephthalate, nylon, and composite fibers thereof, for example, a composite fiber in which the fiber sheath is made of polyethylene and a fiber core is made of polypropylene or nylon, or a fiber in which polyethylene and polyethylene terephthalate are composited in a side-by-side type is preferably used. . Among them, polypropylene is more preferably used.
【0010】不織布の製造方法にも特に制限はないが、
不織布の緩衝性を考慮すると柔軟性やかさ高感が得られ
る方法を適宜選択することが好ましい。具体的にはスパ
ンボンド,スパンレース,熱風カード,熱エンボスカー
ド,ニードルパンチ法、メルトブロー等公知の方法にて
製造することができるが、中でも、緩衝性、適度な嵩高
性、強度等のバランスの点から下記製法が好しく用いら
れる。Although there is no particular limitation on the method for producing the nonwoven fabric,
In consideration of the cushioning property of the nonwoven fabric, it is preferable to appropriately select a method that can provide flexibility and bulkiness. Specifically, it can be manufactured by a known method such as spunbond, spunlace, hot air card, hot embossed card, needle punch method, melt blow, etc. Among them, among others, cushioning, moderate bulkiness, strength and the like are balanced. From the viewpoint, the following production method is preferably used.
【0011】スパンボンド法は上記利点に加え、一工程
で製造できることで好ましく、スパンレース法や熱風カ
ード法も同様に好ましい。不織布の目付についても、特
に制限はないが、15〜100g/m2 、好ましは20
〜60g/m2 である。100g/m2 を超えると、不
織布部が多くなりヒートシールによる製袋効率が低下
し、静電気防止加工が困難になるうえ、高コストにつな
がる。15g/m2 未満の場合、袋の強度が低く、ハン
ドリング時や被包装物との擦れにより破損する恐れがあ
り、また緩衝効果が期待し難いため被包装物の傷の原因
になりやすい。The spunbond method is preferable because it can be manufactured in one step in addition to the above advantages, and the spunlace method and the hot air card method are also preferable. The basis weight of the nonwoven fabric is not particularly limited, but is 15 to 100 g / m 2 , preferably 20 g / m 2 .
6060 g / m 2 . If it exceeds 100 g / m 2 , the nonwoven fabric portion increases, the efficiency of bag making by heat sealing decreases, the antistatic processing becomes difficult, and the cost increases. When it is less than 15 g / m 2 , the strength of the bag is low, the bag may be damaged during handling or by rubbing with the packaged object, and the cushioning effect is difficult to expect, so that the bag is likely to be damaged.
【0012】本発明で使用する帯電防止加工された熱可
塑性不織布は、前述の不織布を公知の方法で帯電防止加
工した物である。静電気防止加工法には、後加工法と、
予め帯電防止剤や導電性物質(有機系導電剤等)を練り
混んだ樹脂を紡糸して不織布を製造する方法が挙げられ
る。前者の例として、帯電防止性を有する界面活性剤を
不織布にグラビアロール塗布、スプレー塗布熱分解、含
浸塗布する方法が挙げられる。The thermoplastic nonwoven fabric subjected to antistatic treatment used in the present invention is obtained by subjecting the above nonwoven fabric to antistatic treatment by a known method. Post-processing methods include anti-static processing methods,
A method of producing a nonwoven fabric by spinning a resin in which an antistatic agent or a conductive substance (such as an organic conductive agent) has been kneaded in advance. As an example of the former, there is a method of applying a gravure roll coating, a spray coating pyrolysis, and an impregnation coating to a nonwoven fabric with a surfactant having an antistatic property.
【0013】袋の内面にあたる不織布と被包装物の擦れ
による帯電防止性能の劣化防止、被包装物への付着防止
及び経済性等を考慮すると、予め帯電防止剤を練り混ん
だ樹脂を紡糸して不織布を製造する方法が好ましい。た
だし後加工法でも、近距離輸送用で比較的耐久性を気に
しなくて良い場合は、少量の塗布で充分な帯電防止性能
を発現しうる界面活性剤を選べば付着の心配はなくな
る。要は使用環境において、袋内面の不織布の表面が帯
電防止性を発現して、かつ被包装物に付着等の問題を起
こさなければ良い。Considering the prevention of deterioration of the antistatic performance due to the rubbing of the non-woven fabric on the inner surface of the bag and the packaged object, the prevention of adhesion to the packaged item and the economical efficiency, a resin mixed with an antistatic agent in advance is spun. A method for producing a nonwoven fabric is preferred. However, even in the post-processing method, in the case where it is not necessary to worry about durability for short-distance transportation, if a surfactant capable of exhibiting sufficient antistatic performance with a small amount of application is selected, there is no fear of adhesion. In short, in the use environment, the surface of the non-woven fabric on the inner surface of the bag only needs to exhibit antistatic properties and not cause problems such as adhesion to the packaged object.
