JPH1152409A - Manufacture of panel block - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the frame size of a panel block and to reduce the number of manufacture processes by bonding a driver IC and a flexible board with the board of a panel compression-bonding them at the same time. SOLUTION: The device IC 8 is fitted facedown onto an electrode terminal part so that the electrode 9 of the driver IC 8 is bonded with a small quadrangular PAD part of a driving electrode lead-out pattern 3 and a small quadrangular PAD part of an input signal electrode pattern 4. In this case, adhesives used for bonding part of a flexible circuit board between a conductive pattern which supplies an input signal to the driver IC 8 and the input signal electrode pattern 4 of the electrode terminal part of a glass substrate and the bonding part between the driver IC 8 and electrode terminal part are the same or of the same system and enable simultaneous compression-bonding. Then those two bonding are formed by the simultaneous compression-bonding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel block structure in which circuit components such as a drive circuit are mounted in a liquid crystal display panel in which a liquid crystal layer is sandwiched between two upper and lower substrates.

[0002]

2. Description of the Related Art A conventional liquid crystal display panel is shown in FIG.
The structure was as shown in FIG. That is, FIG.
Shows a cross section of a conventional panel block structure. 2 in the figure
Reference numerals 1 and 22 denote glass substrates, 23 denotes an electrode terminal, 24 denotes a liquid crystal layer, 25 denotes a polarizing plate, 26 denotes a sealing portion, 27 denotes a driver IC, 28 denotes a flexible circuit component for mounting the driver IC by TAB, and 29 denotes an anisotropic conductive material. Reference numeral 30 denotes a panel circuit board which forms a bus line. FIG. 2
(B) shows an upper plan view of a conventional panel block structure. In the figure, reference numeral 31 denotes a connection tape for connecting to another circuit board. The liquid crystal display panels are glass substrates 21 and 22,
It comprises an electrode terminal 23, a liquid crystal layer 24, a seal portion 26 and the like.

[0003] The driver IC 28 is provided with an X of a liquid crystal display panel.
There are a type that applies a drive signal to the electrode terminal of the line and a type that provides a drive signal to the electrode terminal of the Y line.

A flexible circuit component on which a driver IC is mounted by TAB is mounted on four sides of a liquid crystal display panel with an anisotropic conductive film.
2 are each soldered to a frame-shaped panel circuit board. The panel circuit board is a rigid circuit board.

[0005]

However, the conventional panel block structure has a number of problems as apparent from FIGS. 2 (a) and 2 (b).

First, in the conventional panel block structure, flexible circuit components on which a driver IC is mounted by TAB are spread and mounted so as to be spread on all sides of the liquid crystal display panel. Is formed in the shape of a frame on the outer periphery. The flexible circuit component is mounted on four sides of the panel circuit board by soldering. Therefore, the outer peripheral dimension of the entire panel block becomes extremely large, and as a result, the commercial value of the panel block is reduced, and the application range due to dimensional restrictions is reduced.

In the conventional panel block structure, a driver IC and a driver IC are used to drive the liquid crystal display panel.
Flexible circuit parts for AB mounting, panel circuit boards for soldering flexible circuit parts, connection tapes for connecting panel circuit boards to other circuit boards, etc.
Many components are required, and component costs are high.

Further, in the conventional panel block structure, in order to manufacture, bonding of a driver IC to a flexible circuit component, bonding of a liquid crystal display panel to a flexible circuit component, bonding of a flexible circuit portion to a panel circuit board, and panel panel It has many joints such as the joint between the substrate and the connection tape, and requires a large number of manufacturing steps, such as requiring an assembling work to put them together.

Accordingly, an object of the present invention is to solve the conventional drawbacks described above, reduce the outer dimensions of the panel block, reduce the cost of parts, and reduce the number of manufacturing steps.

[0010]

According to the present invention, there is provided a panel block structure comprising a driver IC bonded to a panel substrate and a flexible substrate bonded to the panel substrate. It is characterized in that two bondings are performed by simultaneous pressure bonding.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A is an external perspective view of an embodiment of the present invention, and FIG. 1B is a cross-sectional view of a main part of the embodiment of the present invention. 1 (a) and 1 (b),
2 is a glass substrate, 3 is a drive electrode lead pattern, 4 is an input signal electrode pattern, 5 is a liquid crystal layer, 6 is a seal portion, 7 is a polarizing plate, 8 is a driver IC, 9 is a driver IC electrode, and 10 is a flexible circuit. A board, 11 is a conductive pattern section for providing an input signal to the driver IC on the flexible circuit board, 12 is a bus line section for delivering various signals to the conductive pattern for providing the input signal on the flexible circuit board, and 13 is a bus line and other circuits A connection pattern portion 14 for connecting to the substrate is provided with an adhesive layer 14 and a driver I.
C and the liquid crystal display panel, and between the flexible circuit board and the liquid crystal display panel.

