JPH11354392A - Apparatus and method of holding chip electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable accurate and ensured mounting of a chip on a holder plate to form electrodes of a chip electronic component such as a layered capacitor, etc. SOLUTION: The chip electronic component holding apparatus comprises a holder plate 11 for holding a chip 1, a guide plate 12 for guiding the chip 1 to the holder plate 11, a press pin 23 for drive-fitting the chip 1 into a through-hole 16 of the holder plate 11, and a rod 26 for pushing up the chip 1. The rod 26 is used to push the chip 1 up when the chip 1 is normally set in a guide hole 20 of the guide plate 12, and a vacuum hole 25 of the rod 26 sucks the chip 1 after the chip 1 is normally set.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component holding apparatus and method for holding electronic components such as a multilayer ceramic capacitor in a predetermined state.

[0002]

2. Description of the Related Art As shown in FIG. 1, a multilayer ceramic capacitor has a ceramic chip 1 made of a rectangular columnar dielectric ceramic including a plurality of internal electrodes (not shown), and a pair of external electrodes 2;
3 The pair of external electrodes 2 and 3 are composed of a pair of end surfaces 1a and 1b of the porcelain chip 1 and four side surfaces 1c, 1d and 1e.
It is formed so as to cover a part of 1f. In order to easily form the pair of electrodes 2 and 3, it is composed of a holding plate 4 also called a holding plate, a guide plate 5 also called a loading plate, and a pressing pin 6 as a pressing member as shown in FIGS. An electronic component holding device is used.

The holding plate 4 comprises a supporting plate 4a having little or no flexibility and a plurality of elastic members 4 made of silicone rubber.
b. A through hole 7 is formed in the elastic body 4b, and the porcelain chip 1 as a chip-type electronic component is also held by the through hole 7. The planar shape of the through hole 7 is circular as is clear from FIG. 4, and is formed at the center of the circular plate-like elastic body 4b. The elastic body 4b is fixed to the support plate 4a. The diameter of the through hole 7 is set to be somewhat smaller than the length of the diagonal line of the porcelain chip 1 in a plan view. Therefore, when the prismatic porcelain chip 1 is forcibly inserted into the through hole 7, the elastic body 4b is elastically deformed so that the through hole 7 expands, and the porcelain chip 1 is held by the elastic body 4b.

The guide plate 5 guides the porcelain chip 1 to the holding plate 4 and assists the mounting of the porcelain chip 1 on the holding plate 4. It has a plurality of guide holes 8 arranged concentrically. The guide hole 8 is formed in a circular shape in plan view as shown in FIG. 5 corresponding to the through hole 7 of the holding plate 4, and is formed larger than the diameter of the through hole 7 and the length of the diagonal line of the ceramic chip 1. I have.

The pressing pin 6 presses the end face of the porcelain chip 1 to push the porcelain chip 1 into the through hole 7 of the holding plate 4 as shown in FIG. In addition, a plurality of the pressing pins 6 are provided corresponding to the number of the through holes.

When the electrodes 2 or 3 are formed, the end face of the porcelain chip 1 is slightly projected from the lower surface of the holding plate 4 as shown in FIG. One end face 1a of the porcelain chip 1 is brought into contact, a paste-like electrode material is adhered to a predetermined area of the porcelain chip 1, and then dried. Next, the porcelain chip 1 is taken out of the holding plate 4, turned upside down and mounted on the holding plate 4 again, and a paste-like electrode material is attached to the other end surface of the porcelain chip 1 and dried. Thereafter, the porcelain chip 1 is removed from the holding plate 4 and the electrode material is fired to complete the external electrodes 2 and 3.

[0007]

Since the diameter of the guide plate 5 is larger than the length of the diagonal line of the porcelain chip 1, the porcelain chip 1 is guided to the guide hole 8 by a vibration device (not shown) or the like.
When inserted into the device, the device is not always inserted in the correct direction, and may be inserted at an angle as shown in FIG. When the porcelain chip 1 is inserted in such an inclined manner, the porcelain chip 1 cannot be appropriately pressed by the pressing pin 6, and the porcelain chip 1 cannot be pressed into the through hole 7 of the holding plate 4. And the porcelain chip 1 is damaged.

