JPH1154597A - Holder for film forming of semiconductor bar - Google Patents

Abstract

PROBLEM TO BE SOLVED: To securely form a film on a section of the semiconductor bar held stacked independently of presence of burrs. SOLUTION: About sides 506 and 507 of an internal space 502, as the part of a predetermined distance D from the sides 504 and 505 of the internal space are exposed except the end face restriction materials 514 and 515, and side face restriction materials 516, 517, 526, and 527, a plurality of semiconductor bars having a semiconductor bar 5a with burrs 5c can be held stacked. The semiconductor bar 5a with burrs 5c can be held as the burrs 5c pass the exposed area of the side 506 and 507 of the internal space 502. As the all semiconductor bars can be held, the semiconductor bar 5a with burrs 5c can also be utilized without wasting over.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor bar film-forming holder for holding a plurality of semiconductor bars in a stacked state when forming a film on a cut surface of a semiconductor bar.
In particular, the present invention relates to a film forming holder for a semiconductor bar for forming a protective film on a light emitting surface of a semiconductor laser.

[0002]

2. Description of the Related Art As shown in FIGS. 1 and 2, a plurality of semiconductor bars 5 are formed by cutting a semiconductor wafer 1 in one direction. After the semiconductor bars 5 are formed, a protective film is formed on all the cut surfaces 9 and 10 in a state where the plurality of semiconductor bars 5 are stacked. At this time,
A holder for holding a plurality of semiconductor bars 5 aligned and stacked is required.

[0003] As shown in FIG.
Has an inner space 102 and includes a bottom surface defining member 113 and end portion defining members 111 and 112. Interior space 102
Is a space having a shape and a size that can accommodate the stacked semiconductor bars 5 and for mounting the semiconductor bars 5. The bottom surface defining member 113 is provided on the bottom surface 10 of the internal space 102.
3 is specified. The end defining member 111 is a bottom defining member 1.
It is composed of an end face defining portion 114 and side face defining portions 116 and 117 extending perpendicularly from the reference numeral 13. End face defining part 114
Defines an end surface 104 of the internal space 102. The side surface defining portions 116 and 117 are provided on the side surfaces 106 and 1 of the internal space 102.
07 is specified. Similarly, the end defining member 112
Is an end surface defining portion 1 extending vertically from the bottom surface defining member 113.
15 and side surface defining portions 126 and 127.
The end surface defining portion 115 defines the end surface 104 and the side surface defining portion 1
26 and 127 define side surfaces 106 and 107, respectively.

[0004] A total of four side defining portions 116, 117, 12
6 and 127 are in contact with the side surfaces 106 and 107 of the internal space 102. The distance W1 between the side surfaces 106 and 107 is set to be about 1.1 to 1.2 times the distance L between the cut surfaces 9 and 10 of the semiconductor bar 5.

The internal space 102 of such a holder 101
A plurality of semiconductor bars 5 are contained in a stacked state so that the semiconductor bars 5 are held, and a protective film is formed on the exposed cut surfaces 9 and 10 collectively. After the protective film is formed, the semiconductor bar 5 is taken out of the holder 101 and cut to form a plurality of laser chips.

[0006]

As shown in FIG. 3, when cutting the semiconductor wafer 1, burrs 5c may be formed. At the end of the cut surface of the semiconductor bar 5a, a portion to be a part of the adjacent semiconductor bar 5 remains as a burr 5c. The burr 5c is located in a region within a predetermined distance D from the end surface within the cut surface of the semiconductor bar 5a.
As described above, burrs 5c are likely to be generated in a region within a predetermined distance D from the end surface in the cut surface of the semiconductor bar 5.

As shown in FIG. 10A, in the conventional holder 101, the burrs 5c projecting 0.2 L or more from the cut surface.
The semiconductor bar 5a having the
3 and cannot be included. FIG.
(B), as shown in FIG. 10 (c), the width R of the burr 5c
Is 20% or more of the distance L between the cut surfaces 9 and 10 of the semiconductor bar 5a. Therefore, a plurality of semiconductor bars 5
If the semiconductor bar 5a is included, the mounting is impossible even if it is attempted to mount the holder 101 in a state in which they are stacked.