【0014】前記帯電防止剤は特に制限はなく公知のも
のを使用できる。例えば、第一級アミン塩、第三級アミ
ン、第四級アンモニウム化合物及びピリジン誘導体等の
陽イオン活性剤、脂肪アルコール硫酸エステル塩、アル
キル硫酸エステル塩及び脂肪酸エチルスルフォン酸塩等
のアニオン活性剤、脂肪アルコールのエチレンオキサイ
ド付加物、脂肪酸のエチレンオキサイド付加物及び脂肪
アミノまたは脂肪酸アミドのエチレンオキサイド付加物
等の非イオン活性剤、カルボン酸誘導体(ペタイン形)
及びヒドロキシエチルイミダゾリン硫酸エステル等の両
性活性剤、高分子量のポリエチレンオキサイド等の高分
子型の帯電防止剤が挙げられる。The antistatic agent is not particularly limited, and known ones can be used. For example, primary amine salts, tertiary amines, cationic surfactants such as quaternary ammonium compounds and pyridine derivatives, anionic surfactants such as fatty alcohol sulfates, alkyl sulfates and fatty acid ethyl sulfonates, Nonionic activators such as ethylene oxide adducts of fatty alcohols, ethylene oxide adducts of fatty acids and ethylene oxide adducts of fatty amino or fatty acid amides, carboxylic acid derivatives (petaine form)
And amphoteric activators such as hydroxyethylimidazoline sulfate and high molecular weight antistatic agents such as high molecular weight polyethylene oxide.
【0015】本発明で好ましい静電気防止性の目安は、
不織布の表面固有抵抗値が23℃−相対湿度50%下で
1.0×1013Ω未満、好ましくは1.0×1012Ω以下、
更に好ましくは1.0×1011Ω以下であり、不織布の摩
擦帯電圧が23℃−相対湿度50%下で1500V以
下、好ましくは1000V以下、更に好ましくは500
V以下である。In the present invention, a preferable standard of antistatic property is:
The surface specific resistance of the nonwoven fabric is less than 1.0 × 10 13 Ω, preferably 1.0 × 10 12 Ω or less at 23 ° C. and 50% relative humidity;
More preferably, it is 1.0 × 10 11 Ω or less, and the friction band voltage of the nonwoven fabric is 1500 V or less, preferably 1000 V or less, more preferably 500 V at 23 ° C. and 50% relative humidity.
V or less.
【0016】表面固有抵抗値が1.0×1013Ω以上及び
/又は摩擦帯電圧が1500V以上の場合、摩擦等によ
る静電気帯電、その静電気帯電により空気中の塵芥が包
装物に付着することにより発生する傷、汚れ等から被包
装物を充分に保護できない可能性が高くなる。 (2)紙層 特に制限はなく、例えばパルプ、セルロース、ミツマ
タ、コウゾ等の植物繊維を抄紙した公知の紙、リサイク
ル紙及びレーヨン、セルロースアステート、合成繊維、
ポリプロピレン、ポリエチレンを抄紙した公知の合成紙
が挙げられる。When the surface specific resistance value is 1.0 × 10 13 Ω or more and / or the frictional band voltage is 1500 V or more, static charge due to friction or the like, and dust in the air adheres to the package due to the static charge. There is a high possibility that the packaged product cannot be sufficiently protected from the generated scratches, dirt, and the like. (2) Paper layer There is no particular limitation, for example, known paper made of plant fibers such as pulp, cellulose, mitsumata, mulberry, recycled paper and rayon, cellulose acetate, synthetic fiber,
Known synthetic papers made of polypropylene and polyethylene may be used.
【0017】一般にクラフト紙、純白ロール紙、パルプ
とレーヨンの混抄紙が好ましく、その中でもパルプとレ
ーヨンの混抄紙が適度に腰があり、梱包のし易さの点で
特に好ましい。パルプとレーヨンの混合割合は特に制限
はないが好ましくは重量比でパルプ/レーヨン=1/9
〜9/1、特に好ましくは3/7〜7/3である。目付
は10〜100g/m2 の物が好ましく、更に好ましく
は20〜50g/m2 である。In general, kraft paper, pure white roll paper, and mixed paper of pulp and rayon are preferred, and among them, mixed paper of pulp and rayon is particularly preferable because of its moderate stiffness and ease of packing. The mixing ratio of pulp and rayon is not particularly limited, but is preferably pulp / rayon = 1/9 by weight.