Further, since the guide hole 8 of the guide plate 5 is formed in a circular shape like the through hole 7 of the holding plate 4, the insertion of the porcelain chip 1 in a plan view as shown by a broken line in FIG. The directions are unified, and the mounting directions of the porcelain chips 1 in the through holes 7 of the holding plate 4 are also uneven as shown in FIG. When the direction of holding the porcelain chip 1 on the holding plate 4 becomes uneven in this way, when the paste-like electrode material 10 is adhered to the porcelain chip 1 as shown in FIG. The adhesion of the material 10 varies, and the width E on the side surfaces of the electrodes 2 and 3 shown in the drawing varies. Another problem when holding the porcelain chip 1 with the holding plate 4 is that the porcelain chip 1 cannot be sufficiently held by the through-hole 7 due to the variation in the dimensions of the through-hole 7 and the porcelain chip 1. There is a problem that the chip 1 is detached from the through hole 7.

The various problems as described above are not limited to the multilayer ceramic capacitor, but when a capacitor of another type or an electronic component such as a resistor or an inductance is held by the holding plate 4 or only when the electrode of the electronic component is formed. In other words, the holding plate 4 is used for measuring the characteristics of the electronic components or mounting the electronic component on a circuit board.
A similar problem occurs when the electronic component is held by the above.

Accordingly, a first object of the present invention is to provide an apparatus and a method capable of smoothly and satisfactorily inserting an electronic component into a through hole of a holding plate. A second object of the present invention is to provide a holding device that can hold an electronic component so as not to fall off. Further, a third object of the present invention is to provide an apparatus capable of mounting a plurality of electronic components on a holding plate in a uniform direction.

[0011]

The present invention for achieving the first object has a through hole for holding a chip-type electronic component, and at least the periphery of the through hole is elastically deformable. Holding part (for example, holding plate) formed of
A guide portion (for example, a guide plate) having an electronic component guide hole larger than the through hole and adjacent to the holding portion so that the guide hole is concentric with the through hole; A pressing member for pressing the electronic component disposed in the guide hole and inserting the electronic component in the through hole; and inserting the electronic component disposed in the guide hole into the through hole before inserting the electronic component into the through hole. It is a device for pressing the electronic component from a direction opposite to the direction of pressing the component, and relates to a chip-type electronic component holding device comprising a rod-shaped body formed so as to be inserted into the through hole. is there. In addition, as shown in claim 2, it is desirable to add a suction device to the device of claim 1. The present invention of a method for achieving the first object has a through-hole for holding a chip-type electronic component, and at least a periphery of the through-hole is formed of an elastically deformable material. A guide portion having an electronic component guide hole larger than the through hole, the guide portion being adjacent to the holding portion such that the guide hole is concentric with the through hole, and arranged in the guide hole. A pressing member for pressing the electronic component into the through-hole and pressing the electronic component into the through-hole from a side of the through-hole opposite to the side where the electronic component is inserted; Preparing a rod-shaped member for pressing the electronic component; inserting the electronic component into the guide hole of the guide plate; inserting the rod-shaped member into the through-hole; Press to correct the direction of the electronic component And the step that,
Pressing the electronic component by the pressing member to insert the electronic component in the guide hole into the through hole of the holding plate. Preferably, the electronic component is sucked. According to another aspect of the present invention, there is provided a holding plate having a through-hole for holding a chip-type electronic component, wherein at least a periphery of the through-hole is formed of an elastically deformable material. The present invention relates to a chip-type electronic component holding device in which a number of irregularities or a number of cuts are provided on a wall surface of the through hole of the holding plate.
The present invention for achieving the third object has a through hole having a substantially circular shape in plan view for holding a prismatic chip-type electronic component, and at least the periphery of the through hole is formed of an elastically deformable material. A holding plate, a guide plate having an electronic component guide hole larger than the through hole and being superposed on the holding plate such that the guide hole is concentric with the through hole; A chip-type electronic component holding device having a pressing member for pressing the electronic component disposed in the guide hole and inserting the electronic component into the through hole, wherein the device corresponds to the planar shape of the prismatic chip type electronic component. The present invention relates to a chip-type electronic component holding device in which at least a region of a guide hole near a holding plate is formed in a square shape when viewed in plan. It is preferable that the guide hole is formed so as to be tapered toward the holding plate. In the invention of each of the above-mentioned claims, the term “electronic component” means not only a completed component but also an unfinished component provided with no external electrodes or the like.

