JPH11354396A - Method and device for controlling semiconductor process - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow easy analysis of troubles causing defects by, even for a parameter wherein the relation between an integrated circuit device and characteristics is not technically clear, clearing the relations statistically for comparison between a product data and a device condition data when a defective occurs. SOLUTION: In a diffusion process 1 of a management device, manufacturing processes such as CVD, an electric furnace, washing, stepper, dry etching, and ion implantation are included, and the condition data of these semiconductor manufacturing devices is sent to a device condition data 2 along with a measurement time. The electric characteristics of a product 3 of the lot processed in the diffusion process 1 is measured with a PCM measuring device. The results measured with the PCM measuring device and a wafer inspection device are sent to a product data 4 along with the measurement time. A control system 5 extracts, along with the device condition data 2 where the unit identity of a processed manufacturing device, the process time, and the information indicating the device condition are stored, the data stored in the product data 4 for an integrated circuit device, and a process is made to obtain relations with the product data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for managing a semiconductor process in a manufacturing process of an integrated circuit device in which a plurality of semiconductor manufacturing devices exist for one process.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of an integrated circuit device, a plurality of semiconductor manufacturing devices exist for one process.
It is manufactured through several hundred semiconductor processes.

As described above, in one step in a semiconductor process, a plurality of semiconductor manufacturing apparatuses exist.
Assuming that there are 100 diffusion steps and that there are n semiconductor manufacturing apparatuses in one step, the path of the semiconductor manufacturing apparatus actually used when manufacturing the integrated circuit device is n.
¹⁰⁰ ways.

In this semiconductor process, there are many cases where the relationship between parameters indicating the state of each semiconductor manufacturing apparatus and the characteristics of an integrated circuit device manufactured using each semiconductor manufacturing apparatus is not clearly determined. Each process must always be strictly controlled so that the yield of integrated circuit devices is improved.

Hereinafter, a conventional method of managing a semiconductor process will be described with reference to the drawings. FIG. 3 is a schematic diagram showing a conventional semiconductor process management device and a flow of management data. In FIG. 3, reference numeral 31 denotes a semiconductor manufacturing apparatus;
2 is apparatus state data indicating the state of the semiconductor manufacturing apparatus 31;
33 is a device state database storing device state data 32, 34 is a PCM measuring device for measuring PCM in an integrated circuit device processed using the semiconductor manufacturing device 31, 35
Is a PCM electrical characteristic data obtained by the PCM measuring device 34, 36 is a PCM electrical characteristic database storing the PCM electrical characteristic data 35, 37 is a wafer inspection device for measuring the integrated circuit device, 38 is a wafer inspection device A wafer inspection data 39 obtained by the device 37 is a wafer inspection database storing wafer inspection data 38.

Here, PCM stands for Process Control.
An abbreviation for Module, an element for measuring basic electrical characteristics of a manufactured integrated circuit device. In the management method using the conventional semiconductor process management apparatus as described above, the apparatus state data 32 and the PCM electrical characteristic data 35 are used.
And wafer inspection data 38 into databases 33, 3
The data is stored in the database corresponding to each of Nos. 6 and 39, and the fluctuation of each data alone is extracted.

For example, regarding the device status data 32,
A management method of examining how a parameter of a certain semiconductor manufacturing apparatus changes with time and adjusting and repairing the semiconductor manufacturing apparatus when an abnormality is found has been used.

The PCM electrical characteristic data 35 has a standard set for each electrical characteristic. If the standard is not met, it is assumed that an abnormality has occurred, and an investigation or countermeasure is taken. I have used it.

The wafer inspection data 38 is managed on a daily basis to determine whether the yield or the percentage of defective categories is significantly different from past values. In addition, a standard is set for the yield of the wafer inspection data and the ratio of the defective category, and a management method has been used in which if the standard is not met, it is considered that an abnormality has occurred, and an investigation or a countermeasure is taken.

[0010]

However, in the conventional method of managing a semiconductor process as described above, each parameter of the semiconductor manufacturing apparatus is set to be different from each characteristic of the integrated circuit device manufactured by the semiconductor manufacturing apparatus. There is no problem if the effect is clear, but in practice the correlation between most parameters is not clear and it is unclear whether the range to be managed is optimal. Therefore,
Even if each parameter is managed based on a certain management standard, there is a problem that the characteristics of the integrated circuit device deteriorate.