To 9/1, particularly preferably 3/7 to 7/3. Basis weight is preferably those of 10 to 100 g / m 2, more preferably from 20 to 50 g / m 2.
【0018】目付が10g/m2 より小さい場合、輸送
中の擦り、取り扱い時、製袋時に破損することが多くな
り、100g/m2 より大きい場合は、袋の柔軟性が損
なわれるうえ、取り扱い時に皺が残り美観が損なわれる
こともある。上記目付は一般的な目安であり、低目付で
も強度がある場合、10g/m2 未満でも実用上問題な
いであろうし、柔軟な素材であれば100g/m2 を超
えても、袋の柔軟性や皺の問題は実用上問題ないことも
ある。If the basis weight is less than 10 g / m 2 , it is likely to be rubbed during transportation, damaged during handling and bag making, and if it is greater than 100 g / m 2 , the flexibility of the bag will be impaired and the handling will be poor. Sometimes wrinkles are left and the appearance is impaired. The basis weight is a general guideline, if there is a strength at low basis weight, to would no practical problem even less than 10 g / m 2, even beyond 100 g / m 2 if a flexible material, the flexible bag The problem of wrinkles and wrinkles may not be a problem in practical use.
【0019】通常、紙の目付が大きければ、低目付の紙
を使用する時より高強度になるためその分、廃棄処理に
問題がある熱可塑性樹脂製の不織布の使用重量を減ら
せ、焼却時の発熱カロリーを削減できるというメリット
がある。袋の柔軟性、皺の問題、高価格等の問題が実用
上許容できるならば、紙と熱可塑性樹脂不織布の重量比
(紙/フィルム)は大きい方が好ましい。In general, when the basis weight of paper is large, the strength becomes higher than when low-weight paper is used. Therefore, the weight of the non-woven fabric made of thermoplastic resin, which has a problem in disposal, can be reduced by that much, and the amount of paper used during incineration can be reduced. There is an advantage that calorific value can be reduced. If the problems of bag flexibility, wrinkles, and high price are practically acceptable, it is preferable that the weight ratio (paper / film) between paper and the thermoplastic resin nonwoven fabric is large.
【0020】又、紙は必要に応じて各種添加剤、例えば
前記熱可塑性樹脂製不織布に用いることができる帯電防
止剤、滑剤等を配合しても構わない。 (3)積層方法 本発明にかかる電子機器類収納袋は、前記、紙と熱可塑
性樹脂不織布が積層されたシートを製袋したものであ
る。The paper may optionally contain various additives such as an antistatic agent and a lubricant which can be used for the thermoplastic resin nonwoven fabric. (3) Lamination Method The electronic equipment storage bag according to the present invention is a bag made of a sheet in which the paper and the thermoplastic resin nonwoven fabric are laminated.
【0021】該シートの積層方法は、公知の方法で良
く、例えば押出ラミネート、ドライラミネート、ホット
メルト接着剤を使用した積層方法が考えられるが、特に
高生産低コストの面から、押出ラミネート法が好まし
い。紙と熱可塑性樹脂不織布の間に入る接着層、通常ホ
ットメルト接着剤(エチレンビニルアルコール系,エチ
レンエチルアクリレート系,エチレンメチルメタアクリ
レート系)、低密度ポリエチレン、直鎖低密度ポリエチ
レン、エチレンビニルアルコールフィルム層(押出ラミ
ネート法)、ドライラミネート用の溶媒系、エマルジョ
ン系接着剤が挙げられる。The method of laminating the sheet may be a known method, such as extrusion lamination, dry lamination, or lamination using a hot melt adhesive. In particular, extrusion lamination is preferred from the viewpoint of high production and low cost. preferable. Adhesive layer between paper and thermoplastic non-woven fabric, usually hot melt adhesive (ethylene vinyl alcohol, ethylene ethyl acrylate, ethylene methyl methacrylate), low density polyethylene, linear low density polyethylene, ethylene vinyl alcohol film Layer (extrusion lamination method), a solvent system for dry lamination, and an emulsion adhesive.
【0022】接着剤の使用量は、熱可塑性樹脂の使用量
を減らすためにも可能な限り少ない方が好ましい。一般
に5〜30g/m2 、更に好ましくは10〜20g/m
2 である。接着層は部分塗工よりも、全面に均一な膜を
形成し、不織布と紙を密着させてているのが、均一な膜
により防水性が得られるため好ましい。The amount of adhesive used is preferably as small as possible in order to reduce the amount of thermoplastic resin used. Generally, 5 to 30 g / m 2 , more preferably 10 to 20 g / m 2
2 It is preferable that the adhesive layer forms a uniform film on the entire surface and makes the nonwoven fabric and the paper adhere to each other, rather than the partial coating, because waterproofness can be obtained by the uniform film.