As described above, in the semiconductor bar 5a having the burrs 5c only at specific portions of the cut surfaces 9, 10, even if the burrs 5c are not generated at other portions such as the central portion of the cut surfaces 9, 10, Regardless, the semiconductor bar 5a cannot be mounted on the holder 101, and a protection film cannot be formed on the cut surfaces 9 and 10, so that a laser chip cannot be formed from the semiconductor bar 5a.

Further, the semiconductor wafer 5b having no burrs shown in FIG. 11A is mounted on the holder 101 shown in FIG.
When the distance W1 of the internal space 102 is mounted on the holder enlarged to the distance W11, that is, when the distance W1 between the side surfaces 106 and 107 is increased by the width R of the burr 5c, a plurality of semiconductor bars including the semiconductor bar 5a are provided. 5 can be mounted on the holder 101. However, since the distance W1 is increased, a gap generated between the cut surfaces 9, 10 and the side surfaces 106, 107 when the semiconductor bar 5b having no burr is mounted is increased. This gap is the thickness t of the semiconductor bar 5.
In this case, as shown in FIG. 11C, there is a possibility that the semiconductor bar 5 falls into the semiconductor bar 5, and in that case, the semiconductor bars 5 cover the cut surfaces 9, 10 of the other stacked semiconductor bars 5. Films are not formed on the cut surfaces 9 and 10 of the semiconductor bar 5 covered with the dropped semiconductor bar 5.

An object of the present invention is to provide a film forming holder for a semiconductor bar which can stack and hold semiconductor bars irrespective of the presence or absence of burrs and can reliably form a film on a cut surface of the semiconductor bar.

[0011]

According to the present invention, a semiconductor wafer is cut in parallel in one direction, and a plurality of strip-shaped semiconductor bars of the same shape each surrounded by two end faces and two cut faces are provided. In a state where the semiconductor bars are stacked and held, the semiconductor bars are stacked and held, and in the film forming holder of the semiconductor bar for forming a film on all cut surfaces, the stacked semiconductor bars can be included,
A flat bottom defining member having an inner space slightly larger than the stacked semiconductor bars and defining a bottom surface of the internal space, and an end face of the inner space extending vertically from the bottom defining member and facing an end face of the semiconductor bar. And four side surface defining members that extend vertically from the bottom surface defining member, are separated from the end surface defining member by a predetermined distance, and define side surfaces of the internal space facing the cut surface of the semiconductor bar. A film forming holder for a semiconductor bar, comprising:

According to the present invention, on the side surface of the internal space, a portion extending from the end surface of the internal space to a predetermined distance is between the end surface defining member and the side surface defining member and is exposed. , A plurality of semiconductor bars can be stacked and held. That is,
When a semiconductor bar having burrs is mounted, the burrs can be mounted because they pass through exposed portions of the side surfaces of the internal space. Therefore, all semiconductor bars can be installed,
Even a semiconductor bar having burrs can be used without waste.

According to the present invention, a semiconductor wafer is cut in parallel in one direction to form a plurality of strip-shaped semiconductor bars of the same shape each surrounded by two end faces and two cut faces. A semiconductor bar deposition holder for depositing a film on all cut surfaces in a state where the semiconductor bars are stacked and held can include the stacked semiconductor bars and has a slightly larger internal space than the stacked semiconductor bars. A flat bottom defining member that defines a bottom surface of the internal space, an end surface defining portion that extends vertically from the bottom defining member and defines an end surface of the internal space facing the end surface of the semiconductor bar, and a side surface of the internal space. And two end defining members each composed of two side defining portions covering a region up to a predetermined distance from the end surface of the internal space, wherein the side defining portion is a side surface of the internal space from the end defining portion. distance Separated by spreading a semiconductor bar film forming holder, characterized in that only the tip in the interior space at a predetermined distance to define the sides of which are arranged on the side interior space of the interior space.

According to the present invention, the side surface defining portion covers a part of the side surface of the internal space, but only its tip defines the side surface of the internal space, and the other portions are separated from the side surface of the internal space. Therefore, when a semiconductor bar having burrs is mounted, the burrs do not abut on any part, even though they are not included in the internal space. Therefore, all the semiconductor bars can be mounted, and even a semiconductor bar having burrs can be used without wasting.

Further, the present invention is characterized in that the semiconductor bar is cut parallel to an end face of the semiconductor bar to form a laser chip after a protective film is formed on a cut surface of the semiconductor bar.

