JPH116049A - Vacuum film forming equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide vacuum film forming equipment capable of solving the problem of adhesion of vapor deposition material in a vacuum vessel by merely performing a relatively simple operation and also capable of continuous normal running for a long period. SOLUTION: This equipment has a vacuum vessel 10, a plasma beam generator 20 as a plasma source attached to the vacuum vessel 10, and a hearth 41 as an anode disposed in the bottom of the vacuum vessel 10. A plasma beam generated by the plasma beam generator 20 is introduced to the hearth 41 to ionize a vapor deposition material 200, by which a film composed of the vapor deposition material 200 is formed on a substrate, as an object of treatment, which is disposed in the position above the hearth 41 and to which voltage is applied. An adhesion-preventive plate 71 made of metal is disposed inside the side wall of a main body 11a of vessel of the vacuum vessel 10, and a mesh plate 72 made of metal is detachably disposed inside the adhesion- preventive plate 71.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum deposition apparatus for vaporizing a vapor deposition material in a vacuum vessel and depositing the vaporized vapor deposition material on an object to be processed.

[0002]

2. Description of the Related Art Vacuum film forming apparatuses include an ion plating apparatus, a plasma CVD apparatus, a vacuum evaporation apparatus, and a sputtering apparatus.

As an ion plating apparatus, for example, an apparatus using a pressure gradient type plasma source or an HCD plasma source, which is an arc discharge type plasma source, is known. Such an ion plating apparatus is provided with a plasma beam generator (plasma source), and generates a plasma beam between a hearth (anode) arranged in a vacuum vessel and the plasma beam generator. Is heated and evaporated. Then, the vapor-deposited metal particles from the vapor-deposited material are ionized by the plasma beam, and these ion particles adhere to the substrate surface at a negative voltage, and a film is formed on the substrate.

FIG. 5 is a diagram showing an example of a conventional ion plating apparatus. Referring to FIG. 5, this ion plating apparatus has an airtight vacuum vessel 10. A plasma beam generator (for example, a pressure gradient type plasma gun) 20 is attached to the vacuum vessel 10 via a guide unit 12. Outside the guide section 12, a steering coil 31 for guiding the plasma beam is provided. In the plasma beam generator 20, first and second intermediate electrodes 27 and 28 for converging a plasma beam are concentrically arranged. The first intermediate electrode 27 has a permanent magnet 27a built therein so that the magnetic pole axis is parallel to the central axis of the plasma generator 20.
The coil 28a is built in the second intermediate electrode 28.

[0005] The plasma beam generator 20 is provided with an insulating tube (for example, a glass tube) 21 connected to a passage defined by the first and second intermediate electrodes 27 and 28. A Mo cylinder 22 is arranged in the insulating tube 21.
A Ta pipe 23 is arranged in the Mo cylinder 22.
The space defined by the Mo cylinder 22 and the Ta pipe 23 is L
It is isolated by aB ₆ made of an annular plate 24. Insulating tube 21,
A conductor plate 25 is attached to one end of the Mo cylinder 22 and the Ta pipe 23. Carrier gas is introduced from a carrier gas inlet 26 formed in the conductor plate portion 25, and the carrier gas passes through the Ta pipe 23.

A substrate 100 as an object to be processed is disposed in a vacuum vessel 10 by being supported by a transfer device 60. A DC power supply for negative bias is connected to the substrate 100. A substrate 100 is provided on the bottom surface of the vacuum vessel 10.
A hearth (anode) 41 is arranged so as to oppose to.

[0007] The negative end of the variable power supply 90 is connected to the conductor plate 25. The positive end of the variable power supply 90 is connected to the first and second terminals via resistors R1 and R2, respectively.
Are connected to the intermediate electrodes 27 and. On the other hand, the hearth 41 includes a variable power supply 90 and resistors R1 and R1.
2 is connected. In addition, Ar walls are provided on the side walls of the vacuum vessel 10.
Gas inlet 10 for introducing a carrier gas such as gas
a and an exhaust port 10 b for exhausting the inside of the vacuum vessel 10.