[0012]

According to the present invention, when the electronic component is inserted into the through hole of the holding portion, the electronic component of the guide hole of the guide portion on the holding portion is pressed by the pressing member from the through hole side. Therefore, the inclination of the electronic component with respect to the direction in which the guide hole extends can be corrected by the pressing by the pressing member, and the electronic component can be smoothly inserted into the through hole of the holding portion, and Parts can be prevented from being damaged.
According to the second and fourth aspects of the present invention, the position of the electronic component in the guide hole can be corrected or the electronic component can be inserted into the through hole with the suction of the electronic component by the suction device. Can be advanced more smoothly and accurately. According to the fifth aspect of the present invention, since the elastically deformable portion surrounding the through-hole of the holding plate is provided with irregularities or cuts, the amount of elastic deformation of this portion is increased, and the electronic component or the through-hole is formed. The electronic component can be held satisfactorily even if the dimensional variation occurs. According to each of the sixth and seventh aspects of the present invention, the electronic component is held by the holding plate so as to be in a predetermined direction when viewed in plan. That is, even if the through hole in the holding plate is circular and the electronic component is prismatic, the direction of the prismatic electronic component can be set to a predetermined direction.

[0013]

Embodiments and Examples Next, embodiments and examples of the present invention will be described with reference to FIGS.

FIG. 7 is a view for holding the porcelain chip 1 on the holding plate 11 and attaching an electrode material to the porcelain chip 1 as in FIG. 3 in order to manufacture the multilayer capacitor shown in FIG. This device includes a holding plate 11 as a holding portion, a guide plate 12 as a guiding portion, a pressing device 13, and an auxiliary device 1.
4 and a control device 15.

The holding plate 11 holds the porcelain chip 1 as an electronic component, similarly to the conventional holding plate 4 of FIG. 2, and is made of a support plate 11a having little or no flexibility and a silicone rubber. And a plurality of elastic members 11b.
A through hole 16 is formed in the elastic body 11b.
6 also holds the porcelain chip 1 as a chip type electronic component. The through hole 16 has a circular shape as a whole as is apparent from FIG. 8, but the wall surface of the through hole 16 is provided with a number of irregularities such as saw teeth. That is, as is clear from FIG. 8 and FIG.
A large number of triangular projections 17 protrude from the wall surface 6 toward the center of the through hole 16. Note that the circumferential end of each projection 17 is substantially located on a first virtual circle 18 shown by a broken line in FIG. In addition, the end on the outer peripheral side of the projection 17, that is, the tip of the valley of the uneven surface is substantially located on the second virtual circle 19 shown by the broken line in FIG. The diameter of the first virtual circle 18 is set to be somewhat smaller than the length of a diagonal line connecting the first and second angles P1 and P2 of the porcelain chip 1 when viewed in plan, and the diameter of the second virtual circle 19 is The length is set larger than the length of the diagonal line of the chip 1. Accordingly, when the prismatic porcelain chip 1 is forcibly inserted or pressed into the through-hole 16, the projection 17 of the elastic body 11b is elastically deformed so that the through-hole 16 expands, and the porcelain chip 1 is stably held by the elastic body 11b. Is done. In addition,
The elastic body 11b is fixed to the support plate 11a.

A guide plate 12, which can also be called a load plate, guides the porcelain chip 1 to a holding plate 11, which can also be called a holding plate, like the guide plate 5 of FIG. 2, and mounts the porcelain chip 1 on the holding plate 11. And a plurality of guide holes 20 that are arranged adjacent to and adjacent to the holding plate 11 and that are concentrically arranged in the through holes 16 of the holding plate 11. In this embodiment, the guide hole 20 is
The through hole 16 is not formed in a circular shape corresponding to the through hole 16, but is formed in a square shape as viewed in plan as shown in FIG. That is, the guide hole 20 has a relatively steep slope, and the first portion 20 a tapered toward the holding plate 11.
And a second portion 20b having a wall surface that is smaller in inclination than the first portion 20a, and both the first and second portions 20a and 20b have a planar rectangular shape as is clear from FIG. It is. The portion where the diameter of the guide hole 20 is the smallest is the outlet of the first portion 20a, that is, the portion adjacent to the holding plate 11, and is formed somewhat larger than the porcelain chip 1 shown by the broken line in FIG. Since the planar shape of the first portion 20a is similar to the planar shape of the porcelain chip 1 as is clear from FIG. 9, the porcelain chip 1 is arranged in the guide hole 20 with uniform directionality. Note that the second portion 20b does not need to be similar to the porcelain chip 1, and the outer peripheral end of the second portion 20b can be formed in a circular shape and formed into a sliding needle-like wall surface. Also, the diagonal length of the minimum size outlet of the first portion 20a is somewhat longer than the diameter of the through hole 16 of the lower holding plate 11.