An integrated circuit device is manufactured through a semiconductor process of several hundred steps or more, and a plurality of semiconductor manufacturing devices exist for one process. There will be numerous routes.

In order to investigate the cause when a characteristic value of the integrated circuit device fluctuates and an out-of-specification characteristic value is generated, as described above, a semiconductor manufacturing device used for manufacturing the integrated circuit device is used. There is also a problem that an enormous amount of time and advanced technology are required because there are so many routes of the apparatus.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. It is possible to set a management standard of each parameter indicating a state of a semiconductor manufacturing apparatus to an optimum value and to determine a defective point in the characteristics of an integrated circuit device. In the case where a failure occurs, the cause of the failure can be easily extracted from several hundred processes or more, and the cause of the failure can be easily investigated. Easily extract the equipment that caused the failure from the equipment, and easily extract the parameter that caused the failure from the parameters of the equipment that caused the failure and easily analyze the cause of the failure The present invention provides a method and an apparatus for managing a semiconductor process, which can be performed.

[0014]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a method and apparatus for managing a semiconductor process according to the present invention provide a method of controlling the characteristics of an integrated circuit device among parameters indicating the state of each semiconductor manufacturing apparatus. Even for parameters whose relationship is not technically clear, the correlation is statistically clarified so that the range to be managed for each semiconductor manufacturing device can be grasped, and if the characteristics of the integrated circuit device are poor. Even when a location occurs, the recorded product data is compared with the device state data at the time of occurrence of the failure.

According to the above-described method or configuration, it is possible to set the management standard of each parameter indicating the state of the semiconductor manufacturing apparatus to an optimum value, and even if a defective portion occurs in the characteristics of the integrated circuit device, The process that caused the failure can be easily extracted from hundreds of processes or more, and the cause of the failure can be easily determined. The failed device can be easily extracted, and the parameter that caused the failure can be easily extracted from the parameters of the device that caused the failure, and the cause of the failure can be easily analyzed.

[0016]

A method of managing a semiconductor process according to a first aspect of the present invention uses a plurality of semiconductor manufacturing apparatuses for one step in a manufacturing process of an integrated circuit device made of a semiconductor. A method for managing a semiconductor process, which is a process when manufacturing an integrated circuit device, comprising: storing device state data indicating an operation state of the semiconductor manufacturing device in association with the semiconductor manufacturing device; For storing device identification information of a semiconductor manufacturing device used for manufacturing a semiconductor device, storing product data of an integrated circuit device manufactured by the semiconductor manufacturing device, and correlation between product data of the integrated circuit device And a step of obtaining

According to a tenth aspect of the present invention, in the manufacturing process of an integrated circuit device made of a semiconductor, a plurality of semiconductor manufacturing devices are used for manufacturing the integrated circuit device. A semiconductor process management device, wherein the device status data indicating the operation state of the semiconductor manufacturing device is stored in association with the semiconductor manufacturing device, and the device is used when manufacturing the integrated circuit device. Means for storing device identification information of a semiconductor manufacturing device; means for storing product data of an integrated circuit device manufactured by the semiconductor manufacturing device; and means for determining a correlation between product data of the integrated circuit device. Configuration.

According to the above method or configuration, even if the causal relationship between the parameters indicating the state of each semiconductor manufacturing apparatus and the characteristics of the integrated circuit device is not technically clear, even if the parameters are statistically unclear, It clarifies the correlation and enables the grasp of the range to be managed for each semiconductor manufacturing device, and if a defect occurs in the characteristics of the integrated circuit device, the recorded product data and the defect occurrence point With the device status data of the other device.

According to a second aspect of the present invention, there is provided a method of managing a semiconductor process, wherein the product data of the integrated circuit device according to the first aspect includes yield information, power consumption, operation characteristics, resistance value, and the like in an inspection process provided in a manufacturing process. It is assumed that the data is at least one data of the electrical characteristics of the PCM.

According to an eleventh aspect of the present invention, there is provided a semiconductor process management device, wherein the product data of the integrated circuit device according to the tenth aspect includes yield information, power consumption, operation characteristics, resistance value, and the like in an inspection process provided in a manufacturing process. It is configured to be data of at least one or more electrical characteristics of PCM.