【0023】接着性能を必要以上に損なわない範囲で、
帯電防止剤を配合しても良い。不織布、接着層の帯電防
止効果が、紙表面の摩擦帯電防止に寄与する。 2.電子機器・電子部品用収納袋 (1)前記積層シートを袋状にする態様 ヒートシールして袋状にする際、最外面が紙層、最内面
に帯電防止された熱可塑性樹脂製不織布層であれば良
い。紙層と熱可塑性樹脂製不織布層の間には接着層以外
には何もない方が好ましい。As long as the adhesive performance is not impaired more than necessary,
You may mix | blend an antistatic agent. The antistatic effect of the nonwoven fabric and the adhesive layer contributes to the prevention of triboelectric charging of the paper surface. 2. Storage bag for electronic devices and electronic components (1) Embodiment in which the laminated sheet is formed into a bag When heat-sealing into a bag, the outermost surface is a paper layer, and the innermost surface is an antistatic thermoplastic resin nonwoven fabric layer. I just want it. It is preferable that there is nothing between the paper layer and the thermoplastic resin nonwoven fabric layer other than the adhesive layer.
【0024】ここで最外面が紙層とは、「最外面が実質
的に紙層」であれば良く、例えば紙表面に薄い保護フィ
ルムが貼ってある場合も「最外面が紙層」に含まれる。 (2)製袋方法 被包装物の寸法に合わせて裁断し、不織布面を内側にし
て従来公知の方法でヒートシールして袋状にするか、ヒ
ートシール後、裁断して袋状にする。Here, the outermost surface is a paper layer as long as the outermost surface is substantially a paper layer. For example, even when a thin protective film is stuck on the paper surface, the outermost surface is included in the paper layer. It is. (2) Bag-making method The bag is cut in accordance with the dimensions of the packaged object, and heat-sealed into a bag-like shape by a conventionally known method with the nonwoven fabric surface inside, or cut into a bag-like shape after heat sealing.
【0025】具体的には熱板シール、インパルスシー
ル、超音波シール、高周波ウェルダー製袋法が挙げられ
るが、生産速度の面から熱板シールを用いた製袋機を使
用することが好ましい。Specific examples include a hot plate seal, an impulse seal, an ultrasonic seal, and a high frequency welder bag making method. From the viewpoint of production speed, it is preferable to use a bag making machine using a hot plate seal.
【0026】[0026]
実施例1 帯電防止性を付与されたポリプロピレンスパンボンド不
織布(出光石油化学製RN2020E )20g/m2 と混抄紙
(井上製紙製 パルプ/レーヨン=1/1:重量比)3
0g/m2 をTダイ押出機を用いて低密度ポリエチレン
(東ソー製ペトロセン212)18μm で積層シートを
得た。その積層シートを用い、不織布層を内面にした3
0cm×30cmの三辺を熱板シール機でヒートシール
して図1の袋を得た。Example 1 Polypropylene spunbond nonwoven fabric (RN2020E manufactured by Idemitsu Petrochemical) 20 g / m 2 provided with antistatic property and mixed paper (pulp / rayon = 1/1: weight ratio, manufactured by Inoue Paper) 3
Using a T-die extruder, 0 g / m 2 of 18 μm low-density polyethylene (Petrocene 212 manufactured by Tosoh Corporation) was used to obtain a laminated sheet. Using the laminated sheet, 3
The three sides of 0 cm × 30 cm were heat-sealed with a hot plate sealing machine to obtain the bag of FIG.
【0027】不織布面(袋内面)の表面固有抵抗をJIS
K6911 法(23℃-50%RH) で測定したところ、1.2×10
10、不織布面の摩擦帯電圧はJIS L1094B法(23℃-50%R
H) 、平均350V(最小280V,最大450V)で
あった。 比較例1 帯電防止性を付与されていないポリプロピレンスパンボ
ンド不織布(出光石油化学製,RN2020)20g/m2 を
使用した以外は実施例1と同様にして袋体を作製した。The specific resistance of the surface of the nonwoven fabric (the inner surface of the bag) is determined by JIS.
When measured by the K6911 method (23 ° C-50% RH), 1.2 × 10
10. The frictional voltage of the non-woven fabric surface is JIS L1094B method (23 ℃ -50% R
H), and the average was 350 V (minimum 280 V, maximum 450 V). Comparative Example 1 A bag was produced in the same manner as in Example 1, except that 20 g / m 2 of a polypropylene spunbond nonwoven fabric (Idemitsu Petrochemical, RN2020) having no antistatic property was used.