The holding plate 11 and the guide plate 12 are arranged on the fixed support 21 so as to overlap with each other as shown in FIG.

The pressing device 13 comprises a plurality of rod-shaped pressing pins 23 projecting linearly from the support 22, and a pressing pin moving device 24. The pressing pin 23 is formed so as to be inserted into the guide hole 20 similarly to the pin 6 of FIG.
Is pressed against the end face 1a or 1b of the end face. The pressing pin moving device 24 includes an air cylinder or the like, and moves the pressing pin 23 downward when pressing the porcelain chip 1 against the holding plate 11.

The auxiliary device 14 is used to hold the porcelain chip 1
1, a rod-shaped body 26 having a suction port 25 at its tip, and a suction device 29 connected to the rod-shaped body 26 via a flexible pipe 27 and a solenoid valve 28.
, A support 30 for the rod 26, and a moving device 31 for vertically moving the rod 26 via the support 30.
And a spring 32. FIG. 12 and FIG.
3, the lower surface of the porcelain chip 1 can be pressed upward from below by inserting it into the through hole 16 of the holding plate 11, and the lower surface of the porcelain chip 1 is sucked by the suction port 25 at the tip. It is formed in a pin nozzle shape so that it can be used. The electromagnetic valve 28 is for selectively performing the suction of the porcelain chip 1 by the suction port 25 according to the control of the control device 15. The support 30 supporting the plurality of rods 26 has a plurality of through holes 33, and the rods 26 are inserted into the through holes 33. The rod 26 is vertically movable with respect to the support 30, but the first and second flanges 34, 35 provided on the rod 26 limit the range of independent movement. The spring 32 is relatively weak and elastically deforms to allow the rod 26 to move downward when the rod 26 is pressed by the pressing pin 23 via the chip 1. The moving device 31 includes an air cylinder, and is configured to move the support 30 up and down under the control of the control device 15.

When holding the porcelain chip 1 as an electronic component before the electrodes 2 and 3 of FIG. 1 are formed on the holding plate 11 by the chip-type electronic component holding device shown in FIG. The plate 12 and the plate 12 are arranged as shown in FIG.
The porcelain chip 1 is inserted into the guide hole 20 of the guide plate 12 using a vibration device (not shown) or the like. Since the guide hole 20 has the second portion 20b having a large entrance area, the porcelain chip 1 enters the guide hole 20 relatively easily. The guide hole 20 has a rectangular second portion 2 similar to the planar shape of the ceramic chip 1.
0b, and the second portion 20b is tapered, so that the porcelain chips 1 of the respective guide holes 20 are arranged so that the horizontal direction and the front-back direction are predetermined directions when viewed in plan. . However, some of the many porcelain chips 1 may be abnormally arranged as shown in FIG. Then, when the step of arranging the porcelain chips 1 with respect to the guide holes 20 is completed, the moving device 31 is driven under the control of the control device 15 to move the support 30 upward in FIG. Is inserted into the through hole 16 and the bottom of the ceramic chip 1 is pushed up by the tip of the rod 26 as shown in FIG. 12 to correct the orientation of the inclined ceramic chip 1. After the operation of pushing up the porcelain chip 1 by the rod 26 is completed, the electromagnetic valve 28 is opened and the porcelain chip 1 is sucked through the suction port 25 at the tip of the rod 26. Next, based on the control of the control device 15, the moving device 24 is driven to lower the pressing pin 23 to push down the porcelain chip 1 as shown in FIG. At this time,
The rod 26 is moved downward by another moving device 31. That is, the pressing pin 23 and the rod 26 are moved downward synchronously. At this time, the suction state by the rod 26 is maintained. Therefore, the porcelain chip 1 is pressed by the pressing pin 23 while being sucked downward. When the pressing by the pressing pin 23 is completed, the electromagnetic valve 28 is closed in synchronization with this, and the suction by the rod 26 is stopped.