According to the above method or configuration, the correlation between yield information, power consumption, operating characteristics, resistance values, and electrical characteristics of PCM in the inspection process is obtained with at least one or more product data.

According to a third aspect of the present invention, there is provided a method of managing a semiconductor process, wherein the step of determining a correlation according to the first aspect is a step of determining a correlation between product data. According to a twelfth aspect of the present invention, there is provided a semiconductor process management device.
The means for obtaining a correlation described in 0 is a means for obtaining a correlation between product data.

According to the above method or configuration, a correlation between product data is obtained. According to a fourth aspect of the present invention, in the semiconductor process management method according to the first aspect, the step of determining the correlation includes determining a correlation between yield information in an inspection process provided in the manufacturing process and product data other than the yield information. It is a method that is a process.

According to a thirteenth aspect of the present invention, in the semiconductor process management apparatus, the means for determining a correlation according to the tenth aspect is configured such that the correlation between yield information in an inspection step provided in a manufacturing process and product data other than the yield information is provided. It is configured to be a means for obtaining a relationship.

According to the above method or configuration, the correlation between the yield information and the product data other than the yield information is obtained. The method for managing a semiconductor process according to claim 5,
The step of determining a correlation according to claim 1 is a method of determining a correlation between device state data and product data.

A semiconductor process management device according to a fourteenth aspect is configured such that the means for determining a correlation according to the tenth aspect is means for determining a correlation between device state data and product data.

According to the above method or configuration, the correlation between the apparatus status data and the product data is obtained. According to a sixth aspect of the present invention, there is provided a method of managing a semiconductor process, the method further comprising the step of storing the obtained correlation information.

According to a fifteenth aspect of the present invention, there is provided a semiconductor process management device further comprising means for storing the obtained correlation information. According to the above method or configuration, by storing the correlation information, it is possible to perform a reliable comparison.

According to a seventh aspect of the present invention, there is provided a method of managing a semiconductor process, further comprising a step of obtaining a parameter affecting the correlation of product data from the apparatus state data according to the first aspect.

A semiconductor process management apparatus according to a sixteenth aspect of the present invention has a configuration further comprising means for obtaining a parameter affecting the correlation of product data from the apparatus state data according to the tenth aspect.

According to the above method or configuration, the parameters of the apparatus status data which further affect the correlation are obtained from the stored correlation items. An eighth aspect of the present invention is a method for managing a semiconductor process, the method further comprising the step of controlling an operation state of a semiconductor manufacturing apparatus based on the obtained correlation information.

A semiconductor process management apparatus according to a seventeenth aspect has a configuration further comprising means for controlling an operation state of a semiconductor manufacturing apparatus based on the information on the correlation obtained in the tenth aspect.

According to the above method or configuration, the state of the semiconductor manufacturing apparatus is controlled based on the correlation. Claim 9
The method of managing a semiconductor process according to the present invention further includes a step of analyzing the cause of the failure when a failure occurs in the integrated circuit device based on the information on the correlation obtained in the claim 1. .

In the semiconductor device management apparatus according to the present invention, when a defective portion occurs in the integrated circuit device, the cause of the failure is analyzed based on the obtained correlation information. Is further provided.

According to the above method or configuration, when a defective portion occurs in the integrated circuit device, the cause of the failure is analyzed based on the correlation. Hereinafter, a method and apparatus for managing a semiconductor process according to an embodiment of the present invention will be specifically described with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a management apparatus for a semiconductor process according to the present embodiment. In FIG. 1, reference numeral 1 denotes a diffusion step for manufacturing an integrated circuit device in which a plurality of semiconductor manufacturing apparatuses exist for one step;
Device state data for storing the state data of the apparatus indicating the operating state of each semiconductor manufacturing apparatus in association with the semiconductor manufacturing apparatus, and storing the apparatus identification information of the semiconductor manufacturing apparatus used to manufacture the integrated circuit device; Reference numeral 3 denotes a product which is an integrated circuit device manufactured by the semiconductor manufacturing apparatus in the diffusion step 1. Reference numeral 4 denotes yield information or power consumption, measured values such as operating characteristics and resistance values in an inspection step provided in the manufacturing step. Wafer inspection data and PCM
5 is a control system for extracting the data stored in the device state data 2 and the product data 4 and obtaining a correlation with the product data. This is means for analyzing the correlation data based on the correlation of the control system 5 and controlling the semiconductor manufacturing apparatus in the diffusion step 1 based on the analysis result.