【0028】不織布面の表面固有抵抗をJIS K6911 法で
測定したところ、2.0×1016Ω以上、不織布面の摩
擦帯電圧はJIS L1094B法(23℃-50%RH) 、平均2600
V(最小1500V,最大4200V)であった。The surface specific resistance of the nonwoven fabric surface was measured by JIS K6911 method to be 2.0 × 10 16 Ω or more, and the frictional charged voltage of the nonwoven fabric surface was JIS L1094B method (23 ° C.-50% RH), averaged 2600
V (minimum 1500 V, maximum 4200 V).
【0029】[0029]
【発明の効果】本発明によれば、袋の内面が静電気防止
加工された熱可塑性不織布からなるため、被包装物との
摩擦による静電気帯電を抑えること、及び不織布の緩衝
効果により、汚れや擦り傷等から被包装物である電子機
器を保護することができる。又、袋の外面が紙であるた
め、外的物品(隣接する収納用袋、緩衝材等)と袋外面
の摩擦による静電気発生が抑えられる。According to the present invention, since the inner surface of the bag is made of a thermoplastic non-woven fabric which has been subjected to antistatic treatment, the electrostatic charge due to friction with the packaged object is suppressed, and the buffer effect of the non-woven fabric causes dirt and scratches. It is possible to protect the electronic device which is the packaged object from the above. Further, since the outer surface of the bag is paper, generation of static electricity due to friction between an external article (adjacent storage bag, cushioning material, etc.) and the outer surface of the bag can be suppressed.
【0030】上記利点に加え、紙と複合することで焼却
時の発熱カロリーを削減することができる。In addition to the above advantages, the calorific value during incineration can be reduced by combining with paper.
【図1】発明の電子機器・電子部品用収納袋の一例であ
る。FIG. 1 is an example of a storage bag for electronic devices and electronic components of the present invention.
【図2】記袋を形成する積層シートの断面(図1のA→
←A, 部の拡大図)FIG. 2 is a cross-sectional view of a laminated sheet forming a storage bag (A → FIG. 1);
← A , Enlarged view of the part)
1:紙 2:不織布 3:ヒートシール部 4:A→ ←A, 積層シートの断面(Aが袋の最内層
面,A, が袋の最外層)1: paper 2: non-woven fabric 3: heat-sealed part 4: A → ← A , cross section of the laminated sheet (A is the innermost surface of the bag, A , is the outermost layer of the bag)
Claims (2)
製不織布を貼り合わせた積層シートを、紙を外面に、熱
可塑性樹脂製不織布を内面にして袋状にヒートシールし
た電子機器・電子部品用収納袋。1. An electronic device or electronic component obtained by heat-sealing a laminated sheet obtained by laminating a paper and a non-woven fabric made of an antistatic thermoplastic resin into a bag with the paper as an outer surface and the non-woven fabric made of a thermoplastic resin as an inner surface. Storage bag.
抗値が1.0×1011Ω以下の請求項1の電子機器・電子
部品用収納袋。2. The storage bag according to claim 1, wherein the surface resistivity of the surface of the thermoplastic resin nonwoven fabric is 1.0 × 10 11 Ω or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9233870A JPH1170994A (en) | 1997-08-29 | 1997-08-29 | Storage bag for electronic device and parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9233870A JPH1170994A (en) | 1997-08-29 | 1997-08-29 | Storage bag for electronic device and parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1170994A true JPH1170994A (en) | 1999-03-16 |
Family
ID=16961871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9233870A Pending JPH1170994A (en) | 1997-08-29 | 1997-08-29 | Storage bag for electronic device and parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1170994A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010042598A (en) * | 2008-08-12 | 2010-02-25 | Jsp Corp | Method of manufacturing antistatic multilayered sheet |
JP2010058517A (en) * | 2009-10-28 | 2010-03-18 | Asahi Kasei Fibers Corp | Laminate-processed paper |
JP2014172622A (en) * | 2013-03-07 | 2014-09-22 | Hitachi Systems Ltd | Package for electronic device |
-
1997
- 1997-08-29 JP JP9233870A patent/JPH1170994A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010042598A (en) * | 2008-08-12 | 2010-02-25 | Jsp Corp | Method of manufacturing antistatic multilayered sheet |
JP2010058517A (en) * | 2009-10-28 | 2010-03-18 | Asahi Kasei Fibers Corp | Laminate-processed paper |
JP2014172622A (en) * | 2013-03-07 | 2014-09-22 | Hitachi Systems Ltd | Package for electronic device |
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