JPH11354955A - Cooling structure for electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiency radiate heat which is generated from high heating parts. SOLUTION: A heat pipe 8 is connected to the side of an encapsulating resin 23 of a power module 2. A main circuit board 3 and a control substrate 4, then the power module 2 are electrically connected via the heat pipe 8, and power and control signals are supplied via the heat pipe 2. The outer surface of the heat pipe 8 is coated with an insulation layer. A plurality of radiating fins 9 are mounted to the heat pipe 8 via the insulation layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an electronic device, and more particularly, to a structure capable of efficiently radiating heat generated from a high heat generating component and reducing its size.

[0002]

2. Description of the Related Art FIG. 10 is a perspective view showing an example of a conventional cooling structure in an inverter control device. FIG. 11 is a sectional view of the cooling structure shown in FIG.
It is A 'sectional drawing. FIG. 12 is a cross-sectional view taken along line BB ′ of the cooling structure shown in FIG. This inverter control device 50
0, a power module 2 for generating electric power for driving the motor, a main circuit board 3 for supplying electric power to the power module 2, and a control board 4 for controlling the power module 2 are arranged in this order from below in the housing 1. Accommodating. The power module 2 has a structure in which a power element 22 is die-bonded on a metal substrate 21 and the metal substrate 21 and the power element 22 are sealed with a sealing resin 23. Metal substrate 2
Reference numeral 1 is electrically connected to the main circuit board 3 and the control board 4 via wiring. Further, the metal substrate 21 is thermally connected to the radiation fins 502. The fan 7 is provided on the side of the heat radiation fins 502.

[0003] Power and control signals are supplied to the power module 2 via a wiring 501. As a result, the power element 22 is driven, and the power element 22 generates heat due to the power loss generated here. Most of the heat is transferred from the metal substrate 21 to the radiating fins 502. The radiation fins 502 are cooled by the fan 7. As a result, heat is dissipated to the radiation fins 5.
Heat is dissipated to the outside through the line 02. On the other hand, the remaining heat is transmitted to the inside of the housing 1 through the sealing resin 23. Since the housing 1 has the slit 510, heat is radiated to the outside of the housing 1 through the slit 510. The arrows in the figure indicate the state of heat transfer.

[0004] In particular, when a chip having a large heat value is to be formed into a module, the substrate is formed of a ceramic substrate and a metal substrate having an insulating layer, and the chip is placed on this substrate. It is common to stop it. Therefore, the thermal resistance between the chip of the power module 2 and the metal substrate 21 is small, and the thermal resistance between the chip of the power module 2 and the resin seal 23 is large. Therefore, the metal substrate 21 of the power module 2
A heat radiation fin 502 is provided on the side, and most of the heat generated from the power module 2 is radiated from the heat radiation fin 502.

[Display-Integrated Computer] FIG. 13
FIG. 1 is an assembly view showing an example of a conventional display integrated computer device. FIG. 14 is a sectional view of the display integrated computer device shown in FIG. The display-integrated computer device 600 includes a housing 601 and a CPU 202 for performing central processing and a motherboard 20 on which various electronic components such as a chipset, a memory, and a crystal oscillator are mounted.
3 and a display 20 for outputting the calculation result and the like of the CPU 202
4 are accommodated. Further, a front panel 205 is attached to the housing 601. Motherboard 203 and CP
U202 is electrically connected by wiring. C
A radiation fin 602 is attached to the upper surface of the PU 202. A fan 603 for forced air cooling is attached to the radiation fin 602. Further, the housing 601 is provided with an intake slit 611 and an exhaust slit 612.

Power and signals are transmitted from motherboard 203 to C
It is supplied to the PU 202 via a wiring. CPU 202
Is driven, the CPU 202 generates heat. This heat is transmitted to the radiation fins 602. Outside air introduced from the intake slit 611 of the housing 601 is blown by the fan 603 to the radiation fins 602. As a result, the heat of the radiation fins 602 is removed, and the device can be cooled. Hot air that has passed through the radiation fins 602 exits through the exhaust slit 612. The arrows in the figure indicate the state of heat transfer.