The operation of the semiconductor process management apparatus configured as described above will be described below. In the diffusion step 1, C
There are manufacturing processes such as a VD process, an electric furnace process, a cleaning process, a stepper process, a dry etching process, and an ion implantation process. Each diffusion step includes a plurality of semiconductor manufacturing apparatuses.
The integrated circuit device as the product 3 is manufactured in units called lots by performing several hundred or more processes in the diffusion process 1. For example, a semiconductor manufacturing apparatus in a CVD process constantly manages the state of the apparatus such as the degree of vacuum in a reaction chamber, the temperature of a stage, the power of a heater for controlling the temperature, the flow rate of gas, and the opening and closing angle of a valve for controlling the degree of vacuum. , Respectively. The device status data obtained from these semiconductor manufacturing devices is stored in the device status data 2 together with the measurement time.
Sent to

The electrical properties data of the PCM of the product 3 of the lot that has been subjected to the diffusion process 1 is measured by a PCM measuring device. Furthermore, the power consumption, operating characteristics, resistance, and the like of the integrated circuit device are measured by the wafer inspection device, and good or bad is determined for each measurement item, and when the failure is determined, the category is classified according to the measurement item. . Product data 4 contains P
The result measured by the CM measuring device and the wafer inspection device is sent together with the measured time.

The control system 5 includes a device status data 2 storing the number of the semiconductor manufacturing device that has processed the integrated circuit device, the time when the semiconductor manufacturing device has performed the processing, and information indicating the device status, and the integrated circuit device. A process of extracting data stored in the product data 4 and obtaining a correlation with the product data is performed. By outputting the correlation with the product data obtained by the control system 5 to a monitor screen, a printer, or the like, the correlation between the device state data 2 and the product data 4 can be clearly known.

Accordingly, it has become possible to determine a standard for device management and to quickly analyze the characteristics of the integrated circuit device when it changes. Hereinafter, the operation of the control system 5 for obtaining the correlation in the semiconductor process management apparatus and the management method using the apparatus configured as described above will be described with reference to FIG. I do.

In the control system 5 for obtaining the correlation, first, in STEP 20, a manufacturing process / semiconductor manufacturing apparatus to be investigated is set. Next, in STEP 30, the apparatus status data (parameters: P1, P2,..., Pn) and the product data (items: K1, K2,. , Kb (yield)) from each database. For example, in the CVD process, the state of the apparatus such as the time at which the treatment was performed, the degree of vacuum in the reaction chamber, the temperature of the stage, the power of the heater for controlling the temperature, the flow rate of the gas, and the opening / closing angle of the valve for controlling the degree of vacuum. Is extracted as the parameter Pn of the device status data 2. As the product data 4, product data such as the electrical characteristics of the PCM in the PCM measurement device, the yield of the measurement result in the wafer inspection device, and the yield for each failure category are extracted.

Next, in STEP 40, i = 0 is set as an initial value for n indicating the variable part of the parameter Pn of the apparatus status data 2. Here, i = 0 means that the device status data is not set. If i ≧ 1, it means that the device status data has been set.
Next, in STEP 50, the items of the product data 4 to be investigated are set. The product data items set here are Km and Kb
Not only a single item such as, but also an item obtained by combining a plurality of product data is set as product data to be investigated. Product data contains m items and yield information in Kb
If there are, the number of combinations is _{m + 1} C _q (q = 1,2,3, ..., m
+1) For example, when q = 1, the extracted product data is a single item (K1), (K2),..., (Km), (Kb). When q = 2, the product data to be extracted is (k1, k
2), (k1, k3), ..., (Km, kb). Here, the item obtained by combining the product data is a voltage obtained by adding Vtn indicating the switching voltage of the N-channel transistor and Vtp indicating the switching voltage of the P-channel transistor, which is one of the electrical characteristics of the PCM. As described above, it is an item combining product data.