The porcelain chip 1 is held by the holding plate 11 so as to slightly protrude from the holding plate 11 as shown in FIG. When the electrodes 2 and 3 are formed on the porcelain chip 1, FIG.
As in the case of (1), one end face 1a of the porcelain chip 1 is brought into contact with the paste-like electrode material 10 applied on the flat plate 9, the paste-like electrode material is adhered to a predetermined region of the porcelain chip 1, and then dried. . Next, the porcelain chip 1 is taken out of the holding plate 11, the direction is changed, and
1. The porcelain chip 1 is mounted on the porcelain chip 1 using the pressing pin 23 and the rod-like body 26, and the other end face 1b of the porcelain chip 1 is
From below, to paste the paste-like electrode material,
dry. Thereafter, the porcelain chip 1 is removed from the holding plate 11 and the electrode material is fired to complete the external electrodes 2 and 3.

As apparent from the above, the present embodiment has the following effects. (B) Since the porcelain chip 1 is pushed up by the rod 26,
An abnormal inclination of the porcelain chip 1 in the guide hole 20 of the porcelain chip 1 can be easily corrected, and damage to the porcelain chip 1 can be easily prevented. (B) A suction port 25 is provided at the tip of the rod-shaped body 26, and the porcelain chip 1 is sucked by the suction port 25 after the inclination of the porcelain chip 1 is corrected. The chip 1 can be pressed into the holding plate 11. Thereby, the pressure of the porcelain chip 1 can be smoothly advanced, and damage to the porcelain chip 1 can be prevented more favorably. (C) Since a large number of projections 17 are provided on the wall surface of the through hole 16 of the elastic body 11b, the through hole 16 of the elastic body 11b is provided.
The amount of elastic deformation in the vicinity increases. When the porcelain chip 1 is set to be held at or near the center of the elastic deformation range of the elastic body 11b, it is possible to largely absorb the dimensional variation of the porcelain chip 1 and the through-hole 16, and the holding plate 1
1 makes it difficult for the holding failure of the ceramic chip 1 to occur. (D) Although the through hole 16 is substantially circular,
Since the first portion 20a of the guide hole 20 is formed in a rectangular shape similar to the porcelain chip 1 and has a tapered inclined wall surface, and the first portions 20a of the plurality of guide holes 20 have the same planar direction. The orientations of a large number of porcelain chips 1 on the guide plate 12 and the holding plate 11 can be satisfactorily aligned. As a result, when the material of the paste-like electrode is attached to the porcelain chips 1, it is possible to prevent the dimensional variation of the portion E shown in FIG.

[0023]

[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) The elastic body 11b of the holding plate 11 as shown in FIG.
A number of cuts 17a are provided adjacent to the through-holes 16 and the elastic projections 17b are provided between the cuts 17a.
Are arranged, and the porcelain chip 1 is elastically deformed by the protrusion 17b.
Can be held. (2) The present invention can be applied to a case where chip-like electronic components such as a capacitor chip, a resistor chip, and an inductor chip other than the porcelain chip 1 are held by the holding plate 11. (3) The entire holding plate 11 can be made of an elastic body. (4) The planar shape of the electronic component to be press-fitted into the through hole 16 can be circular, rectangular, or the like. (5) The shape of the guide hole 20 can be made the same as that of FIG. (6) The shape of the through hole 16 of the holding plate 11
Can be squared in accordance with the planar shape of. (7) When the variation in the size of the chip 1 and the through hole 16 is small, the protrusion 17 or the protrusion 1 along the through hole 16
7b can be omitted. (8) A portion of the porcelain chip 1 protruding from the holding plate 11 can be brought into contact with a liquid conductor (eg, solder) to form a conductor layer. (9) A large number of porcelain chips 1 or similar electronic components can be held by the holding plate 11 and their electrical characteristics can be measured. This makes it possible to quickly measure the electrical characteristics. (10) It is also possible to correct the inclination of the chip 1 in the guide hole 20 by selectively discharging compressed air from the hole 25 at the tip of the rod 26 composed of a nozzle. (11) As shown in FIG. 16, the thickness of the holding plate 11 can be made larger than the length of the porcelain chip 1. (12) The holding plate 11 and the guide plate 12 can be formed integrally.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multilayer capacitor as an electronic component.

FIG. 2 is a cross-sectional view showing a conventional electronic component holding device and a holding state by the device.

FIG. 3 is a cross-sectional view showing a state in which a pasty electrode material is adhered to a porcelain chip using a conventional electronic component holding device.