As is apparent from the figure, the flexible circuit board includes a conductive pattern section 11 for supplying an input signal to the driver IC, a bus line section 12 for delivering various signals to the conductive pattern, and a connection pattern section for connection to another circuit board. 1
3 are formed on a single substrate.

In the liquid crystal display panel, the size of the substrate on each side of the outer periphery is large so as to protrude from the counter substrate.
In the present embodiment, the lower side has the front side substrate overhanging from the rear side substrate, and the right side has the opposite. Further, one substrate may be unilaterally enlarged so as to protrude from the other substrate, or a part of the side may not have a portion which is enlarged so as to protrude.

The following various electrode patterns are formed on the portions which are larger than the opposing substrate so as to protrude from the counter substrate, and form electrode terminal portions. The liquid crystal display panel is a matrix display liquid crystal panel in which a large number of X lines and Y lines are formed in a matrix, and a lower electrode terminal portion has a driving electrode leading pattern 3 for leading a driving electrode of the X line for driving the liquid crystal display panel. The drive electrode leading pattern 3 for leading the drive electrode of the Y line is formed in the electrode terminal portion on the right side. Drive electrode lead-out pattern 3
Is a parallel straight portion near the seal portion just drawn out from the inside of the liquid crystal display panel, and a small quadrilateral PA formed at a position corresponding to the electrode position of the driver IC 8.
D section and a radial connection section connecting the parallel straight section and the PAD section.

Further, an input signal electrode pattern 4 for supplying an input signal to the driver IC 8 is formed on the electrode terminals on the lower side and the right side. The input signal electrode pattern 4 is provided at an outer edge of the liquid crystal display panel connected to the flexible circuit board 10, a parallel straight portion formed parallel to the outer periphery of the liquid crystal display panel in a vertical direction, and a driver I.
A small quadrangular PAD portion formed at a position corresponding to the electrode position of C8, the parallel straight portion and the PA
It consists of a radial connection part connecting the D part.

The drive electrode lead-out pattern 3 and the input signal electrode pattern 4 are made of a conductive thin film made of ITO, Ni, Cr, Ta, or the like, or a combination of multiple layers thereof.

The driver IC 8 is face-down so that the electrode 9 of the driver IC 8 is joined to the small quadrilateral PAD of the driving electrode lead-out pattern 3 and the small quadrilateral PAD of the input signal electrode pattern 4. It is mounted on the electrode terminal.

A joint between the conductive pattern section 11 for providing an input signal to the driver IC 8 of the flexible circuit board 10 and the input signal electrode pattern 4 on the electrode terminal section of the glass substrate, and a joint section between the driver IC 8 and the electrode terminal section. Are the same or of the same system and can be pressed together at the same time. For example, a sheet-like adhesive sheet may be heated and pressed by a heater chip having a difference in level between the thickness of the driver IC 8 and the thickness of the flexible circuit board 10.

The most distinctive features of liquid crystal panels are thin, small,
Low power consumption, and the applied product is liquid crystal T
V, portable word processors, portable personal computers, etc., often emphasize portability and feature features of miniaturization of dimensions.
Therefore, the size of the liquid crystal panel used for such a product must be small and the design must be light. The size of the frame outside the active screen of the liquid crystal panel is no exception. The smaller the size, the higher the value of the applied product.

As is clear from FIGS. 1 (a) and 1 (b),
In the panel block structure according to the present embodiment, the driver IC 8 is directly face-down bonded and joined to the electrode terminal portion of the liquid crystal display panel without any other components, and the bus line 12 and another circuit board are connected to the same electrode terminal portion. Connection pattern 13
Driver IC for flexible circuit board 10
8 and a conductive pattern 11 for applying an input signal are bonded and bonded, and the conductive pattern 11 is bonded and bent just outside the bonded portion toward the inside of the glass substrate near the glass substrate. Since it does not spread widely to the outside, the frame size outside the active screen of a so-called liquid crystal panel can be reduced, and the product value of a product using this can be increased.