Next, in STEP 60, of the item group extracted in STEP 50, the first time, the yield and the product data other than the yield are extracted. Here, the second time is ST
The processing path is from the EP 120. In this case, the apparatus data is extracted from the apparatus state data and the product data including the yield.

Next, in STEP 70, the correlation between the items extracted in STEP 60 and the product data is extracted. If there is no parameter setting for the device status data (i = 0 for Pi),
Yield (Kb) and non-yield product data (K1, K2,
・ ・, Km) The correlation is extracted for the item including the combination. When there is a parameter setting for device status data (Pi
I ≧ 1) extracts correlations for items including a combination of device state data (P1, P2,..., Pn) and product data (K1, K2,..., Km, Kb).

Next, in step 80, the presence or absence of the correlation extracted in step 70 is determined. If there is a correlation, the correlation information is stored in step 90. Further, in STEP 100, the correlation information is ranked (weighted) by the correlation strength.

Next, in STEP 110, it is determined whether or not there is another correlation investigation item extracted in STEP 60. If there is a correlation survey item, change the correlation survey item and change from STEP 70 to STEP 70.
Repeat step 110.

Next, in STEP 120, it is determined whether or not there is any device status data (parameters: P1, P2,..., Pn) affecting the correlation items stored in STEP 90. If there are parameters to be affected, the parameters of the device status data are set as i ++ in STEP130.
Configure Pi settings.

Next, returning to STEP 50, the device data including the device state data and the yield are calculated from the above STEP 50.
Step 120 is repeated to extract correlations.
Next, in step 140, the information stored in step 100 is output, and the candidate for the cause of failure is determined including a combination of parameters and items. In STEP 150, the correlation investigation is similarly repeated for the next step with the contents of STEP 20 to STEP 140 described above. This process ends when the entire process is completed.

[0049]

As described above, claim 1 or claim 10 is as described above.
According to the invention described in the above, among the parameters indicating the state of each semiconductor manufacturing apparatus, even if the causal relationship with the characteristics of the integrated circuit device is not technically clear, the correlation is statistically clear. Therefore, the range to be managed for each semiconductor manufacturing apparatus can be grasped.

Therefore, it is possible to set the management standard of each parameter indicating the state of the semiconductor manufacturing apparatus to an optimum value. Further, even when a defective portion occurs in the characteristics of the integrated circuit device, the recorded product data can be compared with the device state data at the time of occurrence of the defect.

Therefore, even when a defective portion occurs in the characteristics of the integrated circuit device, the cause of the defect can be easily extracted from hundreds of processes or more, and the cause of the defect can be easily investigated. In addition, a device that caused a failure can be easily extracted from a plurality of devices corresponding to hundreds or more processes, and a parameter that caused a failure can be extracted from each parameter of the device that caused the failure. Easily extract
The cause of the failure can be easily analyzed.

According to the invention as set forth in claim 2 or claim 11, correlation of the yield information, power consumption, operating characteristics, resistance value, and electrical characteristics of PCM with at least one or more product data in the inspection process. Since a relationship can be obtained, a correlation that cannot be found with one item can be found.

According to the third or twelfth aspect of the present invention, the correlation between product data can be obtained, so that the correlation between product data can be clarified.

According to the invention described in claim 4 or claim 13, since the correlation between the yield information and the product data other than the yield information can be obtained, the yield information and the product data other than the yield information can be obtained. Can be clarified.

According to the invention described in claim 5 or claim 14, since the correlation between the device status data and the product data can be obtained, the correlation between the device status data and the product data can be clearly defined. can do.

According to the invention of claim 6 or claim 15, since the correlation information can be stored,
Correlation can be reliably compared, and the order of correlation strength can be clarified.

According to the present invention, the parameters of the apparatus status data which further affect the correlation can be obtained from the stored correlation items. Can be extracted.

According to the invention described in claim 8 or claim 17, since the state of the semiconductor manufacturing apparatus can be controlled based on the correlation, the management criterion of each parameter is set for each manufacturing apparatus. It can be reliably set to the optimum value.