[Driving / Control Circuit Integrated Servomotor] FIG. 15 is a sectional view showing an example of a conventional driving / control circuit integrated servomotor. The drive / control circuit integrated servomotor 700 includes a motor unit 301 and a motor unit 301.
Position / speed detecting unit 302 for detecting the rotational position and rotational speed of the motor, a driving circuit unit 303 for driving the motor, and information detected by the position / speed detecting unit 302 for the driving circuit unit 3
The configuration includes a control circuit unit 304 that controls the motor unit 301 by feeding back to the control unit 03 and a radiating fin 307 that releases heat of the power module 331 that configures the drive circuit unit 303. This drive and control circuit integrated motor 7
00 is directly attached to the machine tool. Therefore, the housing 701 includes not only the motor unit 301 but also the drive circuit unit 3
03, control circuit unit 304 and position / speed detection unit 302
It has a hermetically sealed structure with dust, water and oil resistance. The arrows in the figure indicate the state of heat transfer.

[0008]

However, in the cooling structure of the conventional inverter control device 500 described above, most of the heat generated from the power
Will be released from one side. For this reason, the size of the radiation fins 502 required for heat radiation becomes large, and there is a problem that it is difficult to reduce the size of the cooling device. On the other hand, the sealing resin 23 of the power module 2 has a thermal conductivity of 2.0 W /
mk, which is 0.1 to 0.01 times the thermal conductivity of the radiation fins 502 and the metal substrate 21. For this reason, there is a problem that cooling from the sealing resin surface becomes difficult even if the radiation fins are directly attached to the resin sealing surface.

The sealing resin 23 of the power module 2
After the heat of the surface is released into the housing 1, the slit 510
Is discharged from Therefore, when the main circuit board 3 is disposed close to the power module 2, heat radiation is hindered and the air temperature in the housing rises, affecting the control board 4 or the electronic components of the main circuit board 3. Therefore, it is necessary to secure a space between the power module 2 and the main circuit board 3. On the other hand, since heat is mainly radiated from one side of the power module 2, the heat radiation fins 502 become large. For this reason, there has been a problem that the product size cannot be reduced.

Next, in the above-mentioned conventional display-integrated computer apparatus 600, a heat radiation fin 602 and a fan 603 are mounted on the upper surface of the CPU 202. Therefore,
The positions of the radiating fins 602 and the fan 603 are raised as a whole, and the wind passing between the radiating fins 602 passes through the space above the electronic components other than the CPU and exits from the discharge slit 612. For this reason, there has been a problem that cooling of the electronic component becomes insufficient. In addition, when the space inside the housing 601 is increased in order to suppress the temperature rise of the electronic component, there is a problem that the product size increases accordingly.

In the conventional drive / control circuit integrated servo motor 700, the power module 331 generates a large amount of heat, and therefore, the power module 331 is disposed at the outermost position in the housing. Therefore, the control circuit unit 304 and the position / speed detection unit 302 are arranged at a position between the motor unit 301 and the power module 331. As a result, heat due to the copper loss and iron loss of the motor unit 301 and the friction of the sliding part flows into the closed casing of the control circuit unit 304 and the position / speed detecting unit 302. Most of the heat of the power module 331 is radiated from the radiation fins 307, but the remaining heat flows into the casing of the control circuit unit 304 and the position / speed detection unit 302. For this reason, there is a problem that heat is trapped in the closed casing, and heat dissipation in the casing 701 becomes difficult. Further, in order to suppress a rise in the temperature of the control circuit unit 34 and the position / speed detection unit 302, it is necessary to increase the space in the housing 701, and there is a problem that the product size increases.

The present invention has been made in view of the above, and efficiently radiates heat generated from a high heat generating component.
It is an object of the present invention to obtain a cooling structure for an electronic device that can be reduced in size.

[0013]

In order to achieve the above-mentioned object, a cooling structure for an electronic device according to the present invention comprises an electronic device housing and a high heat-generating component housed in the electronic device housing and mounted on a circuit board. A power module attached and resin-sealed from above, a cooling means attached to the circuit board side of the power module, a heat pipe extending from the sealing resin side of the power module, and an outer surface of the heat pipe In addition, the heat pipe includes an insulating layer for performing electrical insulation, and a radiating fin attached to the heat pipe via an insulating layer.

On the metal substrate side, heat generated by the power module is radiated by cooling means. On the sealing resin side, the heat generated by the power module is transmitted to the radiating fins via the heat pipe and the insulating layer provided on the outer surface thereof, and is radiated. A heat pipe having high heat conductivity and high conductivity is used. As the insulating layer, a material having high electric insulation and heat conductivity is used. The power of the power supply means is transmitted to the power module via the heat pipe. With this configuration, heat generated in the power module can be efficiently radiated from both sides of the power module. Therefore, the space required for cooling can be reduced, and the size of the electronic device can be reduced.