According to the present invention, since the semiconductor bar is further cut into laser chips, even if the semiconductor bar has burrs, a large number of laser chips irrelevant to burrs are manufactured after cutting. Since the laser chip irrelevant to burrs operates normally, the laser chip can be manufactured from a semiconductor bar having burrs. Therefore, the yield of laser chips can be improved by effectively using all the semiconductor bars.

[0017]

FIG. 1 shows a typical semiconductor wafer 1.
FIG. 2 is a perspective view showing a semiconductor bar 5 cut out from the semiconductor wafer 1. The semiconductor wafer 1 shown in FIG. 1 has been processed by a process step for forming a semiconductor laser, and has an electrode 2 and a light emitting channel 3 for each chip region 6. The chip regions 6 are arranged in a matrix on the surface of the semiconductor wafer 1 in the X and Y directions orthogonal to each other. At an end in the X direction on the semiconductor wafer 1, a cutting marker 4 is formed by scribing between chip regions 6 adjacent in the Y direction. The light emitting channel 3 is a region for emitting light in the Y direction.

The semiconductor wafer 1 is cut into a cutting marker 4
To form a plurality of identical semiconductor bars 5 as shown in FIG. The cut-out semiconductor bar 5 is surrounded by the end faces 7 and 8 and the cut faces 9 and 10 to form a strip.

FIG. 3 shows a semiconductor bar 5a having burrs 5c.
FIG. As shown in FIG. 3, when the semiconductor wafer 1 is cut, an end of a cut surface of the semiconductor bar 5a is
The part that should become a part of the adjacent semiconductor bar 5 is a burr 5
It may remain as c. The burr 5c is located in a region within a predetermined distance D from the end surface within the cut surface of the semiconductor bar 5a. As described above, burrs 5c are likely to be generated in a region within a predetermined distance D from the end surface in the cut surface of the semiconductor bar 5. The distance D is, for example, about 1 mm.

FIG. 4A is a perspective view showing a holder 501 according to the first embodiment of the present invention, and FIG. 4B is a plan view thereof. The holder 501 has an internal space 502, and has a bottom surface defining member 513, end surface defining members 514, 515.
And side surface defining members 516, 517, 526, 527. The internal space 502 is a space for containing and mounting the stacked semiconductor bars 5 and is slightly larger than the stacked semiconductor bars 5. Side surface 50 of internal space 502
6,507 are separated by a distance W2. Distance W2
Is about 1.1 to 1.2 times the distance L similarly to the distance W1.

The bottom surface defining member 513 is a plate-like member that defines the bottom surface 503 of the internal space 502. The end surface defining members 514, 515 and the side surface defining members 516, 517,
526 and 527 extend vertically from the bottom surface defining member 513. Among these, the end surface defining members 514 and 515 are flat members that define the end surfaces 504 and 505 of the internal space 502. The side surface defining members 516 and 526 are connected to the inner space 50.
The rod-shaped members are disposed at positions separated from the two end surfaces 504 and 505 by a predetermined distance D, and define the side surface 506 of the internal space 502. That is, the side 506
Is a tangent plane commonly contacting the side surface defining members 516 and 526. Similarly, the side surface defining members 517 and 527 are arranged at positions separated from the end surfaces 504 and 505 of the internal space 502 by a predetermined distance D, respectively, and define the side surface 507 of the internal space 502. Also, the side surface defining members 516, 51
Reference numerals 7 are spaced at a relatively wide interval so that the cut surfaces 9 and 10 of the semiconductor bar 5 are exposed for the later-described vapor deposition.

In the holder 501 shown in FIG. 4, the plurality of semiconductor bars 5 are kept parallel to the bottom surface defining member 503, and the end surface defining members 514, 515 and the side surface defining members 516, 526 are provided.
The plurality of semiconductor bars 5 are held in a stacked state by being slidably mounted in an internal space 502 surrounded by 517 and 527. The mounted semiconductor bar 5 includes end surface defining members 514,
The displacement in the X direction is restricted by 515, and the displacement in the Y direction is restricted by the side surface defining members 516, 517, 526, 527.