According to the ninth or eighteenth aspect of the present invention, when a defective portion occurs in the integrated circuit device, the cause of the defect can be analyzed based on the correlation. The cause of the failure can be quickly determined.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an apparatus for managing a semiconductor process according to an embodiment of the present invention;

FIG. 2 is a flowchart showing the operation of the control system according to the embodiment;

FIG. 3 is a schematic diagram showing a conventional semiconductor process management device and a flow of management data.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Diffusion process 2 Device status data 3 Product 4 Product data 5 Control system 6 Correlation data 31 Semiconductor manufacturing device 32 Device status data 33 Device status database 34 PCM measurement device 35 PCM electrical characteristic data 36 PCM electrical characteristic database 37 Wafer inspection device 38 Wafer inspection data 39 Wafer inspection database

Claims (18)

[Claims] In a method of manufacturing an integrated circuit device comprising a semiconductor, a method of managing a semiconductor process when manufacturing the integrated circuit device using a plurality of semiconductor manufacturing devices for one step, A step of storing device state data indicating an operation state of the semiconductor manufacturing apparatus in association with the semiconductor manufacturing apparatus; a step of storing device identification information of the semiconductor manufacturing apparatus used in manufacturing the integrated circuit device; A method for managing a semiconductor process, comprising: a step of storing product data of an integrated circuit device manufactured by a semiconductor manufacturing device; and a process of obtaining a correlation between product data of the integrated circuit device. 2. The integrated circuit device product data is at least one of yield information, power consumption, operating characteristics, resistance values, and electrical characteristics of PCM in an inspection process provided in a manufacturing process. The method for managing a semiconductor process described in the above. 3. The method according to claim 1, wherein the step of obtaining the correlation is a step of obtaining a correlation between product data. 4. The method according to claim 1, wherein the step of obtaining the correlation is a step of obtaining a correlation between yield information in an inspection step provided in the manufacturing process and product data other than the yield information. . 5. The semiconductor process management method according to claim 1, wherein the step of obtaining the correlation is a step of obtaining a correlation between the device state data and the product data. 6. The method according to claim 1, further comprising the step of storing the obtained correlation information. 7. The semiconductor process management method according to claim 1, further comprising a step of obtaining a parameter affecting the correlation of the product data from the apparatus state data. 8. The method according to claim 1, further comprising the step of controlling an operation state of the semiconductor manufacturing apparatus based on the obtained correlation information. 9. The method according to claim 1, further comprising the step of analyzing the cause of the failure when a failure occurs in the integrated circuit device based on the obtained correlation information. 10. An apparatus for managing a semiconductor process when manufacturing an integrated circuit device using a plurality of semiconductor manufacturing devices for one step in a manufacturing process of an integrated circuit device made of a semiconductor, Means for storing device state data indicating an operation state of the semiconductor manufacturing apparatus in association with the semiconductor manufacturing apparatus; means for storing device identification information of the semiconductor manufacturing apparatus used when manufacturing the integrated circuit device; An apparatus for managing a semiconductor process, comprising: means for storing product data of an integrated circuit device manufactured by a semiconductor manufacturing device; and means for determining a correlation between product data of the integrated circuit device. 11. The product data of the integrated circuit device is at least one of yield information, power consumption, operation characteristics, resistance values, and electrical characteristics of PCM in an inspection process provided in a manufacturing process. An apparatus for managing a semiconductor process according to claim 1. 12. The apparatus according to claim 10, wherein the means for obtaining the correlation is means for obtaining a correlation between product data. 13. The semiconductor process management apparatus according to claim 10, wherein the means for obtaining the correlation is means for obtaining a correlation between yield information in an inspection step provided in the manufacturing process and product data other than the yield information. . 14. The apparatus according to claim 10, wherein the means for obtaining the correlation is means for obtaining a correlation between the apparatus state data and the product data. 15. An apparatus according to claim 10, further comprising means for storing the obtained correlation information. 16. The management apparatus for a semiconductor process according to claim 10, further comprising means for obtaining a parameter affecting the correlation of the product data from the apparatus state data. 17. The management apparatus for a semiconductor process according to claim 10, further comprising means for controlling an operation state of the semiconductor manufacturing apparatus based on the obtained correlation information. 18. The management apparatus according to claim 10, further comprising means for analyzing a cause of the failure when a failure occurs in the integrated circuit device based on the obtained correlation information.