[0015] The cooling structure of the electronic device according to the next invention is as follows.
In the cooling structure for an electronic device, the insulating layer is made of a hard carbon film.

That is, a hard carbon film is used for the insulating layer interposed between the radiation fin and the heat pipe. Since the hard carbon film has both high insulating properties and high thermal conductivity, the conduction efficiency of heat generated in the power module is improved. Therefore, the cooling efficiency of the electronic device is further improved.

A cooling structure for an electronic device according to the next invention is as follows.
An electronic device housing provided with an intake slit and an exhaust slit, a control circuit board housed in the electronic device housing and having a high heat-generating component, a stator portion directly formed on the control circuit board, and the stator portion A rotor portion disposed opposite to the stator portion so as to be coaxial with the rotor portion, a blade portion rotating with the rotation of the rotor portion, and a support portion for rotatably supporting the rotor portion.

The fan can be constituted by the rotor, the stator, and the blades. In this electronic device cooling structure, the stator is formed directly on the circuit board. By forming the stator portion on the circuit board, the height of the fan can be reduced. Therefore, the size of the electronic device can be reduced. In addition, if the fan can be lowered, the air can be blown lower, so that the electronic components on the circuit board can be blown directly. Therefore, the cooling efficiency of the electronic component is improved.

A cooling structure for an electronic device according to the next invention is as follows.
In the above cooling structure for electronic equipment, the control circuit board may further include a metal board provided with an insulating layer having high heat conductivity.

If the control circuit board has a structure in which an insulating layer is provided on a metal substrate, heat generated by the high heat-generating components is diffused by the metal substrate, and the metal substrate functions as a radiation fin. Further, since the stator of the fan is formed directly on the control circuit board, the heat diffused to the metal board can be easily cooled. Therefore, the electronic device can be cooled more efficiently by a synergistic effect with the fin structure.

The cooling structure for electronic equipment according to the next invention is as follows.
A motor housing having a radiation fin in the axial direction, a motor unit housed in the housing, and a power module attached to an axial end of the housing and forming a drive circuit unit;
A fan provided in the housing above the space between the motor unit and the power module; and a radiation fin provided around the fan.

Since the power module is attached to the end of the housing, heat generated by the power module is transmitted to the radiating fins through the housing, and is mainly radiated from the fins. However, heat generated in the motor unit accumulates in a space in the housing between the power module and the power module. Further, since the hot air has a rising property, the upper portion of the housing becomes particularly hot. Therefore, a fan and a radiation fin are provided above the space between the motor unit and the power module. By doing so, the cooling efficiency is improved, and the space required for cooling can be reduced accordingly. As a result, the size of the electronic device can be reduced.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a cooling structure for electronic equipment according to the present invention will be described in detail with reference to the drawings. The present invention is not limited by the embodiment.

Embodiment 1 [Inverter Control Equipment] FIG. 1 is a perspective view showing a cooling structure of the inverter control equipment according to Embodiment 1 of the present invention. FIG. 2 is a sectional view of the cooling structure shown in FIG.
It is sectional drawing. FIG. 3 is a cross-sectional view of the cooling structure shown in FIG.
It is B 'sectional drawing. In the inverter control apparatus 100, a power module 2 for generating electric power for driving a motor, a main circuit board 3 for supplying electric power to the power module 2, and a control for controlling the power module 2 The substrate 4 is accommodated. The power module 2 has a structure in which a power element 22 is die-bonded on a metal substrate 21 and the metal substrate 21 and the power element 22 are sealed with a sealing resin 23.

The heat pipe 5 is connected to the metal substrate 21 of the power module 2. A plurality of radiation fins 6 are attached to the heat pipe 5. Heat from the metal substrate 21 side is transmitted to the radiation fins 6 via the heat pipe 5. A fan 7 is attached to the housing 1.