In this ion plating apparatus, when a carrier gas is introduced from the carrier gas inlet 26,
Discharge starts between the first intermediate electrode 27 and the Mo cylinder 22. As a result, a plasma beam 300 is generated.
The plasma beam 300 is guided by the steering coil 31 and the permanent magnet 43a in the magnet case 43, and reaches the hearth 41 and the magnet case 43 used as an anode. When the plasma beam 300 is applied to the hearth 41, the deposition material 200 accommodated in the hearth 41 is heated by Joule heating and evaporates. The vapor-deposited metal particles are ionized and adhere to the surface of the substrate 100 to which a negative voltage is applied, and a film is formed on the substrate 100.

FIG. 6 shows an example of a conventional plasma CVD apparatus. 5, the same or similar parts as those of the ion plating apparatus shown in FIG. 5 are denoted by the same reference numerals as in FIG. 5, and description thereof will be omitted. Referring to FIG. 6, a source gas inlet 10a 'for introducing a source gas 250 as a vapor deposition material is formed on a side wall of a vacuum vessel 10' in the plasma CVD apparatus. An anode 41 'is arranged on the bottom surface in the vacuum vessel 10'.

In this plasma CVD apparatus, the vacuum vessel 1
0 'is evacuated, and a source gas 250 is introduced from a source gas inlet 10a'.
0 generates a plasma beam 300 to generate an anode 41 '.
Lead to. Then, the source gas 250 is ionized, adheres to the surface of the substrate 100 to which the negative voltage is applied, and
A film is formed on the top surface.

When the vacuum film forming apparatus including the examples shown in FIGS. 5 and 6 is operated, the vapor-deposited metal particles or the raw material gas from the vapor-deposited material adhere not only on the substrate but also on the inner wall surface of the vacuum vessel. I do. The deposition of the deposition material on the inner wall surface occurs regardless of whether the deposition metal particles or the source gas are ionized. The deposits may cause abnormal discharge or particles during operation of the apparatus. That is,
The deposition of the deposition material is an obstacle to normal operation of the apparatus and production of the product. For this reason, it is necessary to remove the deposits. However, cleaning the inner wall surface of the vacuum vessel, which is equipped with various members such as a plasma beam generator, an anode, and a transfer section, and which has a container shape, requires a great deal of labor, and also requires a high operating efficiency. Will be reduced.

Therefore, a technique using a plate member called a deposition-preventing plate is often adopted. In this method, if the deposition plate is arranged to cover the inner wall surface of the vacuum vessel, and the deposition material adheres to the deposition plate as the apparatus is operated, the thickness of the deposit may cause a problem. The operation of the apparatus is stopped before the thickness reaches a certain value, and the deposition-preventing plate is removed from the inside of the vacuum vessel to perform cleaning or the like. According to this method, since the deposition material does not adhere to the inner wall surface of the vacuum vessel, a difficult operation such as cleaning the vacuum vessel itself is unnecessary. As described above, by using the anti-adhesion plate, the problem of the deposition material being deposited in the vacuum vessel can be improved by performing a relatively simple operation.

[0013]

By the way, due to the properties of the adhered substance itself and the state of adherence, even if the adhered substance has a relatively small thickness, the adhered substance is peeled off from the adhesion-preventing plate, and the detached adhered substance is removed. May fall or float in containers. The detached deposits also cause abnormal discharge and particles, so even if the deposits are relatively thin, the operation of the device must be stopped and the anti-adhesion plate must be cleaned. There were things that did not work. That is, the conventional vacuum film forming apparatus has a problem that it cannot be operated continuously for a long time.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problem of deposition of a vapor deposition material in a vacuum vessel by performing only a relatively simple operation, and furthermore, to provide a vacuum film forming apparatus capable of continuously operating normally for a long time. It is to provide a device.

[0015]

According to the present invention, there is provided a vacuum film forming apparatus for vaporizing a vapor deposition material in a vacuum vessel and depositing the vaporized vapor deposition material on the surface of an object to be processed. , A metal deposition plate is disposed inside, and a metal mesh plate is detachably disposed inside the deposition plate to obtain a vacuum film forming apparatus.

According to the present invention, the mesh plate may include:
The above-described vacuum film forming apparatus including one of a wire mesh, an expanded metal, and a stamped metal plate is obtained.