As described above, in the holder 501 shown in FIG. 4, the end face defining members 514 and 515 and the side face defining members 516 and 516 are provided.
517, 526, and 527 are separated by a predetermined distance D. As shown in FIG. 3, when the semiconductor bar 5a having the burrs 5c is formed at the time of cutting, the burrs 5c are projected from between the end face defining member and the side face defining member. Thereby, the bottom surface 50 is formed similarly to the semiconductor bar 5 having no burrs.
The semiconductor bars 5a can be slidably mounted on the holder 501 and stacked in a posture parallel to 3. Also, the distance D
Is a value that defines an area in which burrs 5c are likely to occur.
527 can be reliably prevented from contacting.

FIG. 5 is a view showing a vacuum evaporation apparatus 21 using a holder 501 holding a plurality of semiconductor bars 5.
The vacuum evaporation apparatus 21 includes an evaporation source 12, a holder fixing device 11, and a film thickness meter 14 inside a chamber 20 connected to the duct 13. The holder fixing device 11 includes the semiconductor bar 5
This is an instrument for fixing the cut surfaces 9, 10 to the evaporation source 12. The film thickness gauge 14 is an instrument that detects the thickness of a deposited film using a quartz oscillator.

In the vacuum deposition apparatus 21, a plurality of holders 501 are collectively fixed to the holder fixing device 11, and a vapor deposition film is collectively formed on either the cut surface 9 or the cut surface 10 of the plurality of semiconductor bars 5. You. The deposited film is controlled to a predetermined film thickness by the film thickness gauge 14. Next, the holder fixing device 11
Is rotated 180 degrees so that the cut surface of the non-evaporated portion faces the evaporation source 12. Similarly, vapor deposition is performed to complete a vapor deposition film on all cut surfaces 9 and 10.

FIG. 6A is a perspective view showing a holder 201 according to a second embodiment of the present invention, and FIG. 6B is a plan view thereof. The holder 201 has an internal space 202 for including and mounting the stacked semiconductor bars 5,
A bottom surface defining member 213 for defining the bottom surface 203 of the internal space 202 and end defining members 211 and 212 for defining both ends of the internal space 202 are provided. Interior space 2
02 has the same shape and size as the internal space 502.

The end defining members 211 and 212 extend vertically from the bottom defining member 213, respectively. The end defining member 211 includes an end face defining section 214 and side face defining sections 216 and 217. The end face defining portion 214
An end surface 204 of the internal space 202 is defined. Side definition part 2
16, 217 are side surfaces 206, 207 of the internal space 202.
Are defined respectively. Similarly, the end defining member 212 is
End surface defining portion 215 that defines end surface 205, and side surface 2
06, 207, respectively.
27.

The side surface defining portions 216 and 226 have only their ends on the side surface 206 of the internal space 202, and the other portions are separated from the side surface 206. Side surface defining portions 217, 227
Similarly, only the tip is the side surface 207 of the internal space 202.
Above, the other part is separated from side 207. The distance between the side surface defining portion 216 and the side surface defining portion 217 becomes narrower toward the tip. The maximum distance between the side surface defining portions 216 and 217 is the distance W3, and the minimum distance is the distance W1.

As described above, the displacement of the semiconductor bar 5 in the X direction is limited by the end face defining portions 214 and 215. Since the tip of the side surface defining portion 216 is on the side surface 206 and the tip of the side surface defining portion 217 is on the side surface 207, the displacement of the semiconductor bar 5 in the Y direction is limited. Also, the side defining part 2
A space having a trapezoidal cross section is widened between 16 and 217 so that the burrs 5c can pass when the semiconductor bar 5a having the burrs 5c is slid and mounted. That is, the semiconductor bar 5a can be mounted on the holder 201. The width R of the burr 5c that can be attached is (W3-
L) / 2 or less.

FIGS. 7 and 8 are plan views respectively showing holders 301 and 401 according to another second embodiment. FIG.
Has a configuration similar to that of the holder 201 shown in FIG. 6, and a space having a rectangular cross section spreads between the side surface defining portions 216 and 217. Therefore, also in the case of FIG. 7, the semiconductor bar 5a having the burr 5c can be slid and mounted. In addition, assuming that the maximum distance is the distance W4, the width R of the burrs 5c that can be mounted is (W4-L) / 2 or less.

The holder 401 shown in FIG. 8 also has the same configuration as the holder 201 shown in FIG.
A space with a circular cross section extends between them. Assuming that the diameter of the circle is W5, the width R of the burr 5c that can be mounted is (W5-L) / 2.
It is as follows. Therefore, in both the case of FIG. 4 and the case of FIG. 5, the semiconductor bar 5a having the burr 5c can be mounted by sliding.