The sealing resin 23 of the power module 2
A heat pipe 8 is also connected to the side. The power module 2 is electrically connected to the main circuit board 3 and the control board 4 via the heat pipe 8, and power and control signals are supplied through the heat pipe 8. On the outer surface of the heat pipe 8, as shown in FIG.
(Except for the part that is joined to the power module 2, the main circuit board 3, or the control board 4).
By coating the outer surface of the heat pipe 8 with the insulating layer 81, heat and electricity can be conducted in the axial direction of the heat pipe 8, and only heat can be conducted in the radial direction of the heat pipe 8. Further, a plurality of heat radiation fins 9 are attached to the heat pipe 8 via an insulating layer 81.

As the insulating layer 81, a hard carbon film is used. This hard carbon film is formed by chemical vapor deposition (CVD).
ition) method. In the CVD method, hydrogen gas and methane gas are formed into a plasma jet by arc discharge, and hard carbon, which is very similar to non-doped diamond, is formed on the outer surface of the heat pipe 8 attached to the electrode by vapor phase growth. Hard carbon film obtained in this way are highly insulating (electric resistance: 1MΩ~10 ⁶ MΩ)
And high thermal conductivity (thermal conductivity: 500W / mk to 1000W)
/ Mk) have properties that satisfy both. The method of forming the hard carbon film is not limited to the CVD method, and may be formed by another method.

The power and control signals are supplied to the power module 2 via the heat pipe 8. As a result, the power element 22 is driven, and the power element 22 generates heat due to the power loss generated here. On the side of the sealing resin 23 of the power module 2, the heat of the power module 2 is transmitted through the heat pipe 8 and the insulating layer 81 and diffuses to the radiation fins 9. The radiation fins 9 are cooled by the fan 7. Also, on the metal substrate 21 side of the power module 2,
The heat generated in the power module 2 is transmitted through the heat pipe 5 and diffuses to the radiation fins 6. Similarly, the radiation fins 6 are also cooled by the fan 7. The hot air that has passed through the radiation fins 9 and 6 is released to the outside from the slit 10 of the housing 1. The arrows in the figure indicate the state of heat transfer.

As described above, in the cooling structure of the inverter control device 100, by coating the outer surface of the heat pipe 8 with the insulating layer 81, heat and electricity are conducted in the axial direction of the heat pipe 8, Conducts only heat. Thereby, the heat pipe 8 is connected to the control board 4.
In addition, it has a function of supplying power and a control signal from the main circuit board 3 to the power module 2 and a function of transporting only heat from the power module 2 to the radiation fins 9. By doing so, the space between the main circuit board 3 and the control board 4 and the power module 2 is
The inverter control device 10
0 can be reduced in size.

Embodiment 2 FIG. FIG. 5 is an assembly diagram showing a display-integrated computer apparatus according to Embodiment 2 of the present invention. FIG. 6 is an assembly view showing the fan shown in FIG. FIG. 7 is a sectional view of the display-integrated computer device shown in FIG. The display-integrated computer device 200 includes a housing 201, a CPU 202 for central processing, and a motherboard 203 on which various electronic components such as a chipset, a memory, and a crystal oscillator are mounted.
And a display 204 for outputting a calculation result of the CPU and the like. The housing 201 has a front panel 205.
Is attached. Motherboard 203 and CPU 202
Are electrically connected by wiring. Housing 201
Is provided with an intake slit 211 and an exhaust slit 212.

The motherboard 203 has a metal substrate 231
Is used. The insulating layer 232 of the metal substrate 231 is
A hard carbon film grown by a vapor phase method is used. Further, a stator portion 251 of the motor constituting the fan 250 is integrally formed on the motherboard 203. The stator part 251 includes a coil 252, a bearing part 253 for rotatably supporting the rotor part, and a microcomputer 254 for controlling driving of the motor. The coil 252 is patterned on the motherboard 203. Bearing parts 25
3 is mounted on the motherboard 203. Rotor part 2
Reference numeral 55 denotes a fan blade 256, a magnet 257 provided at a position facing the coil 252, and a frame 258 for rotatingly supporting the blade 256. The rotor portion 255 is fixed by attaching the feet 259 of the frame 258 to the motherboard 203.

Power and signals are transmitted from motherboard 203 to C
It is supplied to the PU 202 via a wiring. CPU 202
Is driven, the CPU 202 generates heat. Fan 2
As the 50 rotates, outside air is introduced from the intake slit 211. The introduced outside air flows on the surface of the motherboard 203 by the fan 250 (arrows in the figure), and the outside air directly hits the CPU 202 and other electronic components. As a result, heat is deprived and the electronic component can be cooled. After cooling the electronic components, the hot air passes through the exhaust slit 2
It is discharged from 12.