According to the present invention, there is further provided the vacuum film forming apparatus, wherein the mesh plate is made of any one of copper, stainless steel, iron and aluminum.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a vacuum film forming apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing the configuration of an ion plating apparatus as a vacuum film forming apparatus. 5, the same parts as those in the conventional example or the same parts are denoted by the same reference numerals as in FIG. 5, and the description will be omitted. Further, an electric circuit and the like are not shown.

Referring to FIG. 1, the present apparatus comprises a vacuum vessel 10
A plasma beam generator 20 as a plasma source attached to the vacuum vessel 10, a steering coil 31 for guiding the plasma beam, and a function as an anode disposed at the bottom of the vacuum vessel.
The hearth 41 accommodates the substrate 100, and the transfer device 60 movably supports the substrate 100 as an object to be processed above the hearth 41. The vacuum container 10 includes a cylindrical container main body 11a, an upper plate 11b, and a lower plate 11c. Then, the plasma beam generated by the plasma beam generator 20 is guided to the hearth 41, and the evaporation material 20
0 is vaporized, and a film made of the vapor deposition material 200 is formed on the substrate 100 to which a voltage is applied above the hearth 41.

FIGS. 2 (a) and 2 (b) are views showing a part of the attachment plate 71 and a mesh plate described later in the apparatus shown in FIG. Referring to FIGS. 1 and 2, in the present apparatus, the deposition material is adhered to the inside of the side wall of the container body 11 a of the vacuum vessel 10, whereby the deposition material is adhered to the inside of the side wall of the container body 11 a. Is attached to the outside of the vacuum vessel 10 by a mounting bracket 73 so as to be able to be taken out. The deposition-preventing plate 71 is made of a material such as copper, stainless steel, iron, or aluminum that can withstand deposition of a vapor deposition material and does not generate gas during vapor deposition. The attachment prevention plates 71 are attached to four side walls of the container body 11a. Each of the four deposition-preventing plates 71 may be independent, or one set of two deposition-prevention plates 71 may be integrated in advance, or three deposition-prevention plates may be integrated. And 1
It may be a combination with sheets. Alternatively, the four attachment plates 7
1 may be in the form of a rectangular tube integrated in advance. Further, the attachment-preventing plate 71 may be disposed so as to be able to be taken out so as to cover the inner surface of the container main body 11a, and may be hung on the upper plate 11b, for example. In any case, the attachment-preventing plate 71 can be taken out of the vacuum container 10 after removing the upper plate 11b or the lower plate 11c from the container main body 11a.

Further, on the inner surface of the attachment-preventing plate 71, a mesh plate 72 constituted by a plate-like wire net is disposed so as to be detachable from the attachment-preventing plate 71. The mesh plate 72 is
Like the deposition-preventing plate 71, it is made of a material such as copper, stainless steel, iron, or aluminum that can withstand the deposition of a deposition material and does not generate gas during the deposition.

As shown in FIG. 2B, the mesh plate 72 is suspended from the attachment-preventing plate 71 by its hook portion 72a. The mesh plate 72 only needs to be disposed so as to be able to be taken out of the deposition-inhibiting plate 71, and may be bolted, for example. Further, the mesh plate 72 may be independent of four like the attachment-preventing plate 71, or may be a form in which two to four mesh plates 72 are integrated in advance. The mesh plate 72 connects the upper plate 11 b or the lower plate 11 c to the container body 11.
After being removed from the vacuum container 10, it can be taken out of the vacuum vessel 10 independently, or it can be removed together with the deposition preventing plate 71.

FIGS. 3A to 3D are diagrams for explaining the operation and effect of the mesh plate 72 in the present apparatus. As the apparatus operates, the mesh plate 72 on the deposition-preventing plate 71
As shown in FIGS. 3A to 3C, the vapor deposition material 200 gradually adheres as an adhered matter 200 '. The attached matter 200 ′ enters the adhesion-preventing plate 71 side from the mesh of the mesh plate and adheres so as to wrap around the mesh line of the mesh plate 72. Therefore, the mesh plate 72 of the attached matter 200 ′
The adhesion strength to the mesh plate 72 is not greater than the strength of the flat protection plate 71 or the rough-plated protection plate. Therefore, the problem of abnormal discharge and the like caused by the detached deposit 200 'can be solved. In addition, the deposit 20
It is not necessary to stop the operation of the apparatus until 0 'becomes a considerable adhesion thickness, and the apparatus can be operated continuously for a long time.