In the second embodiment, as in the first embodiment, a protective film is formed on the cut surfaces 9 and 10 of the semiconductor bar 5 by using the vacuum evaporation apparatus 21 shown in FIG.

[0033]

As described above, according to the present invention, all the semiconductor bars can be mounted by exposing a portion up to a predetermined distance from the end face of the internal space. Can be used without doing.

Further, according to the present invention, since the side surface defining portion is separated from the side surface of the internal space except for the end, all the semiconductor bars can be mounted, and even if the semiconductor bar has burrs, it is not wasted. Can be used.

Further, according to the present invention, a laser chip can be formed from a semiconductor bar having burrs, and the yield of laser chips can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a typical semiconductor wafer 1. FIG.

FIG. 2 shows a semiconductor bar 5 cut from a semiconductor wafer 1;
FIG.

FIG. 3 is a perspective view showing a semiconductor bar 5a having burrs 5c.

FIG. 4A is a perspective view showing a holder 501 according to the first embodiment of the present invention, and FIG. 4B is a plan view thereof.

FIG. 5 is a view showing a vacuum deposition apparatus using a holder 501.

FIG. 6A is a perspective view showing a holder 201 according to a second embodiment of the present invention, and FIG. 6B is a plan view thereof.

FIG. 7 is a plan view showing a holder 301 according to another second embodiment.

FIG. 8 is a plan view showing a holder 401 according to another second embodiment.

FIG. 9 is a perspective view showing a conventional holder 101.

10 (a) is a perspective view showing a holder 101 and a semiconductor bar 5a, FIG. 10 (b) is a perspective view showing a semiconductor bar 5a, and FIG. 10 (c) is a holder 101.
FIG.

11A is a perspective view showing a semiconductor bar 5b, FIG. 11B is a plan view showing a holder 101 in which a distance W1 is enlarged to a distance W11, and FIG. It is a perspective view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 5, 5a, 5b Semiconductor bar 5c Burr 7, 8 End surface 9, 10 Cut surface 201, 301, 401, 501 Holder 202, 502 Internal space 203, 503 Bottom surface 204, 205, 504, 505 End surface 206, 207, 506,507 Side surface 211,212 End portion defining member 213,513 Bottom surface defining member 214,215 End surface defining portion 216,217,226,227 Side surface defining portion 514,515 End surface defining member 516,517,526,527 Side surface defining member D distance

Claims (3)

[Claims] 1. A semiconductor wafer is cut in parallel in one direction to form a plurality of strip-shaped semiconductor bars of the same shape each surrounded by two end faces and two cut faces. In a film forming holder for semiconductor bars for forming a film on all cut surfaces in a state of being stacked and held, the semiconductor bar can include the stacked semiconductor bars, and has a slightly larger internal space than the stacked semiconductor bars, A flat bottom defining member that defines a bottom surface of the internal space; two end surface defining members that extend perpendicularly from the bottom defining member and define an end surface of the internal space facing the end surface of the semiconductor bar; And four side surface defining members extending at a predetermined distance from the end surface defining member and defining a side surface of the internal space facing the cut surface of the semiconductor bar. 2. A semiconductor wafer is cut in parallel in one direction to form a plurality of strip-shaped semiconductor bars of the same shape each surrounded by two end faces and two cut faces. In a film forming holder for semiconductor bars for forming a film on all cut surfaces in a state of being stacked and held, the semiconductor bar can include the stacked semiconductor bars, and has a slightly larger internal space than the stacked semiconductor bars, A flat bottom defining member for defining a bottom surface of the internal space, an end surface defining portion extending perpendicularly from the bottom defining member and defining an end surface of the internal space facing the end surface of the semiconductor bar, and an internal space on a side surface of the internal space. And two end defining members each comprising two side defining portions that cover an area up to a predetermined distance from the end surface of the internal space, wherein the side defining portion is separated from the end defining portion by a distance from the side surface of the internal space. Wide Ri, semiconductor bars film forming holder, characterized in that only the tip in the interior space at a predetermined distance is disposed on the side of the internal space defining the sides of the interior space. 3. The laser bar according to claim 1, wherein the semiconductor bar is cut into a laser chip in parallel with an end surface of the semiconductor bar after a protective film is formed on a cut surface of the semiconductor bar. Film holder for semiconductor bars.