The heat generated by the CPU 202 is transmitted to the motherboard 203. Since a metal substrate 231 is used for the motherboard 203 and a hard carbon film is used for the insulating layer 232 of the metal substrate 231, heat is diffused to the metal substrate 231. Air intake slit 2 of housing 201
The outside air introduced from 11 is blown onto the metal substrate 231 by the fan 250. This allows the heat to be removed and the device to be cooled. Further, the metal substrate 231 is cooled by the fan 250, and the heated hot air is discharged from the discharge slit 212. The arrows in the figure indicate the state of heat transfer.

As described above, according to the display-integrated computer apparatus 200, since the stator portion 251 is formed directly on the motherboard 203, the fan 250 can be installed low. For this reason, air can flow along the surface of the motherboard 203, and other electronic components can be directly blown. Therefore, the cooling effect is improved. In addition, since the fan 250 can be installed low, the size of the apparatus can be reduced.

Embodiment 3 FIG. [Driving / Control Circuit Integrated Servomotor] FIG. 8 is a sectional view showing the structure of a driving / control circuit integrated servomotor according to Embodiment 3 of the present invention. FIG. 9 is an explanatory diagram showing the inside of the housing of the drive / control circuit integrated servomotor shown in FIG. This drive / control circuit integrated servo motor 3
00 is a motor unit 301, a position / speed detection unit 302 that detects a rotation position and a rotation speed of the motor unit 301,
A drive circuit unit 303 for driving the motor; and a control circuit unit 3 for controlling the motor unit 301 by feeding back information detected by the position / speed detection unit 302 to the drive circuit unit 303.
04 and radiating fins 305 for cooling the power module 331 constituting the drive circuit unit 303. The drive / control circuit integrated motor 300 is directly attached to a machine tool. Therefore, the housing 306 of the drive / control circuit integrated motor includes not only the motor section 301 but also the drive circuit section 303, the control circuit section 304,
It has a sealed structure that accommodates the speed detection unit 302 and has an anti-dust, water-proof, and oil-proof effect.

The closed casing 361 of the control circuit 304 and the position / velocity detector 302 is made of metal. Radiation fins 362 are formed on the inner surface of the housing 361. The radiation fins 362 are formed by injection molding. Further, the inner surface of the metal housing 361 is coated with an insulating layer 363 having good heat conductivity but high electrical insulation. Further, a fan 364 for internal air diffusion is attached to the upper inside of the housing 361. This fan 36
Reference numeral 4 denotes a configuration similar to that disclosed in the third embodiment, and the stator coil 365 is formed in a pattern on the surface of the insulating layer. The rotor 366 is attached to face the stator coil. Rotor 3
66 is rotatably supported by the frame 367.

Motor section 301, position / speed detecting section 302
Part of the heat generated from the other heating elements is radiated from the radiation fins 307 at the ends. The remaining hot air stays in the upper portion of the housing 306 due to the rising airflow, and raises the temperature of the radiation fins 362. The fan 364 blows wind to the radiation fins 362. This allows the heat to be removed and the device to be cooled. The hot air after cooling moves below the housing 306 and is cooled. Further, the heat of the radiation fins 362 is transmitted to the outside through the metal housing 361 and is released. This also promotes cooling. The arrows in the figure indicate the state of heat transfer.

As described above, according to the drive / control circuit integrated servomotor 300, the heat staying in the housing 306 is circulated by the fan 364 and is transmitted to the outside through the radiation fins 305 and the metal housing 361. Because of the release, the cooling efficiency is improved. For this reason, the space for cooling can be reduced, so that the servomotor 30
0 can be reduced in size.

Other Embodiments In the first to third embodiments, the case of the inverter control device 100, the display-integrated computer device 200, and the drive / control circuit-integrated servomotor 300 has been described as an example. It can also be applied to cooling other electronic devices. For example, it can be applied to a compact audio device, a thin TV, and the like.

[0040]

As described above, according to the cooling structure for electronic equipment according to the present invention, the heat pipe extends from the sealing resin side of the power module, and the heat pipe and the radiation fin are interposed via the insulating layer. Attached. For this reason, heat can be released from the sealing resin side of the power module through the heat pipe, the insulating layer, and the radiating fins, so that the heat generated in the power module can be efficiently generated. As a result, the space required for cooling can be reduced, and the size of the electronic device can be reduced.

