JPH1148400A - Manufacture of copper-clad laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a copper-clad laminate formed by catching laminating material between panel boards for heating and pressing, which can reduce dent flaws, by heating and pressing the laminating material by inserting aluminum foil between copper foil and a panel board. SOLUTION: Glass fiber cloth is impregnated with resin varnish, and dried for obtaining prepreg. Copper foil of, for example, 18 μm thickness is lapped on the upper and lower sides of one of the prepreg, and aluminum foil of, for example, 50 μm thickness is lapped on the upper and lower sides thereof, which is caught between stainless panel boards of, for example, 0.2 mm thickness for heating and pressing, for example, at a temperature of 175 deg.C and a pressure of 3 Mpa for 60 minutes. Thereby, a both side copper-clad laminate is manufactured. The aluminum foil thickness is preferably 10-100 μm, or more preferably 40-80 μm for taking up thickness of foreign matter adhered to the panel board surface, and in view of handling and price. Prepreg, which is obtained by impregnating a base with a thermosetting resin composition for drying, and copper foil are used for the laminating material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for producing a copper-clad laminate.

[0002]

2. Description of the Related Art A copper-clad laminate used as a substrate for a printed wiring board is a set of laminated materials composed of a prepreg and a copper foil obtained by impregnating and drying a varnish of a thermosetting resin on a base material. Each time, it is manufactured by sandwiching it between end plates and applying heat and pressure.

[0003]

A printed wiring board is manufactured by etching a copper foil of a copper-clad laminate. At this time, an etching resist is formed on the copper foil, but if the copper foil is not smooth, there are portions where the etching resist does not adhere. If there is a part where the adhesion between the etching resist and the copper foil is poor, the etching solution will seep into the part when etching, and the copper foil in the part that should be left as a circuit will be etched, broken, or thinner than the design value . The disconnection is determined to be defective by the inspection, and if there is a circuit thinner than the design value, an abnormal heat generation may occur when a current flows, which may lead to an accident. Therefore, what is important as a copper-clad laminate is that the copper foil surface is smooth.

It is apparent that when the end plate and the laminated material are in direct contact as in the conventional manufacturing method, the copper foil is not smooth unless the surface of the end plate is smooth. However, the head plate is usually used repeatedly, and it is unavoidable to adhere resin residue when heating and pressing.
In addition, various foreign substances, such as fiber debris and hair, may be attached before the next use. In addition, the head may be damaged. As described above, it is extremely difficult to completely smooth the surface of the mirror plate, and it is inevitable that a slight dent is formed on the copper-clad laminate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method for manufacturing a copper-clad laminate in which a laminate material is sandwiched between end plates and heated and pressed to reduce dent defects. is there.

[0006]

SUMMARY OF THE INVENTION The present invention is a method for producing a copper-clad laminate, characterized in that an aluminum foil is interposed between a copper foil and a head plate and heated and pressed. Since the aluminum foil is soft, even if foreign matter adheres to the surface of the end plate, the aluminum foil can be absorbed by deformation. In addition, since it is inexpensive, the surface of the mirror plate can be kept clean by disposing it after the completion of heating and pressurization, and as a result, the dent defect of the copper clad laminate can be eliminated.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The thickness of an aluminum foil is preferably from 10 to 100 μm, from the viewpoint of absorbing the thickness of foreign matter adhering to the surface of a head plate, handleability and cost, and from 40 to 100 μm. More preferably, it is 80 μm.

There are no particular restrictions on the laminated material and end plate used in the present invention, and the same laminated material and end plate as in the prior art can be used. That is, as a mirror plate,
A stainless steel plate having a thickness of about 0.2 mm can be used. As the laminated material, prepreg and copper foil obtained by impregnating and drying a base material with a thermosetting resin composition are used. Further, when a circuit board obtained by subjecting a copper-clad laminate to circuit processing is sandwiched between prepregs and heated and pressed, a multilayer board can be obtained. Examples of the base material of the prepreg include paper, glass fiber, cloth, mat, and nonwoven fabric, and aramid fiber of cloth, mat, and nonwoven fabric. As the thermosetting resin composition, a resin composition containing a phenol resin, a cresol resin, an epoxy resin, an unsaturated polyester resin, a melamine resin, a polyimide resin, a vinyl ester resin, or the like is used. Further, as the heating and pressurizing conditions, an optimum temperature and pressurizing time are selected according to the kind of the resin of the prepreg.

[0009]

【Example】

Example 1 100 parts (parts by weight, hereinafter the same) of a brominated epoxy resin (epoxy equivalent: 480) 3 parts of dicyandiamide, 0.17 part of 2-ethyl-4-methylimidazole, 25 parts of ethylene glycol monomethyl ether, and N, N dimethylformamide A varnish was prepared by mixing 25 parts. This varnish was applied to a glass fiber cloth (thickness 0.1 mm, basis weight 108
g / m ² ) so as to have a resin content of 51% by weight and dried to obtain a prepreg. A copper foil having a thickness of 18 μm is laid on the upper and lower surfaces of one of the obtained prepregs, and an aluminum foil having a thickness of 50 μm is further laid on the upper and lower surfaces thereof.
175 ° C, pressure 3
By heating and pressurizing with MPa for 60 minutes, 1000 ×
A 1000 mm double-sided copper-clad laminate was prepared. About 100 obtained double-sided copper-clad laminates, dents on the surface were visually observed. As a result, the double-sided copper-clad laminate having a dent of 0.3 mm or more in diameter was 0.

Comparative Example A double-sided copper-clad laminate was produced in the same manner as in Example 1 except that aluminum foil was not used. The dents on the surface of each of the 100 double-sided copper-clad laminates were visually observed. As a result, the diameter of the three double-sided copper-clad laminates was 0.3 m.
m or more dents were observed.

[0011]

According to the present invention, it is possible to eliminate the occurrence of dent defects.

Claims (1)

[Claims] 1. A method for producing a copper-clad laminate, comprising heating and pressing an aluminum foil between a copper foil and a head plate.