Further, in the panel block structure according to the present embodiment, the driver IC 8 is mounted directly on the glass substrate without any other components, and the bus line 12 and the other Since at least all of the connection pattern portion 13 to be connected to the circuit board and the conductive pattern portion 11 that supplies an input signal to the driver IC 8 are mounted, the number of components can be extremely small, and the cost of components can be greatly reduced. You can do it.

Further, in the panel block structure according to the present invention, the driver IC 8 is directly mounted on the glass substrate without any other components, and the bus line 12, the connection pattern portion 13 for connecting with another circuit board, and the driver Since the flexible circuit board 10 in which at least the conductive pattern section 11 for providing an input signal to the IC 8 is formed on the same board is used, the number of joining points is extremely small, and therefore, the number of manufacturing steps can be extremely reduced.

In the embodiment shown in FIGS. 1 (a) and 1 (b), a large number of driver ICs are mounted on each of the X and Y sides of the liquid crystal display panel, and the X side has a downward electrode pattern. The electrode terminal portion is formed so as to protrude from the counter substrate as formed in the above, and the electrode terminal portion is formed so that the Y side protrudes from the counter substrate so that the electrode pattern is formed upward. I have. The bus line portion 12 of the flexible circuit board 10 is mainly formed in an L-shaped portion, and the conductive pattern portion 1 that applies an input signal to the driver IC corresponding to the driver IC 8 outwardly on each side of the L-shaped portion.
1 is formed in plurality. In the conductive pattern portion 11, the conductive pattern 11 corresponding to the driver IC 8 on the X side is formed on the back surface, and the conductive pattern portion corresponding to the driver IC on the Y side is formed on the front surface. Each is folded back and adhered and joined to the electrode terminal portion of the glass substrate. The bonding pattern part with other circuit boards is L
It faces outward in the vicinity of the bent portion of the character portion.

As described above, if a large number of driver ICs are mounted on a small number of sides, the effect of the reduction in the number of manufacturing steps is further increased. If the connecting process of the pattern portions is performed by the same pressure bonding process, the effect of reducing the number of manufacturing steps is further increased.

[0026]

As described above, according to the present invention, the frame size of the panel block can be reduced by simultaneously performing the bonding of the driver IC to the panel substrate and the bonding of the flexible substrate to the panel substrate. This has the effect of reducing man-hours.

[Brief description of the drawings]

FIG. 1A is an external perspective view of an embodiment of the present invention. FIG. 2B is a cross-sectional view of a main part in one embodiment of the present invention.

FIG. 2A is a cross-sectional view of a conventional panel block structure.
(B) is an upper plan view of the conventional panel block structure.

[Explanation of symbols]

1, 2, 21, 22 ... glass substrate 3 ... drive electrode lead-out pattern 4 ... input signal electrode pattern 5, 24 ... liquid crystal layer 6, 26 ... seal part 7, 25 ··· Polarizer 8, 27 ··· Driver IC 9 ····· Driver IC electrode 10 ························································································································································································ / ················································· of / of-of-W /// Connection pattern section 14 Adhesive layer 23 Electrode terminal section 28 Flexible circuit parts for driver IC TAB mounting 29 Anisotropic Conductive film joint 30 Panel circuit board 31 Connection tape

[Procedure amendment]

[Submission date] August 11, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

Patent application title: Panel block manufacturing method

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a panel block in which circuit components such as a drive circuit (driver) are mounted on a substrate, and a flexible substrate having a conductive pattern is joined to the substrate.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

[0010]

According to the panel block structure of the present invention, a driver IC is bonded to a substrate of a panel.
In a method of manufacturing a panel block formed by bonding a flexible substrate to the panel substrate, the bonding of the driver IC and the flexible substrate to the panel substrate is performed by simultaneous pressure bonding.
Further, the adhesive for bonding the driver IC and the adhesive for bonding the flexible substrate are the same or the same type of adhesive. Further, a joint portion between the driver IC and the flexible substrate with respect to the panel substrate is adjacent to each other.

Claims (1)

[Claims] 1. A panel block structure comprising a driver IC bonded to a panel substrate and a flexible substrate bonded to the panel substrate, wherein the two bondings are performed by simultaneous pressing. Panel block structure.