In the cooling structure for electronic equipment according to the next invention, since the insulating layer used for the cooling structure for electronic equipment is a hard carbon film, the efficiency of conducting heat generated in the power module is improved. Therefore, the cooling efficiency of the electronic device is further improved.

In the cooling structure for electronic equipment according to the next invention, since the stator portion of the fan is formed directly on the circuit board, the height of the fan can be reduced.
Therefore, the size of the electronic device can be reduced. Further, since the air can be blown at a low level, it is possible to directly blow air to the electronic components on the circuit board, and the cooling efficiency of the electronic components is improved.

In the cooling structure for electronic equipment according to the next invention, since the control circuit board has a structure in which an insulating layer is provided on a metal substrate, the heat generated by the high heat-generating components is diffused by the metal substrate, and And the electronic device can be more efficiently cooled.

In the cooling structure for electronic equipment according to the next invention, since the fan and the radiation fin are provided in the housing and above the space between the motor and the power module, the cooling efficiency is improved. Therefore, the space required for cooling can be reduced, and the size of the electronic device can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a cooling structure in an inverter control device according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view taken along line AA ′ of the cooling structure shown in FIG.

FIG. 3 is a cross-sectional view of the cooling structure shown in FIG.

FIG. 4 is an explanatory diagram showing an attachment state of a heat pipe and a radiation fin.

FIG. 5 is an assembly diagram showing a display-integrated computer apparatus according to Embodiment 2 of the present invention.

6 is an assembly view showing the fan shown in FIG.

7 is a cross-sectional view of the display-integrated computer device shown in FIG.

FIG. 8 is a cross-sectional view showing a structure of a drive / control circuit integrated servomotor according to Embodiment 3 of the present invention.

FIG. 9 is an explanatory diagram showing the inside of the housing of the drive / control circuit integrated servo motor shown in FIG. 8;

FIG. 10 is a perspective view showing an example of a conventional cooling structure in an inverter control device.

FIG. 11 is a cross-sectional view taken along the line AA ′ of the cooling structure shown in FIG. 10;

12 is a sectional view of the cooling structure shown in FIG. 10 taken along line BB '.

FIG. 13 is an assembly view showing an example of a conventional display-integrated computer device.

14 is a sectional view of the display-integrated computer device shown in FIG.

FIG. 15 is a sectional view showing an example of a conventional drive / control circuit integrated servomotor.

[Explanation of symbols]

Reference Signs List 100 inverter control equipment, 1 housing, 2 power modules, 3 main circuit boards, 4 control boards, 21 metal boards, 22 power elements, 23 sealing resin, 5 heat pipes, 6 heat radiation fins, 7 fans, 8 heat pipes, 81 Insulation layer, 9 Heat radiation fin.

Continued on front page (72) Inventor Haruhiko Ito 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation

Claims (5)

[Claims] An electronic device housing, a power module housed in the electronic device housing and having a high heat-generating component attached to a circuit board and sealed with resin from above, and attached to the circuit board side of the power module. Cooling means, a heat pipe extending from a sealing resin side of the power module, an insulating layer provided on an outer surface of the heat pipe for performing electrical insulation, and a radiating fin attached to the heat pipe via an insulating layer A cooling structure for electronic equipment, comprising: 2. The cooling structure for an electronic device according to claim 1, wherein said insulating layer is made of a hard carbon film. 3. An electronic device housing provided with an intake slit and an exhaust slit; a control circuit board accommodated in the electronic device housing and having a high heat-generating component; and a stator portion directly formed on the control circuit board. A rotor portion disposed opposite to the stator portion so as to be coaxial with the stator portion, a blade portion rotating with the rotation of the rotor portion, and a support portion for rotating and supporting the rotor portion. Electronic equipment cooling structure characterized by the above-mentioned. 4. The cooling structure for an electronic device according to claim 3, wherein the control circuit board has a structure in which an insulating layer having high heat conductivity is provided on a metal substrate. 5. A motor housing having a radiation fin at an axial end thereof, a motor housed in the housing, and a power module attached to the axial end of the housing and constituting a drive circuit unit. A cooling structure for an electronic device, comprising: a fan provided in the housing above the space between the motor unit and the power module; and a radiation fin provided around the fan.