FIG. 4 is a plan view showing the holding plate of FIG. 2 in a state where chips are normally held.

FIG. 5 is a plan view showing the guide plate of FIG. 2;

FIG. 6 is a plan view showing the holding plate of FIG. 2 in an inappropriate holding state of a chip.

FIG. 7 is a partially cutaway front view showing the electronic component holding device according to the embodiment of the present invention.

FIG. 8 is a plan view showing the holding plate of FIG. 7;

FIG. 9 is a plan view showing the guide plate of FIG. 7;

FIG. 10 is an enlarged plan view showing a part of the holding plate of FIG. 8 in a chip holding state.

11 is a cross-sectional view showing a state where chips are supplied to the combined body of the holding plate and the guide plate of FIG. 7;

FIG. 12 is a cross-sectional view for explaining an operation of correcting a tilt of a chip disposed in a guide hole by a rod-shaped body.

FIG. 13 is a cross-sectional view for explaining press-fitting of a chip into the holding plate of FIG. 7;

FIG. 14 is a cross-sectional view for explaining a step of attaching a paste-like electrode material to a chip held by a holding plate.

FIG. 15 is an enlarged plan view of a holding plate according to a modified example.

FIG. 16 is a sectional view showing an electronic component holding device having a deformed holding plate and a paste-like electrode material supply unit.

[Explanation of symbols]

 Reference Signs List 11 holding plate 11b elastic body 12 guide plate 16 through hole 20 guide hole 23 pressing pin 25 suction port 26 rod-shaped body

Claims (7)

[Claims] An electronic component guide having a through-hole for holding a chip-type electronic component, wherein at least a periphery of the through-hole is formed of an elastically deformable material, and an electronic component guide larger than the through-hole. A guide portion having a hole and being adjacent to the holding portion such that the guide hole is concentric with the through hole; and pressing the electronic component disposed in the guide hole to form the through hole. And pressing the electronic component from a direction opposite to a direction in which the electronic component is pressed by the pressing member before inserting the electronic component disposed in the guide hole into the through hole. A chip-type electronic component holding device, comprising: a rod-shaped body formed so as to be inserted into the through hole. And a suction device for selectively sucking the electronic component by the suction port of the rod-shaped body. The chip-type electronic component holding device according to claim 1, further comprising: 3. A holding portion having a through hole for holding a chip-type electronic component, wherein at least a periphery of the through hole is formed of an elastically deformable material, and an electronic component guide larger than the through hole. A guide portion having a hole and being adjacent to the holding portion such that the guide hole is concentric with the through hole; and pressing the electronic component disposed in the guide hole to form the through hole. And a rod-shaped member inserted into the through-hole from the side opposite to the insertion side of the electronic component of the through-hole and pressing the electronic component in the guide hole. Inserting the electronic component into the guide hole of the guide portion; inserting the rod into the through-hole; pressing the electronic component with the tip of the rod to change the directionality of the electronic component. Correcting, by the pressing member And pressing the electronic component to insert the electronic component in the guide hole into the through hole of the holding portion. 4. The bar-shaped body has a suction port at a tip end surface in contact with the electronic component, and further includes a suction device for selectively sucking the electronic component by the suction port of the rod-shaped body. At least a portion from a point in time when the electronic component is pressed with the tip of the rod to a point in time when the insertion of the electronic component into the through hole is completed, by the suction port at the tip of the rod. The method according to claim 3, wherein the component is sucked. 5. A chip-type electronic component holding device having a through-hole for holding a chip-type electronic component, and having a holding plate formed at least around the through-hole with a material that can be elastically deformed. A chip-type electronic component holding device, wherein a large number of irregularities or a large number of cuts are provided on a wall surface of the through hole of the holding plate. 6. A holding plate having a substantially circular through-hole having a planar shape for holding a prismatic chip-type electronic component, wherein at least a periphery of the through-hole is formed of an elastically deformable material; A guide plate having an electronic component guide hole larger than the hole and being superimposed on the holding plate such that the guide hole is concentric with the through hole; and the electronic component disposed in the guide hole A chip-type electronic component holding device comprising: a pressing member for pressing and inserting the same into the through hole. A chip-type electronic component holding device, wherein a region is formed in a quadrangle when viewed in plan. 7. The chip-type electronic component holding device according to claim 6, wherein the quadrangular portion of the guide hole as viewed in plan is tapered toward the holding plate.