With respect to the coarse density of the mesh of the mesh plate 72, if the mesh is too dense, the mesh 200 is immediately crushed by the deposits 200 'and becomes no different from the plate member. ′ Is determined in consideration of the fact that '′ passes through the mesh and adheres to the deposition-preventing plate 71.

A predetermined amount of the deposit 200 'is attached to the mesh plate 72.
When the is adhered, the mesh plate 72 is taken out of the vacuum vessel and returned after removing the attached matter 200 ', or is replaced with a new mesh plate. Of course, it can also be removed together with the attachment-preventing plate 71.

Incidentally, the mesh plate in the present invention does not need to be constituted by a plate-shaped wire netting.
A mesh plate 7 which is a stamped metal plate as shown in FIG.
2 'or a mesh plate 72 "made of a plate-shaped expanded metal as shown in FIG. 4 (b).

In this embodiment, an ion plating apparatus has been described as an example. However, the present invention can be applied to other vacuum film forming apparatuses such as a plasma CVD apparatus.

[0029]

In the vacuum film forming apparatus according to the present invention, the metal deposition plate is disposed inside the side wall of the vacuum vessel, and the metal mesh plate is detachably disposed inside the deposition plate. The problem of adhesion of the vapor deposition material in the container can be solved only by performing a relatively simple operation, and the operation can be continuously performed for a long time. Specifically, since the deposits caused by the vapor deposition material are firmly attached to the mesh plate, it is difficult to peel off after the attachment. Therefore, the problem of abnormal discharge and the problem of generation of particles due to the detached deposits can be solved. Further, it is not necessary to stop the operation of the apparatus until the deposit becomes a considerable thickness, and the apparatus can be normally operated continuously for a long time.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an ion plating apparatus as a vacuum film forming apparatus according to an embodiment of the present invention.

FIGS. 2A and 2B are views showing a deposition-preventing plate and a mesh plate in the apparatus shown in FIG. 1, wherein FIG. 2A shows a part thereof, and FIG.

FIGS. 3 (a) to 3 (d) are diagrams for explaining the function and effect of the mesh plate in the apparatus shown in FIG. 1;

FIGS. 4 (a) and (b) are configuration examples of a mesh plate in the apparatus shown in FIG. 1 other than a wire mesh.

FIG. 5 is a diagram showing an ion plating apparatus as a vacuum film forming apparatus according to a conventional example.

FIG. 6 shows a plasma C as a conventional vacuum film forming apparatus.
It is a figure showing a VD device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Vacuum container 11a Container main body 11b Upper plate 11c Lower plate 20 Plasma beam generator 31 Steering coil 41 Hearth 60 Transfer device 71 Deposition plate 72, 72 ', 72 "Mesh plate 72a Hook part 73 Mounting bracket 100 Substrate 200 Evaporation material

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshiyuki Sakami 5-2 Sokaicho, Niihama-shi, Ehime Sumitomo Heavy Industries, Ltd. Niihama Works (72) Inventor Masaru Tanaka 5-2 Sokaicho, Niihama-shi, Ehime No. Sumitomo Heavy Industries, Ltd. Niihama Works

Claims (3)

[Claims] In a vacuum film forming apparatus for vaporizing a vapor deposition material in a vacuum vessel and depositing the vaporized vapor deposition material on the surface of an object to be processed, a metal deposition plate is provided inside a side wall of the vacuum vessel. A vacuum film forming apparatus, wherein a metal mesh plate is detachably disposed inside the deposition-preventing plate. 2. The vacuum film forming apparatus according to claim 1, wherein the mesh plate is formed of any one of a plate-like metal net, a plate-like expanded metal, and a stamped metal plate. 3. The mesh plate is made of copper, stainless steel,
3. The vacuum film forming apparatus according to claim 1, wherein the vacuum film forming apparatus is made of any one of iron and aluminum.